HUE052284T2 - Szerves sav- vagy látens szerves sav-funkcionalizált polimerrel bevont fémporok forrasztópasztákhoz - Google Patents
Szerves sav- vagy látens szerves sav-funkcionalizált polimerrel bevont fémporok forrasztópasztákhozInfo
- Publication number
- HUE052284T2 HUE052284T2 HUE11818714A HUE11818714A HUE052284T2 HU E052284 T2 HUE052284 T2 HU E052284T2 HU E11818714 A HUE11818714 A HU E11818714A HU E11818714 A HUE11818714 A HU E11818714A HU E052284 T2 HUE052284 T2 HU E052284T2
- Authority
- HU
- Hungary
- Prior art keywords
- organic acid
- coated metal
- metal powders
- functionalized polymer
- solder pastes
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/145—Chemical treatment, e.g. passivation or decarburisation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/860,497 US9682447B2 (en) | 2010-08-20 | 2010-08-20 | Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE052284T2 true HUE052284T2 (hu) | 2021-04-28 |
Family
ID=45593118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE11818714A HUE052284T2 (hu) | 2010-08-20 | 2011-08-17 | Szerves sav- vagy látens szerves sav-funkcionalizált polimerrel bevont fémporok forrasztópasztákhoz |
Country Status (10)
Country | Link |
---|---|
US (2) | US9682447B2 (hu) |
EP (1) | EP2605875B1 (hu) |
JP (1) | JP5762540B2 (hu) |
KR (2) | KR101666705B1 (hu) |
CN (1) | CN103209790B (hu) |
HR (1) | HRP20202052T1 (hu) |
HU (1) | HUE052284T2 (hu) |
PL (1) | PL2605875T3 (hu) |
TW (1) | TWI516322B (hu) |
WO (1) | WO2012024382A2 (hu) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6050364B2 (ja) * | 2011-09-06 | 2016-12-21 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | はんだペースト用の二官能性または多官能性電子不足オレフィン被覆金属粉末 |
CN104752596A (zh) * | 2013-12-30 | 2015-07-01 | 江西省晶瑞光电有限公司 | 一种led倒装晶片的固晶方法 |
CN104175025A (zh) * | 2014-04-30 | 2014-12-03 | 江苏博迁新材料有限公司 | 一种有铅焊锡膏用无卤助焊剂 |
JP6979150B2 (ja) * | 2016-03-28 | 2021-12-08 | 協立化学産業株式会社 | 被覆銀粒子とその製造方法、導電性組成物、および導電体 |
EP3488962A1 (en) * | 2017-11-28 | 2019-05-29 | Vestel Elektronik Sanayi ve Ticaret A.S. | Solder composition and method of soldering |
WO2020165193A1 (en) * | 2019-02-11 | 2020-08-20 | The Provost, Fellows, Scholars And Other Members Of Board Of Trinity College Dublin | A product and method for powder feeding in powder bed 3d printers |
KR102489828B1 (ko) * | 2022-08-12 | 2023-01-18 | 오컴퍼니 주식회사 | 솔더 입자에 활성도막을 형성하는 방법 |
Family Cites Families (46)
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US2010193A (en) | 1934-06-13 | 1935-08-06 | Lyle Jesse Lee | Bunch builder |
US4298407A (en) | 1980-08-04 | 1981-11-03 | E. I. Du Pont De Nemours And Company | Flux treated solder powder composition |
US4452861A (en) | 1982-05-20 | 1984-06-05 | Rca Corporation | Solid particles encapsulated with cyanoacrylate polymer |
DE3433851A1 (de) | 1984-09-14 | 1986-03-27 | Gurit-Essex, Freienbach | Chemisch haertbare harze aus 1-oxa-3-aza-tetralin-gruppen enthaltenden verbindungen und cycloaliphatischen epoxid-harzen, verfahren zu deren herstellung und haertung sowie die verwendung solcher harze |
US5290825A (en) | 1985-05-17 | 1994-03-01 | Lazar Warren G | Composition and method for inhibiting the cure of cyanoacrylate adhesives and cure inhibited cyanoacrylate adhesive compositions |
JP2564152B2 (ja) | 1987-10-27 | 1996-12-18 | タムラ化研株式会社 | はんだペースト |
DE58909626D1 (de) | 1988-07-18 | 1996-04-25 | Gurit Essex Ag | Zu schwerentflammbaren und hochtemperaturbeständigen Kunststoffen härtbare Harze und Verfahren zu deren Herstellung |
US5376403A (en) | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
US5180752A (en) | 1990-03-08 | 1993-01-19 | Pierce & Stevens Corporation | Process for making dry microspheres |
US5062896A (en) | 1990-03-30 | 1991-11-05 | International Business Machines Corporation | Solder/polymer composite paste and method |
JPH0420650U (hu) | 1990-06-04 | 1992-02-20 | ||
EP0493310A1 (de) | 1990-12-21 | 1992-07-01 | Gurit-Essex AG | Zu schwerentflammbaren Kunststoffen härtbare Harzmischungen und deren Verwendung |
US5234757A (en) | 1991-04-30 | 1993-08-10 | The Dexter Corporation | Expandable films and molded products therefrom |
US5272007A (en) * | 1992-02-21 | 1993-12-21 | Union Carbide Chemicals & Plastics Technology Corporation | Solder powder coated with parylene |
US5281388A (en) | 1992-03-20 | 1994-01-25 | Mcdonnell Douglas Corporation | Resin impregnation process for producing a resin-fiber composite |
US5439635A (en) | 1993-02-18 | 1995-08-08 | Scrimp Systems, Llc | Unitary vacuum bag for forming fiber reinforced composite articles and process for making same |
US5369192A (en) | 1993-06-28 | 1994-11-29 | Minnesota Mining And Manufacturing Company | Binder resin for resin transfer molding preforms |
US5445911A (en) | 1993-07-28 | 1995-08-29 | Hewlett-Packard Company | Chelating positive charge director for liquid electrographic toner |
WO1995020460A1 (en) * | 1994-01-27 | 1995-08-03 | Indium Corporation Of America | Solder paste utilizing aromatic carboxylic acids |
US5480603A (en) | 1994-05-19 | 1996-01-02 | The Dow Chemical Company | Method for preparing preforms for molding processes |
US5567499A (en) | 1995-01-03 | 1996-10-22 | The Boeing Company | Resin transfer molding in combination with honeycomb core |
US5569508A (en) | 1995-01-03 | 1996-10-29 | The Boeing Company | Resin transfer molding with honeycomb core and core filler |
US5736074A (en) | 1995-06-30 | 1998-04-07 | Micro Fab Technologies, Inc. | Manufacture of coated spheres |
US5677048A (en) | 1996-03-04 | 1997-10-14 | Gateway Technologies, Inc. | Coated skived foam and fabric article containing energy absorbing phase change material |
US5851311A (en) | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
JP3493101B2 (ja) | 1996-08-15 | 2004-02-03 | 三井金属鉱業株式会社 | 半田粉及びその製造方法、及びその半田粉を用いた半田ペースト |
US5902535A (en) | 1997-07-30 | 1999-05-11 | Mcdonnell Douglas Corporation | Resin film infusion mold tooling and molding method |
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US7368167B2 (en) | 2004-06-17 | 2008-05-06 | Henkel Corporation | Ultra low density thermally clad microspheres and method of making same |
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JP2009030111A (ja) | 2007-07-27 | 2009-02-12 | Sumitomo Metal Mining Co Ltd | 銀微粒子コロイド分散液および銀膜 |
JP2009269935A (ja) | 2008-04-30 | 2009-11-19 | Sumitomo Metal Mining Co Ltd | 金色系金属光沢を有する銀膜 |
JP5287038B2 (ja) | 2008-08-27 | 2013-09-11 | 株式会社リコー | シリカ被覆金ナノロッド及びその製造方法 |
JP5461134B2 (ja) | 2008-11-20 | 2014-04-02 | 三ツ星ベルト株式会社 | 無機素材用接合剤及び無機素材の接合体 |
EP2370219B8 (en) | 2008-11-21 | 2014-09-10 | Henkel US IP LLC | Thermally decomposable polymer coated metal powders |
JP5430922B2 (ja) | 2008-12-24 | 2014-03-05 | 三ツ星ベルト株式会社 | 導電性基材の製造方法 |
-
2010
- 2010-08-20 US US12/860,497 patent/US9682447B2/en active Active
-
2011
- 2011-08-17 KR KR1020137004151A patent/KR101666705B1/ko active IP Right Grant
- 2011-08-17 JP JP2013524958A patent/JP5762540B2/ja active Active
- 2011-08-17 KR KR1020157007907A patent/KR20150040378A/ko not_active Application Discontinuation
- 2011-08-17 WO PCT/US2011/048062 patent/WO2012024382A2/en active Application Filing
- 2011-08-17 HU HUE11818714A patent/HUE052284T2/hu unknown
- 2011-08-17 EP EP11818714.5A patent/EP2605875B1/en active Active
- 2011-08-17 PL PL11818714T patent/PL2605875T3/pl unknown
- 2011-08-17 CN CN201180040347.3A patent/CN103209790B/zh active Active
- 2011-08-18 TW TW100129613A patent/TWI516322B/zh active
-
2017
- 2017-05-18 US US15/599,024 patent/US10189121B2/en active Active
-
2020
- 2020-12-21 HR HRP20202052TT patent/HRP20202052T1/hr unknown
Also Published As
Publication number | Publication date |
---|---|
JP2013538293A (ja) | 2013-10-10 |
KR20130099003A (ko) | 2013-09-05 |
JP5762540B2 (ja) | 2015-08-12 |
PL2605875T3 (pl) | 2021-03-08 |
TW201228748A (en) | 2012-07-16 |
EP2605875B1 (en) | 2020-09-30 |
CN103209790A (zh) | 2013-07-17 |
KR20150040378A (ko) | 2015-04-14 |
US9682447B2 (en) | 2017-06-20 |
US10189121B2 (en) | 2019-01-29 |
TWI516322B (zh) | 2016-01-11 |
WO2012024382A2 (en) | 2012-02-23 |
EP2605875A4 (en) | 2017-04-19 |
WO2012024382A3 (en) | 2012-07-05 |
US20120042990A1 (en) | 2012-02-23 |
CN103209790B (zh) | 2015-10-21 |
KR101666705B1 (ko) | 2016-10-17 |
EP2605875A2 (en) | 2013-06-26 |
US20170259383A1 (en) | 2017-09-14 |
HRP20202052T1 (hr) | 2021-03-05 |
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