JP2006339702A - Manufacturing method of piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem of a conventional piezoelectric device manufacturing method in which characteristics of individual piezoelectric devices can not be measured until a multiple package substrate is slit and formed into the individual piezoelectric devices because it is required to interconnect external connection terminal electrodes by lead wires for forming a plated layer to the external connection terminal electrodes formed on the other principal side of each package region of the multiple package substrate. <P>SOLUTION: The manufacturing method of the piezoelectric devices disclosed herein includes the steps of: preparing a package master substrate demarcated into package regions and formed with recessed parts; mounting piezoelectric resonator elements to the recessed parts respectively and fitting lids onto sealing members in the package regions; forming the plated layer onto the external connection terminal electrodes electrically interconnected by the lead wires formed on the package master substrate, coating or adhering a coating material to the package master substrate and cutting off the lead wires; and slitting the package master substrate after removal of the coating material to obtain the piezoelectric devices. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a piezoelectric device such as a piezoelectric vibrator or a piezoelectric oscillator used in an electronic device such as a portable communication device.

  A conventional piezoelectric device will be described by taking a crystal resonator which is one of piezoelectric devices as an example. A seal ring is attached as a sealing member on a container body region made of a ceramic material or the like, and a crystal vibration element as a piezoelectric element is held only on one end side of the bottom surface of a recess located inside the seal ring. Further, there is known a crystal resonator having a structure in which a crystal resonator element in a recess is hermetically sealed by mounting and fixing a metal lid on the seal ring.

  Also, an assembly container body substrate (agrees with the container master substrate referred to in the present invention) forming a plurality of container body regions having a metallized layer around the opening of the recess in a matrix, and one main surface of the metal plate Forming a brazing material layer having a shape corresponding to the metallized layer, and then forming a lid with a brazing material layer from the metal plate, and forming an electron in the concave portion of the assembly container body substrate. A mounting step of mounting components, and a sealing step of sealing the electronic component mounted in the recess by welding the lid body with the brazing material layer to the metallized layer of each container body region of the collective container body substrate; There is known a method for manufacturing a piezoelectric device including a dividing step of cutting each container body region to which a lid is welded at a predetermined cutting position and dividing the container body region from a collecting container body substrate.

  Regarding the above-described piezoelectric device and its manufacturing method, the following technical documents have already been disclosed.

JP 2002-111435 A (page 5-6, FIG. 2) Japanese Patent Laid-Open No. 2004-18695

  In addition, the applicant has not been able to find prior art documents related to the present invention by the time of the filing of the application other than the technical documents specified by the prior art document information described above.

  However, in the above-described conventional method for manufacturing a piezoelectric device, the container body is manufactured in advance as individual container bodies, and the piezoelectric vibration elements are individually mounted on the individual container bodies obtained after singulation. In this case, it is necessary to mount the piezoelectric vibration element on each container body after the individual container body is mounted and held on a carrier. However, the manufacturing equipment is increased, and the manufacturing process is complicated and the manufacturing time is increased.

  In the conventional method for manufacturing a piezoelectric device using a collective container substrate that solves the above problems to some extent, a plating layer is formed on the external connection terminal electrode formed on the other main surface of each container region of the collective container substrate. To connect each external connection terminal electrode with conductive wiring, the characteristics of each piezoelectric device must be maintained until the assembly container substrate is cut and formed into individual piezoelectric devices. There was a drawback that it was not possible to measure and judge the quality.

  Temporarily, in order to measure various characteristics as individual piezoelectric devices in the collective container body substrate state, by cutting the conductive wiring that conducts the external connection terminal electrode with a dicer or laser light, the collective container body substrate state However, since the conductive wire cutting waste generated by cutting the conductive wire scatters around and adheres to the terminal electrode for external connection, the frequency characteristics of the piezoelectric device vary. There was a drawback. In addition, there is a drawback in that when the scattered conductive metal scraps adhere to between the external connection terminal electrodes or to the wiring, a short circuit state is caused.

  The present invention has been devised in view of the above-described drawbacks, and its purpose is to measure various characteristics as individual piezoelectric devices in the state of a collective container body substrate, and to connect external connection terminal electrodes to each other. Prevents conductive wire cutting waste generated by cutting the connected wiring with a dicer or laser light from adhering to the external connection electrode terminals and the wiring on the substrate, and is stable without any short circuit or other problems. An object of the present invention is to provide a manufacturing method capable of obtaining a piezoelectric device that outputs a frequency.

The method for manufacturing a piezoelectric device of the present invention is a step of preparing a container body master substrate that is partitioned into a plurality of container body regions and in which a recess having an opening is formed on one main surface of the container body region. When,
The piezoelectric vibration element is mounted on each container body region so as to be disposed on the bottom surface of the recess, and the sealing member formed so as to surround each of the openings in the container body region. Attaching the lid to the
On the other main surface of the container master substrate in which a plating layer is formed on a plurality of terminal electrodes for external connection that are electrically connected to each other by a conductive wiring previously formed on the other main surface of the container body master substrate. Applying or pasting a coating material, and mechanically cutting the conductive wiring between the external connection terminal electrodes; and
After removing the coating material, the container body master substrate is cut along the outer periphery of each container body region, and a plurality of piezoelectric devices are obtained simultaneously by separating the individual container body regions from each other;
A method for manufacturing a piezoelectric device comprising:

  The above-described piezoelectric device manufacturing method is characterized in that the coating material is water-soluble, and in this coating material removing step, conductive wire cutting waste is removed together with the coating material.

  According to the method for manufacturing a piezoelectric device of the present invention, a piezoelectric vibration element is mounted and accommodated in each container body region of a container master substrate, sealed with a lid, and then electrically isolated by cutting the conductive wiring. After applying the probe to the external connection terminal electrode and measuring the characteristics as a piezoelectric device, the container master substrate was divided to obtain individual piezoelectric devices. It becomes possible to function as a carrier when the element is mounted.

  Accordingly, a manufacturing facility such as a carrier used for fixing the singulated container body becomes unnecessary, and a plurality of individual container bodies obtained by dividing the container body master substrate are arranged on the carrier. A complicated process is also unnecessary, and this makes it possible to improve the productivity of the piezoelectric device.

  Further, according to the method for manufacturing a piezoelectric device of the present invention, a coating material is applied to the other main surface of the container body master substrate before cutting the conductive wiring that is electrically connected to the external connection terminal electrode. By cutting the wires connecting the terminal electrodes, it is possible to prevent the conductive wire cutting waste generated by cutting the wires from scattering and adhering to the external connection terminal electrodes and wires.

  Furthermore, according to the method for manufacturing a piezoelectric device of the present invention, in this coating material removal step, the conductive wire cutting waste adhering to the coating material is dropped at the same time, so that it adheres to the external connection terminal electrode and wiring and causes a short circuit. In addition, the frequency characteristics of the piezoelectric device in each container region can be stably measured in the state of the container master substrate, and productivity can be improved.

  FIG. 1 is an external perspective view illustrating an embodiment of a piezoelectric device manufactured by the method for manufacturing a piezoelectric device according to the present invention, taking a quartz resonator as an example of the piezoelectric device as an example, and FIG. FIG. 4 is a schematic process diagram illustrating the method of manufacturing a piezoelectric device of FIG. 1 by taking a crystal resonator as one of piezoelectric devices as an example. In each of the drawings, a part of the structure is not shown, and some dimensions are exaggerated for the sake of clarity. A crystal resonator 10 shown in FIG. 1 includes a crystal resonator element 14 mounted on an element connection electrode pad 13 formed on the bottom surface of a recess 12 opened on one main surface of a rectangular container body 11. 14 has a structure in which a lid 15 is attached so as to cover the opening of the recess 12 so as to hermetically seal 14.

  In each figure of FIG. 2, while being divided into the several container body area | region A and the recessed part 12 which has the opening part in one main surface of this container body area | region A is formed, the container body master board | substrate 21 is, for example, It is formed so as to form a substantially flat plate shape by a ceramic material such as glass-ceramic, and a crystal resonator element 14 is disposed on the bottom surface of each recess 12, and the other main surface of the container body master substrate 21 is disposed on the other main surface. For each container body region A, external connection terminal electrodes 22 such as a ground terminal, a power supply voltage terminal, and an oscillation output terminal are provided. These external connection terminal electrodes 22 are electrically connected to the circuit wiring of the external electric network when the crystal resonator is mounted on an external electric network such as a mother board.

  The sealing member 23 is formed by depositing gold tin (Au—Sn) or the like on the container body bonding surface of the lid body 15 or the top surface of the side wall portion of the container body 11 on which the lid body 15 is disposed. The container body 11 is hermetically sealed by bonding through the sealing member 23. A pair of element connection electrode pads 13 connected to the excitation electrodes of the crystal resonator element 14 are provided at predetermined positions on the bottom surface of the recess 12 formed in each container body region A of the container body master substrate 21. It is mounted at a predetermined position by electrically and mechanically connecting the container connection electrode formed on the crystal resonator element 14 and the element connection electrode pad 13 via a conductive adhesive such as solder. .

  The crystal resonator element 14 disposed in each recess 12 is formed by attaching and forming a pair of excitation electrodes on both main surfaces of a crystal piece cut from an artificial crystal at an angle from a desired crystal axis. When a fluctuation voltage from the outside is applied to the crystal piece through the pair of excitation electrodes, vibration is generated at a predetermined frequency in accordance with the cut angle.

Next, the steps of the above-described crystal resonator manufacturing method will be described with reference to each drawing of FIG.
In FIG. 2A, a container body master substrate 21 is prepared in which a container body region A having a recess 12 and a discard region B are adjacent to each other and arranged in a matrix. The container master substrate 21 is made of, for example, a ceramic material such as glass-ceramic. When the container master substrate 21 is made of glass-ceramic, the ceramic material powder made of alumina ceramic or the like is mixed with glass powder, organic solvent. A ceramic green sheet laminate is formed by laminating a plurality of ceramic green sheets obtained by adding and mixing an organic binder or the like and press-molding them, and is fired at a high temperature. In addition, the recessed part 12 is formed by forming a space area | region in the predetermined position of the ceramic green sheet distribute | arranged to the upper part of the said laminated body, specifically, the center area | region of each container body area | region A. FIG. A device connecting electrode in which a container connecting electrode film in which a crystal resonator element 14 is formed in front of each concave portion 12 of the container body region A of the container master substrate 21 is formed on the bottom surface in the concave portion 12. An element provided in one main surface (upper surface) of the container body region A with the vibration electrode provided at one end of the crystal resonator element 14 inserted into each container body region A so as to be disposed on the pad 13 It is mounted on each container body region A of the container body master substrate 21 by being electrically and mechanically connected to the connection electrode pad 13 via a conductive bonding material.

  Next, as shown in FIG. 2B, a sealing member 4 such as gold tin (Au—Sn) is deposited so as to surround each container body region A of the container master substrate 21 or the lid 15. Then, after that, the lid body 15 and each container body region A of the container body master substrate 21 are attached. The lid body 2 is manufactured by molding a metal such as 42 alloy into a predetermined shape by a conventionally known metal processing method. In the steps so far, the container master substrate 21 is used as a carrier for the crystal resonator element 14 when the crystal resonator element 14 is mounted, and is used for attaching the lid body 15 when the lid body 15 is mounted on the sealing member 23. It comes to function as a carrier. Therefore, unlike the conventional example, a manufacturing facility such as a carrier used for fixing the individually divided container bodies is unnecessary, and the individual container bodies obtained by dividing the container body master substrate 23 are used as carriers. A complicated process such as attaching to the camera becomes unnecessary. This makes it possible to improve the productivity of piezoelectric devices.

  Next, in FIG. 2 (c) (FIG. 2 (c) shows the reverse of the one shown in FIG. 2 (b)) to (d), the coating material 24 is formed on the back surface of the container master substrate 21. Apply or paste. In this embodiment, the coating material 24 is a fluid mixed with a low-temperature coagulant, and the coating material is cured after application. In another embodiment, a sheet-like coating material may be attached to the back surface of the container master substrate 21. The coating material 24 can be removed from the back surface of the container master substrate 21 in a cleaning process set later.

  In FIG. 2 (e), the conductive wiring 25 connected to the adjacent external connection terminal electrodes 22 formed on the back surface of the container body master substrate 21 is cut. External connection terminal electrodes 22 such as a ground terminal, a power supply voltage terminal, an oscillation output terminal, and the like are provided on the back surface of each container body region A of the container body master substrate 21. The external connection terminal electrodes 22 are plated. For this reason, the external connection terminal electrodes 22 between the container body regions A are electrically connected by the conductive wiring 25. In addition, this plating process is performed in advance when the container body master substrate 21 is in a single body state, and then the container body master substrate 21 subjected to the plating process is incorporated in the manufacturing method process of the present invention. Further, as a means for cutting the conductive wiring 25, cutting by a laser or a dicer is used.

  As the laser, a YAG laser or an excimer laser capable of pulse oscillation is generally used, but this laser is intermittently irradiated to a part of the conductive wire 25 to be cut to eliminate the constituent members of the conductive wire 25 and externally connect. The terminal electrodes 22 for use are mechanically disconnected. As a dicer, there are a disk-shaped electroformed blade in which diamond abrasive grains and the like are fixed by electroforming, and a resin blade using an insulating resin such as an epoxy resin as a binder. The conductive wire 25 is cut together with the coating material 24 by the means described above. FIG. 2 (e) shows an embodiment in which a dicer is used as a cutting means. FIG. 3 is an enlarged view of FIG. 2 (e) in order to clarify the form of cutting in FIG. 2 (e).

  In FIG. 2F, the coating material 24 is removed, and the externally connected terminal electrodes 22 that are electrically independent on the back surface of the container master substrate 21 and the individual container body regions A are exposed. The coating material 24 is removed in the cleaning step together with the conductive wire cutting waste generated by the conductive wire cutting in the previous step, thereby cutting the conductive wire into the external connection terminal electrode 22 or the wiring formed on the back surface of the container body region A. It is possible to prevent a variation in frequency characteristics caused by the adhering of dust or a short circuit caused by adhering between the wiring and the external connection terminal electrode 22.

  In FIG. 2 (g), after performing the pass / fail determination by measuring the frequency characteristics from the external connection terminal electrode 22 for each container body region, the container body master substrate 21 is cut along the outer periphery of each container body region A. Thus, individual container body regions A are separated from the disposal region B, and a plurality of piezoelectric devices are formed simultaneously. The container master substrate 21 is cut and divided by conventionally known dicing or the like, whereby the master substrate 7 is divided into the crystal resonators 10 having a plurality of container bodies 11 corresponding to the individual substrate regions A. .

  In addition, this invention is not limited to the above-mentioned embodiment, A various change and improvement are possible in the range which does not deviate from the summary of this invention. For example, in the above embodiment, a piezoelectric device (quartz crystal unit) using quartz as a piezoelectric material is disclosed. However, in a method for manufacturing a piezoelectric device using lithium niobate, lithium tantalate, or piezoelectric ceramics as a piezoelectric material. The present invention is effective. In the above-described embodiment, a crystal resonator is illustrated and described as an example of a piezoelectric device. However, an integrated circuit element in which at least an oscillation circuit is formed together with a piezoelectric vibration element (crystal vibration element) on the container body 11. Etc. may be a piezoelectric oscillator equipped with the above. The present invention can also be applied to the case where another piezoelectric element such as a surface acoustic wave (SAW) filter is used as the piezoelectric vibration element. Further, when the conductive wiring 25 is cut with a laser, it is possible to improve productivity by performing a marking process using the laser after the cutting process.

FIG. 1 is an external exploded perspective view illustrating a piezoelectric device formed by the manufacturing method disclosed in the present invention as an example of a crystal resonator which is one form of the piezoelectric device. FIGS. 2A to 2G are schematic process diagrams illustrating an example of an external perspective view of a crystal resonator which is an embodiment of the piezoelectric device, as an embodiment of the method for manufacturing a piezoelectric device of the present invention. FIG. 3 is a perspective view of an external appearance on the process shown in an enlarged view of FIG.

Explanation of symbols

10 ... Quartz crystal resonator (piezoelectric device)
DESCRIPTION OF SYMBOLS 11 ... Container body 12 ... Concave 13 ... Electrode pad for element connection 14 ... Quartz crystal vibration element (piezoelectric vibration element)
DESCRIPTION OF SYMBOLS 15 ... Lid body 21 ... Container body master substrate 22 ... External connection terminal electrode 23 ... Sealing member 24 ... Coating material 25 ... Conductive wiring A ... Container body area | region B ... Disposal area

Claims (2)

A step of preparing a container master substrate that is partitioned into a plurality of container body regions and in which a recess having an opening is formed on one main surface of the container body region;
The piezoelectric vibration element is mounted on each container body region so as to be disposed on the bottom surface of the recess, and the sealing member formed so as to surround each of the openings in the container body region. Attaching the lid to the
The other main surface of the container master substrate, in which a plating layer is formed on the plurality of terminal electrodes for external connection that are electrically connected to each other by a conductive wiring previously formed on the other main surface of the container body master substrate. Applying or pasting a coating material to the surface, and mechanically cutting the conductive wiring that conducts between the external connection terminal electrodes; and
After removing the coating material, the container body master substrate is cut along the outer periphery of each container body region, and a plurality of piezoelectric devices are obtained simultaneously by separating the individual container body regions from each other;
A method for manufacturing a piezoelectric device comprising:   2. The method of manufacturing a piezoelectric device according to claim 1, wherein the coating material is water-soluble, and conductive wire cutting waste is removed together with the coating material in the coating material removing step.

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