IE40174B1 - Ceramic capacitors and circuit boards - Google Patents

Ceramic capacitors and circuit boards

Info

Publication number
IE40174B1
IE40174B1 IE1929/74A IE192974A IE40174B1 IE 40174 B1 IE40174 B1 IE 40174B1 IE 1929/74 A IE1929/74 A IE 1929/74A IE 192974 A IE192974 A IE 192974A IE 40174 B1 IE40174 B1 IE 40174B1
Authority
IE
Ireland
Prior art keywords
layers
ceramic
stacked
spaces
volatile
Prior art date
Application number
IE1929/74A
Other languages
English (en)
Other versions
IE40174L (en
Original Assignee
Nl Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nl Industries Inc filed Critical Nl Industries Inc
Publication of IE40174L publication Critical patent/IE40174L/xx
Publication of IE40174B1 publication Critical patent/IE40174B1/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • H01G4/302Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0272Adaptations for fluid transport, e.g. channels, holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/128Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
IE1929/74A 1973-09-24 1974-09-17 Ceramic capacitors and circuit boards IE40174B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40024273A 1973-09-24 1973-09-24

Publications (2)

Publication Number Publication Date
IE40174L IE40174L (en) 1975-03-24
IE40174B1 true IE40174B1 (en) 1979-03-28

Family

ID=23582798

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1929/74A IE40174B1 (en) 1973-09-24 1974-09-17 Ceramic capacitors and circuit boards

Country Status (18)

Country Link
JP (1) JPS6258124B2 (es)
AR (1) AR216889A1 (es)
AU (1) AU500529B2 (es)
BE (1) BE820287A (es)
BR (1) BR7407820D0 (es)
CH (1) CH586994A5 (es)
DE (4) DE2461995C3 (es)
ES (3) ES430301A1 (es)
FR (1) FR2245063B1 (es)
GB (1) GB1486308A (es)
IE (1) IE40174B1 (es)
IL (1) IL45512A (es)
IN (1) IN143579B (es)
IT (1) IT1022218B (es)
NL (1) NL162504C (es)
NO (1) NO743408L (es)
SE (4) SE7411924L (es)
ZA (1) ZA745838B (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53210A (en) * 1976-06-23 1978-01-05 Mitsubishi Electric Corp Ceramic multiilayer structures and manufacture
JPS6057212B2 (ja) * 1976-07-29 1985-12-13 タム セラミツクス インコ−ポレイテツド 単一焼結セラミック体およびその製造方法
US4289719A (en) * 1976-12-10 1981-09-15 International Business Machines Corporation Method of making a multi-layer ceramic substrate
IT1096888B (it) * 1977-07-01 1985-08-26 Lucas Industries Ltd Dispositivo indicatore di stato di carica di batteria
DE3015356A1 (de) * 1980-04-22 1981-10-29 Robert Bosch Gmbh, 7000 Stuttgart Freitragende schichten sowie verfahren zur herstellung freitragender schichten, insbesondere fuer sensoren fuer brennkraftmaschinen
GB2103422B (en) * 1981-07-30 1985-02-27 Standard Telephones Cables Ltd Ceramic capacitors
US4771520A (en) * 1985-04-25 1988-09-20 Murata Manufacturing Co., Ltd. Method of producing laminated ceramic capacitors
DE4121390C2 (de) * 1991-06-28 1994-10-20 Bosch Gmbh Robert Verfahren zum Herstellen einer freitragenden Dickschichtstruktur
JP3980801B2 (ja) * 1999-09-16 2007-09-26 株式会社東芝 三次元構造体およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2939059A (en) * 1955-03-21 1960-05-31 Clevite Corp Capacitor of high permittivity ceramic
DE1141719B (de) * 1955-03-21 1962-12-27 Clevite Corp Keramischer Kondensator und Verfahren zu seiner Herstellung
NL294447A (es) * 1964-06-22

Also Published As

Publication number Publication date
AU7337574A (en) 1976-03-25
NL162504B (nl) 1979-12-17
NL162504C (nl) 1980-05-16
NL7412599A (nl) 1975-03-26
SE7800027L (sv) 1978-01-02
ES449378A1 (es) 1977-08-01
IE40174L (en) 1975-03-24
DE2461995A1 (de) 1975-11-20
DE2461995C3 (de) 1979-09-13
SE7800028L (sv) 1978-01-02
DE2461997C2 (de) 1985-12-05
IL45512A (en) 1977-05-31
AR216889A1 (es) 1980-02-15
ES430301A1 (es) 1977-02-16
AU500529B2 (en) 1979-05-24
GB1486308A (en) 1977-09-21
BR7407820D0 (pt) 1975-07-15
NO743408L (es) 1975-04-21
FR2245063A1 (es) 1975-04-18
DE2461996A1 (de) 1975-11-20
DE2461997A1 (de) 1975-11-20
CH586994A5 (es) 1977-04-15
ZA745838B (en) 1975-11-26
FR2245063B1 (es) 1980-04-11
DE2461995B2 (de) 1979-01-11
JPS5060507A (es) 1975-05-24
BE820287A (fr) 1975-01-16
SE7800026L (sv) 1978-01-02
JPS6258124B2 (es) 1987-12-04
DE2445086A1 (de) 1975-05-28
IT1022218B (it) 1978-03-20
IL45512A0 (en) 1974-11-29
SE7411924L (es) 1975-03-25
DE2445086C2 (de) 1985-11-21
IN143579B (es) 1977-12-31
ES449379A1 (es) 1977-08-01

Similar Documents

Publication Publication Date Title
US3235939A (en) Process for manufacturing multilayer ceramic capacitors
GB1373575A (en) Method of forming electrodes and conductors and articles made thereby
JPS6486510A (en) Laminated ceramic capacitor and manufacture thereof
US4586972A (en) Method for making multilayer ceramic body
US4008514A (en) Method of making ceramic capacitor
IE40174B1 (en) Ceramic capacitors and circuit boards
US4470098A (en) Multilayer ceramic dielectric capacitors
ES8305152A1 (es) "mejoras en los condensadores ceramicos".
US5040093A (en) Capacitor and method of manufacturing same
US4435738A (en) Multilayer ceramic capacitors
JP2000269074A (ja) 積層セラミックコンデンサとその製造方法
JPS59222917A (ja) 積層セラミツクコンデンサの製造方法
USRE26421E (en) Process for manufacturing multilayer ceramic capacitors
JPS6115315A (ja) 積層セラミツクコンデンサの製造方法
JPH07142285A (ja) 積層セラミックコンデンサとその製造方法
JPH10223470A (ja) 積層セラミックコンデンサ
US4509103A (en) Low dissipation factor monolithic capacitor for high frequency applications
JP3148387B2 (ja) 積層セラミックコンデンサの製造方法
JPH0456118A (ja) 積層セラミックコンデンサおよびその製造方法
JPH07120600B2 (ja) 積層コンデンサの製造方法
JP3538758B2 (ja) コンデンサアレイおよびその製造方法
JPH0752698B2 (ja) 積層セラミックコンデンサの製造方法
JPS63258001A (ja) 抵抗素子
JPS61117818A (ja) 積層セラミツクコンデンサ
KR960004956Y1 (ko) 디라미네이션(Delamination)이 없는 적층세라믹 콘덴서