HUE065755T2 - Gömb alakú szilícium-dioxid por - Google Patents

Gömb alakú szilícium-dioxid por

Info

Publication number
HUE065755T2
HUE065755T2 HUE20777818A HUE20777818A HUE065755T2 HU E065755 T2 HUE065755 T2 HU E065755T2 HU E20777818 A HUE20777818 A HU E20777818A HU E20777818 A HUE20777818 A HU E20777818A HU E065755 T2 HUE065755 T2 HU E065755T2
Authority
HU
Hungary
Prior art keywords
silica powder
spherical silica
spherical
powder
silica
Prior art date
Application number
HUE20777818A
Other languages
English (en)
Inventor
Takuto Okabe
Motoharu Fukazawa
Original Assignee
Denka Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=72611761&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HUE065755(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Denka Company Ltd filed Critical Denka Company Ltd
Publication of HUE065755T2 publication Critical patent/HUE065755T2/hu

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B1/00—Packaging fluent solid material, e.g. powders, granular or loose fibrous material, loose masses of small articles, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B1/04—Methods of, or means for, filling the material into the containers or receptacles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
  • Glass Melting And Manufacturing (AREA)
  • Inorganic Insulating Materials (AREA)
HUE20777818A 2019-03-26 2020-01-30 Gömb alakú szilícium-dioxid por HUE065755T2 (hu)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019057610 2019-03-26
JP2019117216 2019-06-25

Publications (1)

Publication Number Publication Date
HUE065755T2 true HUE065755T2 (hu) 2024-06-28

Family

ID=72611761

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE20777818A HUE065755T2 (hu) 2019-03-26 2020-01-30 Gömb alakú szilícium-dioxid por

Country Status (9)

Country Link
US (1) US12091528B2 (hu)
EP (1) EP3950588B1 (hu)
JP (2) JP6793282B1 (hu)
KR (1) KR20210142632A (hu)
CN (1) CN113614036A (hu)
FI (1) FI3950588T3 (hu)
HU (1) HUE065755T2 (hu)
TW (1) TWI833891B (hu)
WO (1) WO2020195205A1 (hu)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202006825QA (en) * 2018-03-16 2020-10-29 Denka Company Ltd Powder and mixed powder
WO2021215519A1 (ja) * 2020-04-24 2021-10-28 デンカ株式会社 球状シリカ粉末
CN115667393A (zh) 2020-09-11 2023-01-31 电化株式会社 组合物及其固化体
JPWO2022209769A1 (hu) * 2021-03-31 2022-10-06
KR20240043154A (ko) 2021-08-20 2024-04-02 덴카 주식회사 구상 결정질 실리카 분말 및 그 제조 방법
JP7041787B1 (ja) 2021-10-20 2022-03-24 デンカ株式会社 球状シリカ粒子の製造方法
JP7041786B1 (ja) 2021-10-20 2022-03-24 デンカ株式会社 球状シリカ粒子及びそれを用いた樹脂組成物
JP7041788B1 (ja) * 2021-10-20 2022-03-24 デンカ株式会社 球状シリカ粒子及びそれを用いた樹脂組成物
JP2023106883A (ja) 2022-01-21 2023-08-02 信越化学工業株式会社 低誘電非晶質シリカ粉体及びその製造方法、ならびに表面処理低誘電シリカ粉体、シリカスラリー、シリカ含有樹脂組成物、シリカ含有プリプレグ及びプリント配線板
WO2023145780A1 (ja) 2022-01-28 2023-08-03 日産化学株式会社 低誘電正接シリカゾル及び低誘電正接シリカゾルの製造方法
CN114702038B (zh) 2022-04-25 2023-09-29 江苏联瑞新材料股份有限公司 超低介电损耗球形二氧化硅微粉的制备方法
WO2024096021A1 (ja) * 2022-10-31 2024-05-10 日産化学株式会社 疎水化低誘電正接シリカゾル、及びその製造方法
JP7473725B1 (ja) 2023-08-25 2024-04-23 デンカ株式会社 シリカ粉末
JP7473726B1 (ja) 2023-08-25 2024-04-23 デンカ株式会社 シリカ粉末

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138740A (ja) 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
GB8320086D0 (en) 1983-07-26 1983-08-24 Ciba Geigy Ag Spherical fused silica
JP3886262B2 (ja) * 1998-09-10 2007-02-28 電気化学工業株式会社 球状シリカ粒子及びその製造方法
JP2003165718A (ja) * 2001-11-27 2003-06-10 Fuso Chemical Co Ltd 無孔質球状シリカ及びその製造方法
JP4083560B2 (ja) 2002-12-13 2008-04-30 株式会社トクヤマ 絶縁特性が改善された無機酸化物粒子の製造方法
JP2004311326A (ja) 2003-04-10 2004-11-04 Asahi Glass Co Ltd フィラー、シート状成形体および積層体
JP4428618B2 (ja) 2003-07-01 2010-03-10 三菱レイヨン株式会社 表面改質球状シリカ及びその製造方法、並びに封止用樹脂組成物
JP2005054129A (ja) 2003-08-07 2005-03-03 Mitsubishi Rayon Co Ltd 吸着性シリカ充填材及びその製造方法並びに封止用樹脂組成物。
US20050238867A1 (en) * 2003-10-31 2005-10-27 Toshio Nakano Antistatic film, antistatic foam sheet and antistatic bubble sheet
JP5062396B2 (ja) 2006-12-28 2012-10-31 信越化学工業株式会社 高純度クリストバライト粒子及びその製造方法
JP5350847B2 (ja) 2009-03-19 2013-11-27 花王株式会社 板状シリカ粒子の製造方法
WO2011007698A1 (ja) 2009-07-14 2011-01-20 花王株式会社 低誘電樹脂組成物
JP5616672B2 (ja) 2010-04-13 2014-10-29 パナソニックヘルスケア株式会社 硬化性組成物及び歯科用硬化物
KR20110121020A (ko) * 2010-04-30 2011-11-07 한국과학기술연구원 구형 산화물 입자 배열시 결함 발생을 감소시키는 방법
JP5513364B2 (ja) 2010-12-24 2014-06-04 花王株式会社 中空シリカ粒子
JP5822663B2 (ja) * 2011-11-11 2015-11-24 日揮触媒化成株式会社 耐湿性を備えたシリカ系粒子とその製造方法、該粒子を含む半導体封止用樹脂組成物、および該樹脂組成物により塗膜を形成された基材
JP5936473B2 (ja) 2012-07-25 2016-06-22 国立研究開発法人産業技術総合研究所 高周波誘電体デバイス
JP6347644B2 (ja) 2014-03-28 2018-06-27 デンカ株式会社 表面改質シリカ粉末及びスラリー組成物
JP6305281B2 (ja) 2014-09-02 2018-04-04 株式会社日本触媒 シリカ焼成体及びシリカ分散液
JP6394372B2 (ja) 2014-12-25 2018-09-26 Dic株式会社 シリカ構造体およびその製造方法
JP6844311B2 (ja) 2016-03-28 2021-03-17 味の素株式会社 樹脂組成物
JP2018145037A (ja) 2017-03-02 2018-09-20 株式会社アドマテックス 樹脂組成物添加用球状結晶質シリカ粉体
JP6934344B2 (ja) 2017-07-18 2021-09-15 デンカ株式会社 球状シリカフィラー用粉末及びその製造方法

Also Published As

Publication number Publication date
TWI833891B (zh) 2024-03-01
FI3950588T3 (fi) 2024-02-08
JP6793282B1 (ja) 2020-12-02
US12091528B2 (en) 2024-09-17
TW202035287A (zh) 2020-10-01
KR20210142632A (ko) 2021-11-25
JP6814906B1 (ja) 2021-01-20
JPWO2020195205A1 (ja) 2021-04-08
JP2021038138A (ja) 2021-03-11
US20220169832A1 (en) 2022-06-02
EP3950588A1 (en) 2022-02-09
EP3950588B1 (en) 2023-11-29
WO2020195205A1 (ja) 2020-10-01
EP3950588A4 (en) 2022-05-11
CN113614036A (zh) 2021-11-05

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