ID27853A - Komponen elektronik dan peralatan elektronik dimana komponen elektronik terpasang dan metode pembuatannya - Google Patents

Komponen elektronik dan peralatan elektronik dimana komponen elektronik terpasang dan metode pembuatannya

Info

Publication number
ID27853A
ID27853A IDW20010324A ID20010324A ID27853A ID 27853 A ID27853 A ID 27853A ID W20010324 A IDW20010324 A ID W20010324A ID 20010324 A ID20010324 A ID 20010324A ID 27853 A ID27853 A ID 27853A
Authority
ID
Indonesia
Prior art keywords
electronic components
electronic
making
equipments
components installed
Prior art date
Application number
IDW20010324A
Other languages
English (en)
Inventor
Tsuneshi Nakamura
Akio Yoshida
Noriki Ushio
Takashi Kuribayashi
Toshihiro Yamazoe
Yoshiaki Kakinoki
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of ID27853A publication Critical patent/ID27853A/id

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F2027/297—Terminals; Tapping arrangements for signal inductances with pin-like terminal to be inserted in hole of printed path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IDW20010324A 1999-06-09 2000-06-07 Komponen elektronik dan peralatan elektronik dimana komponen elektronik terpasang dan metode pembuatannya ID27853A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11161904A JP2000349217A (ja) 1999-06-09 1999-06-09 電子部品、この電子部品を実装した電子機器およびその製造方法

Publications (1)

Publication Number Publication Date
ID27853A true ID27853A (id) 2001-04-26

Family

ID=15744240

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW20010324A ID27853A (id) 1999-06-09 2000-06-07 Komponen elektronik dan peralatan elektronik dimana komponen elektronik terpasang dan metode pembuatannya

Country Status (7)

Country Link
EP (1) EP1103995A4 (id)
JP (1) JP2000349217A (id)
KR (1) KR100404563B1 (id)
CN (1) CN1259678C (id)
ID (1) ID27853A (id)
TW (1) TW541549B (id)
WO (1) WO2000075940A1 (id)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6603678B2 (en) 2001-01-11 2003-08-05 Hewlett-Packard Development Company, L.P. Thermally-assisted switching of magnetic memory elements
US7397074B2 (en) 2005-01-12 2008-07-08 Samsung Electronics Co., Ltd. RF field heated diodes for providing thermally assisted switching to magnetic memory elements
US20130168146A1 (en) * 2011-12-28 2013-07-04 Jin-San Kim Metal terminal block adapted for surface mounting and method of mounting the same
CN103366923A (zh) * 2012-04-01 2013-10-23 厦门天迈节能照明有限公司 定位短直脚磁环插件
US9642276B2 (en) * 2014-12-01 2017-05-02 Tesla, Inc. Welding and soldering of transistor leads
CN104540334A (zh) * 2014-12-20 2015-04-22 东莞立德精密工业有限公司 插件电容的smt制程组装方法
CN116190069A (zh) * 2023-01-13 2023-05-30 华为数字能源技术有限公司 磁器件及其制造方法及电子设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB721881A (en) * 1950-09-29 1955-01-12 Gunther Laubmeyer Improvements in methods of soldering and solder therefor
JPS61196564A (ja) * 1985-02-25 1986-08-30 シーメンス、アクチエンゲゼルシヤフト フイルムキヤリヤ集積回路とその製造方法
JPH0745666A (ja) * 1993-08-03 1995-02-14 Fujitsu Ltd 電子部品の実装方法
EP0779772B1 (en) * 1994-09-27 2003-06-04 Seiko Epson Corporation Printed wiring board, method of producing the same and electronic devices
DE19512838C2 (de) * 1995-04-06 2000-09-14 Hella Kg Hueck & Co Elektrisches oder elektronisches Gerät
JPH10214706A (ja) * 1997-01-29 1998-08-11 Mitsubishi Materials Corp チップ型サーミスタ
JPH10286688A (ja) * 1997-04-15 1998-10-27 Murata Mfg Co Ltd 半田付け物品

Also Published As

Publication number Publication date
WO2000075940A1 (fr) 2000-12-14
EP1103995A1 (en) 2001-05-30
TW541549B (en) 2003-07-11
CN1313993A (zh) 2001-09-19
KR20010072384A (ko) 2001-07-31
KR100404563B1 (ko) 2003-11-05
JP2000349217A (ja) 2000-12-15
CN1259678C (zh) 2006-06-14
EP1103995A4 (en) 2004-08-11

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