HK9886A - Gold solders - Google Patents

Gold solders

Info

Publication number
HK9886A
HK9886A HK98/86A HK9886A HK9886A HK 9886 A HK9886 A HK 9886A HK 98/86 A HK98/86 A HK 98/86A HK 9886 A HK9886 A HK 9886A HK 9886 A HK9886 A HK 9886A
Authority
HK
Hong Kong
Prior art keywords
gold solders
solders
gold
Prior art date
Application number
HK98/86A
Other languages
English (en)
Inventor
Sakakibara Yousuke
Kasai Takao
Takasugi Tsuneji
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Publication of HK9886A publication Critical patent/HK9886A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Adornments (AREA)
HK98/86A 1982-03-05 1986-02-05 Gold solders HK9886A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57033942A JPS58151992A (ja) 1982-03-05 1982-03-05 金ロウ材

Publications (1)

Publication Number Publication Date
HK9886A true HK9886A (en) 1986-02-14

Family

ID=12400556

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98/86A HK9886A (en) 1982-03-05 1986-02-05 Gold solders

Country Status (6)

Country Link
US (1) US4444719A (cs)
JP (1) JPS58151992A (cs)
CH (1) CH642106A5 (cs)
DE (1) DE3304736C2 (cs)
GB (1) GB2116210B (cs)
HK (1) HK9886A (cs)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4810313A (en) * 1988-03-14 1989-03-07 Virginia McReynolds Gold solder fluxing composition and method of preparing the same
JP2731435B2 (ja) * 1989-10-20 1998-03-25 田中貴金属工業株式会社 エレクトロマイグレーション防止性ろう材及び外部リードをろう付けした電子部品
JP2731434B2 (ja) * 1989-10-20 1998-03-25 田中貴金属工業株式会社 エレクトロマイグレーション防止性ろう材及び外部リードをろう付けした電子部品
US5384089A (en) * 1994-05-02 1995-01-24 Diamond; Lawrence H. Yellow karat gold casting alloys
DE69604144T2 (de) * 1995-03-20 2000-04-27 Koninklijke Philips Electronics N.V., Eindhoven Glasversiegelte halbleiteranordnung bestehend aus einem halbleiterkörper mit einer silber-kupfer-verbindungsschicht zwischen senke und verbindungsleitern
US7074350B2 (en) * 2001-03-23 2006-07-11 Citizen Watch Co., Ltd. Brazing filler metal
JP6084915B2 (ja) * 2012-11-06 2017-02-22 日本碍子株式会社 セラミックス部材と金属部材との接合体及びその製法
WO2015193659A2 (en) * 2014-06-16 2015-12-23 Allied Gold Limited Alloy compositions

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US219097A (en) * 1879-09-02 Improvement in alloys for jewelry
DE153895C (cs) *
GB985281A (en) * 1960-03-18 1965-03-03 Texas Instruments Inc Composite products for soldering and the like and method of their manufacture
DE1235714B (de) * 1963-10-23 1967-03-02 Telefunken Patent Vakuumdichte Metall-Keramik-Loetverbindung an einer elektrischen Entladungsanordnung
DE2829284A1 (de) * 1978-07-04 1980-01-17 Wagner Fa Ferd Goldlegierungsdraht fuer schmuckketten
US4330329A (en) * 1979-11-28 1982-05-18 Tanaka Denshi Kogyo Kabushiki Kaisha Gold bonding wire for semiconductor elements and the semiconductor element
DE3019277A1 (de) * 1980-05-21 1981-11-26 Fa. Dr. Th. Wieland, 7530 Pforzheim Kupferfreie goldlegierung fuer zahnaerztliche zwecke

Also Published As

Publication number Publication date
DE3304736A1 (de) 1983-09-08
DE3304736C2 (de) 1986-07-31
GB8303737D0 (en) 1983-03-16
JPH029558B2 (cs) 1990-03-02
US4444719A (en) 1984-04-24
GB2116210B (en) 1985-07-10
CH642106A5 (de) 1984-03-30
JPS58151992A (ja) 1983-09-09
GB2116210A (en) 1983-09-21

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