JPS52151560A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS52151560A
JPS52151560A JP6900876A JP6900876A JPS52151560A JP S52151560 A JPS52151560 A JP S52151560A JP 6900876 A JP6900876 A JP 6900876A JP 6900876 A JP6900876 A JP 6900876A JP S52151560 A JPS52151560 A JP S52151560A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
removal
deposition
prevention
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6900876A
Other languages
Japanese (ja)
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP6900876A priority Critical patent/JPS52151560A/en
Publication of JPS52151560A publication Critical patent/JPS52151560A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: Easy removal of a protecting film without using any special solvent, reduction in costs required for the removal and prevention of deposition of silicone dust on electrodes are made possible.
COPYRIGHT: (C)1977,JPO&Japio
JP6900876A 1976-06-11 1976-06-11 Production of semiconductor device Pending JPS52151560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6900876A JPS52151560A (en) 1976-06-11 1976-06-11 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6900876A JPS52151560A (en) 1976-06-11 1976-06-11 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS52151560A true JPS52151560A (en) 1977-12-16

Family

ID=13390128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6900876A Pending JPS52151560A (en) 1976-06-11 1976-06-11 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS52151560A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0681774U (en) * 1993-04-28 1994-11-22 荘八 松下 Magnet bar
JP2002088297A (en) * 2000-09-11 2002-03-27 Showa Denko Kk Surface protective material
US6805808B2 (en) 2000-09-14 2004-10-19 Sumitomo Electric Industries, Ltd. Method for separating chips from diamond wafer
JP2006339702A (en) * 2005-05-31 2006-12-14 Kyocera Kinseki Corp Manufacturing method of piezoelectric device
JP5454780B2 (en) * 2008-02-15 2014-03-26 日産化学工業株式会社 Coating composition for semiconductor element protective film
JP2014523109A (en) * 2011-06-15 2014-09-08 アプライド マテリアルズ インコーポレイテッド Multilayer mask for laser substrate dicing and plasma etching

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0681774U (en) * 1993-04-28 1994-11-22 荘八 松下 Magnet bar
JP2002088297A (en) * 2000-09-11 2002-03-27 Showa Denko Kk Surface protective material
US6805808B2 (en) 2000-09-14 2004-10-19 Sumitomo Electric Industries, Ltd. Method for separating chips from diamond wafer
JP2006339702A (en) * 2005-05-31 2006-12-14 Kyocera Kinseki Corp Manufacturing method of piezoelectric device
JP5454780B2 (en) * 2008-02-15 2014-03-26 日産化学工業株式会社 Coating composition for semiconductor element protective film
JP2014523109A (en) * 2011-06-15 2014-09-08 アプライド マテリアルズ インコーポレイテッド Multilayer mask for laser substrate dicing and plasma etching
JP2015097278A (en) * 2011-06-15 2015-05-21 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Multilayer mask for substrate dicing and plasma etching using laser

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