HUE028880T2 - Paszta és eljárás elektronikus alkotórészek összekapcsolására egy hordozóval - Google Patents

Paszta és eljárás elektronikus alkotórészek összekapcsolására egy hordozóval Download PDF

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Publication number
HUE028880T2
HUE028880T2 HUE11007634A HUE11007634A HUE028880T2 HU E028880 T2 HUE028880 T2 HU E028880T2 HU E11007634 A HUE11007634 A HU E11007634A HU E11007634 A HUE11007634 A HU E11007634A HU E028880 T2 HUE028880 T2 HU E028880T2
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HU
Hungary
Prior art keywords
paste
acid
fee
tee
substrate
Prior art date
Application number
HUE11007634A
Other languages
English (en)
Inventor
Michael Schäfer
Wolfgang Schmitt
Albert Heilmann
Jens Nachreiner
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
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Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg filed Critical Heraeus Deutschland Gmbh & Co Kg
Publication of HUE028880T2 publication Critical patent/HUE028880T2/hu

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
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    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83399—Material
    • H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/83438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/83447—Copper [Cu] as principal constituent
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    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83399—Material
    • H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/83438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/83455—Nickel [Ni] as principal constituent
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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Claims (4)

  1. II iUARÁS elektronikusalkötörEszek összekapcsolására egy hordozóval SZABADALMI IGÉNYPONTOK 1 .:|«upAtA Íszloterező; sinter) paszta, amely a köveseiket tartalmazza: {ej iêmPszôîÂk amelyek a következők kézül yáisszihaiékki: rék, ezüst, nfeiès aiominitmti fés^öcskék; (b) tegaSäÄsQy aktivster, amely hordoz tsgelébb két prfcöhssv egységeim molekulában; As íc) diszperziós közeg. 2-.M 1. igénypont szerinti paszta, azzal llfôrég»k$& ezösf réspöskék, I, Az 1. vagy 2. igényijei szsdati íiSiszía, azzal |a|!:&m82VA> bogy áz aktívéternak az elbomlási {dörmmpsitioni pon^s: a; :1:QüDG és IPÔG közötti tartományban ven.
  2. 4. Az 1>3. igénypontok bármelyiké szëfibif paszta, azzal jöílame^apbogy az akövátör a kővetkezők Közül váiesztbatö ki: dikafbspsavak ééii^mpteíípe vitt (comptazadídikarbonsavak, S< Az 14. igénypontok bármelyike széiioti paszta, ami JsiísmszYé, hogy az aktivster a következők köz® választható ki: maionsay maieinssv. dimetil-ma'onssv és oxáisav.
  3. 6. Az t-5. Igényppóiok: bármaiyik® szgönti paszta, mai jellemezve, hogy a diszperziós közeg tartsimaz -agy alifás szénhidrogén vegyúteíet.
  4. 7. Eljárás legalább egy elektronlkes alkotórész összekapcsolására legaláDb egy hordozóhoz egy érintkező régión -contact region) keraszp, ahol a legalább agy említett érintkező régió iartaimaz egy nem-nemesfémet; az eljárás a következő íépésekaltaríaimazzs: $ szoSgaitatank egy bótdozóí fssisfcais)* :^Â^datk^fé§ié|iy'i^Âbâ'^y ótekirsnikps aíkotóreszL amelynek van egy ntásodik #Äez§ régiója, ahsí az ensíiótt iriÄzb régiók legalább agyike tadaíshsosgy ngnvnemesÄbt; pi szsigáitatuhk agy pasztát amely a kdÄeztotförÄszzg· {ajfémrészecskók. ametpk a következők közül választhatok ki: r%. ezüst nikkel és aluminium részecskék; (bbtepiább dgyaktivátot amely hordoz isgaipfc kél karbonsav egységei a moiekatában; és (# diszperziós: közeg; fis) liaSakSinek egy éseflfez ahol a hordozó bise èrÂézô; régié|gí érintkezésbe hozztÉ az aiektfonlkas alkotórész második érintkező régióiéval a pasztán ikéresztüS; és |y) zaügor:itjuk|síníé?) a ezerkézetet, miközben olyan rnorielbaiékibiak ki, emaiylartsimazza iegaiêbb a: hordozót és az elektronikus aikötöfészt egyméssaitesszékettetésben a zsisgoritott {sintered) paszta réven, I. AT. Igénypont :szarioti altéras, azzá! jeílemezve, hogy az end tletf: érintkező régiek legalább agytke az elekavtnikns aikoioréSzoek vagy la hordozónak pszfatiaé (tegml) alkotórésze, B. A 7, vagy I, igénypont szerinti epres, azzal pfemesve, hogy a nemmemas fém réz, és azsktivátöt a követkgÄ köztit választható ki: maion sav, maleinsav és ozáisav. tO, A 7, vagy igénypont szerinij é|árá$, azzal jéíjáibézye, hogy a nommâmes fém nAkeí, és az aktivál a kő vétkezők köz®; yéiaázitatö ki: dimetií-maionsav é$ okáisav.
HUE11007634A 2011-09-20 2011-09-20 Paszta és eljárás elektronikus alkotórészek összekapcsolására egy hordozóval HUE028880T2 (hu)

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