HUE044085T2 - Koncentrikus átkötések elektronikus hordozóban - Google Patents
Koncentrikus átkötések elektronikus hordozóbanInfo
- Publication number
- HUE044085T2 HUE044085T2 HUE09770820A HUE09770820A HUE044085T2 HU E044085 T2 HUE044085 T2 HU E044085T2 HU E09770820 A HUE09770820 A HU E09770820A HU E09770820 A HUE09770820 A HU E09770820A HU E044085 T2 HUE044085 T2 HU E044085T2
- Authority
- HU
- Hungary
- Prior art keywords
- electronic substrate
- concentric vias
- vias
- concentric
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/163,028 US8273995B2 (en) | 2008-06-27 | 2008-06-27 | Concentric vias in electronic substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE044085T2 true HUE044085T2 (hu) | 2019-09-30 |
Family
ID=41061103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE09770820A HUE044085T2 (hu) | 2008-06-27 | 2009-06-19 | Koncentrikus átkötések elektronikus hordozóban |
Country Status (9)
Country | Link |
---|---|
US (1) | US8273995B2 (hu) |
EP (1) | EP2313920B1 (hu) |
JP (1) | JP5524203B2 (hu) |
KR (2) | KR20120125675A (hu) |
CN (1) | CN102067305B (hu) |
ES (1) | ES2719532T3 (hu) |
HU (1) | HUE044085T2 (hu) |
TW (1) | TWI404480B (hu) |
WO (1) | WO2009158286A1 (hu) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8104171B2 (en) * | 2008-08-27 | 2012-01-31 | Advanced Semiconductor Engineering, Inc. | Method of fabricating multi-layered substrate |
EP2463809A1 (fr) | 2010-12-07 | 2012-06-13 | NagraID S.A. | Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne |
JP2012174874A (ja) * | 2011-02-21 | 2012-09-10 | Fujitsu Ltd | プリント配線板の製造方法及びプリント配線板 |
CN102300401A (zh) * | 2011-08-12 | 2011-12-28 | 三星半导体(中国)研究开发有限公司 | 实现多信号传输的通孔结构及其制造方法 |
JP5895635B2 (ja) * | 2012-03-16 | 2016-03-30 | 富士通株式会社 | 配線板の製造方法、配線板およびビアの構造 |
SG11201407290PA (en) | 2012-05-16 | 2014-12-30 | Nagravision Sa | Method for producing an electronic card having an external connector and such an external connector |
CN103687288B (zh) * | 2012-09-11 | 2017-04-05 | 上海耐普微电子有限公司 | 印刷电路板的连接部件及连接结构 |
WO2015116093A1 (en) * | 2014-01-30 | 2015-08-06 | Hewlett-Packard Development Company, L.P. | Printed circuit board with co-axial vias |
US9706667B2 (en) * | 2014-05-19 | 2017-07-11 | Sierra Circuits, Inc. | Via in a printed circuit board |
US9807867B2 (en) | 2016-02-04 | 2017-10-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interconnect structure and method of manufacturing the same |
CN106653318B (zh) * | 2017-02-28 | 2019-06-18 | 华为技术有限公司 | 电感器件和交错并联直流变换器 |
US11160163B2 (en) | 2017-11-17 | 2021-10-26 | Texas Instruments Incorporated | Electronic substrate having differential coaxial vias |
CN111010797A (zh) | 2018-10-08 | 2020-04-14 | 中兴通讯股份有限公司 | 电路板、设备及过孔形成方法 |
TWI704852B (zh) * | 2018-11-28 | 2020-09-11 | 先豐通訊股份有限公司 | 電路板的電鍍方法及其所製成的電路板 |
US11792918B2 (en) * | 2021-01-28 | 2023-10-17 | Unimicron Technology Corp. | Co-axial via structure |
TWI781786B (zh) * | 2021-01-28 | 2022-10-21 | 欣興電子股份有限公司 | 共軸通孔結構及其製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5421083A (en) * | 1994-04-01 | 1995-06-06 | Motorola, Inc. | Method of manufacturing a circuit carrying substrate having coaxial via holes |
US5541567A (en) * | 1994-10-17 | 1996-07-30 | International Business Machines Corporation | Coaxial vias in an electronic substrate |
US5949030A (en) * | 1997-11-14 | 1999-09-07 | International Business Machines Corporation | Vias and method for making the same in organic board and chip carriers |
AU5323000A (en) * | 1999-06-11 | 2001-01-02 | Teradyne, Inc. | Split via surface mount connector and related techniques |
JP2001168530A (ja) * | 1999-12-13 | 2001-06-22 | Ngk Spark Plug Co Ltd | 配線基板及び配線基板の製造方法 |
US6479764B1 (en) * | 2000-05-10 | 2002-11-12 | International Business Machines Corporation | Via structure with dual current path |
JP4390368B2 (ja) * | 2000-06-08 | 2009-12-24 | 新光電気工業株式会社 | 配線基板の製造方法 |
JP4023076B2 (ja) | 2000-07-27 | 2007-12-19 | 富士通株式会社 | 表裏導通基板及びその製造方法 |
US7091424B2 (en) * | 2002-10-10 | 2006-08-15 | International Business Machines Corporation | Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers |
US7081650B2 (en) * | 2003-03-31 | 2006-07-25 | Intel Corporation | Interposer with signal and power supply through vias |
JP4855075B2 (ja) | 2004-02-04 | 2012-01-18 | イビデン株式会社 | 多層プリント配線板 |
JP4430976B2 (ja) * | 2004-05-10 | 2010-03-10 | 富士通株式会社 | 配線基板及びその製造方法 |
SG135065A1 (en) * | 2006-02-20 | 2007-09-28 | Micron Technology Inc | Conductive vias having two or more elements for providing communication between traces in different substrate planes, semiconductor device assemblies including such vias, and accompanying methods |
JP4608297B2 (ja) * | 2004-12-06 | 2011-01-12 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 積層配線基板の製造方法 |
DE102004060962A1 (de) * | 2004-12-17 | 2006-07-13 | Advanced Micro Devices, Inc., Sunnyvale | Mehrlagige gedruckte Schaltung mit einer Durchkontaktierung für Hochfrequenzanwendungen |
US7613007B2 (en) | 2004-12-21 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Power core devices |
JP2007027451A (ja) | 2005-07-19 | 2007-02-01 | Shinko Electric Ind Co Ltd | 回路基板及びその製造方法 |
US7404250B2 (en) * | 2005-12-02 | 2008-07-29 | Cisco Technology, Inc. | Method for fabricating a printed circuit board having a coaxial via |
TWI272886B (en) * | 2006-02-27 | 2007-02-01 | Advanced Semiconductor Eng | Substrate with multi-layer PTH and method for forming the multi-layer PTH |
US7989915B2 (en) * | 2006-07-11 | 2011-08-02 | Teledyne Licensing, Llc | Vertical electrical device |
-
2008
- 2008-06-27 US US12/163,028 patent/US8273995B2/en active Active
-
2009
- 2009-06-19 CN CN2009801235529A patent/CN102067305B/zh active Active
- 2009-06-19 EP EP09770820.0A patent/EP2313920B1/en active Active
- 2009-06-19 KR KR1020127028794A patent/KR20120125675A/ko not_active Application Discontinuation
- 2009-06-19 KR KR1020117001759A patent/KR101213184B1/ko active IP Right Grant
- 2009-06-19 HU HUE09770820A patent/HUE044085T2/hu unknown
- 2009-06-19 JP JP2011516479A patent/JP5524203B2/ja active Active
- 2009-06-19 WO PCT/US2009/048029 patent/WO2009158286A1/en active Application Filing
- 2009-06-19 ES ES09770820T patent/ES2719532T3/es active Active
- 2009-06-26 TW TW098121681A patent/TWI404480B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI404480B (zh) | 2013-08-01 |
WO2009158286A1 (en) | 2009-12-30 |
KR101213184B1 (ko) | 2012-12-18 |
US20090321126A1 (en) | 2009-12-31 |
JP2011526080A (ja) | 2011-09-29 |
TW201018343A (en) | 2010-05-01 |
CN102067305B (zh) | 2013-12-04 |
JP5524203B2 (ja) | 2014-06-18 |
KR20120125675A (ko) | 2012-11-16 |
EP2313920A1 (en) | 2011-04-27 |
US8273995B2 (en) | 2012-09-25 |
KR20110020941A (ko) | 2011-03-03 |
EP2313920B1 (en) | 2019-01-09 |
ES2719532T3 (es) | 2019-07-11 |
CN102067305A (zh) | 2011-05-18 |
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