HK62697A - Process for metallizing non-conducting surfaces and the use of hydroxymethyl sulphinic acid in that process - Google Patents
Process for metallizing non-conducting surfaces and the use of hydroxymethyl sulphinic acid in that processInfo
- Publication number
- HK62697A HK62697A HK62697A HK62697A HK62697A HK 62697 A HK62697 A HK 62697A HK 62697 A HK62697 A HK 62697A HK 62697 A HK62697 A HK 62697A HK 62697 A HK62697 A HK 62697A
- Authority
- HK
- Hong Kong
- Prior art keywords
- appropriate
- conducting surfaces
- hydroxymethyl
- treatment
- sulphinic acid
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4206680A DE4206680C1 (de) | 1992-02-28 | 1992-02-28 | Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren |
PCT/DE1993/000153 WO1993017153A1 (de) | 1992-02-28 | 1993-02-17 | Verfahren zur metallisierung von nichtleiteroberflächen und die verwendung von hydroximethylsulfinsäure im verfahren |
Publications (1)
Publication Number | Publication Date |
---|---|
HK62697A true HK62697A (en) | 1997-05-16 |
Family
ID=6453129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK62697A HK62697A (en) | 1992-02-28 | 1997-05-08 | Process for metallizing non-conducting surfaces and the use of hydroxymethyl sulphinic acid in that process |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0627021B1 (xx) |
JP (1) | JP2799076B2 (xx) |
KR (1) | KR100213528B1 (xx) |
AT (1) | ATE144007T1 (xx) |
DE (2) | DE4206680C1 (xx) |
HK (1) | HK62697A (xx) |
SG (1) | SG46616A1 (xx) |
WO (1) | WO1993017153A1 (xx) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2712086B1 (fr) * | 1993-11-04 | 1996-01-26 | Lyon Ecole Centrale | Procédé et composition pour la préparation d'échantillons, en vue de leur observation en microscopie électronique. |
DE4412463C3 (de) * | 1994-04-08 | 2000-02-10 | Atotech Deutschland Gmbh | Verfahren zur Herstellung einer Palladium-Kolloid-Lösung und ihre Verwendung |
US6325910B1 (en) | 1994-04-08 | 2001-12-04 | Atotch Deutschland Gmbh | Palladium colloid solution and its utilization |
DE19510855C2 (de) * | 1995-03-17 | 1998-04-30 | Atotech Deutschland Gmbh | Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien |
DE19740431C1 (de) * | 1997-09-11 | 1998-11-12 | Atotech Deutschland Gmbh | Verfahren zum Metallisieren eines elektrisch nichtleitende Oberflächenbereiche aufweisenden Substrats |
DE19908755A1 (de) * | 1999-02-19 | 2000-08-24 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf elektrisch nichtleitenden Oberflächen |
DE19918833C2 (de) * | 1999-04-22 | 2002-10-31 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens |
KR20020007875A (ko) * | 2000-07-19 | 2002-01-29 | 마이클 디. 오브라이언 | 반도체 패키지 제조용 리드프레임 |
DE10037071A1 (de) | 2000-07-29 | 2002-02-21 | Omg Ag & Co Kg | Edelmetall-Nanopartikel, Verfahren zu ihrer Herstellung und Verwendung |
JP4662039B2 (ja) * | 2005-07-08 | 2011-03-30 | 上村工業株式会社 | ダイレクトプレーティング方法 |
KR101329989B1 (ko) | 2006-11-06 | 2013-11-15 | 우에무라 고교 가부시키가이샤 | 다이렉트 플레이팅 방법 및 팔라듐 도전체층 형성 용액 |
JP2009021153A (ja) * | 2007-07-13 | 2009-01-29 | Mitsubishi Paper Mills Ltd | 導電性発現方法および導電性部材 |
US9611550B2 (en) | 2012-12-26 | 2017-04-04 | Rohm And Haas Electronic Materials Llc | Formaldehyde free electroless copper plating compositions and methods |
DE102013208395B3 (de) | 2013-05-07 | 2014-08-28 | Helmholtz-Zentrum Dresden - Rossendorf E.V. | Bauteil mit metallhaltiger, selbstorganisierter Schicht, Verfahren zu deren Herstellung sowie Verwendung |
US20170051410A1 (en) * | 2015-08-20 | 2017-02-23 | Macdermid Acumen, Inc. | Solutions of Organic Salts as Pretreatments for Plastic Prior to Etching |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS587888B2 (ja) * | 1975-09-10 | 1983-02-12 | 株式会社クボタ | ハイトウノハンシユツソウチ |
JPS5343890A (en) * | 1976-10-02 | 1978-04-20 | Nippon Telegr & Teleph Corp <Ntt> | Corrosion protective device for submarine coaxial cable, repeater frame |
JPS5654386A (en) * | 1979-10-11 | 1981-05-14 | Hitachi Ltd | Fuel cladding tube with composit clad |
DE3323476A1 (de) * | 1982-07-01 | 1984-01-05 | Kollmorgen Technologies Corp., 75201 Dallas, Tex. | Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen |
JPS60173191A (ja) * | 1984-02-14 | 1985-09-06 | 東海染工株式会社 | 部分導電化法 |
US4652311A (en) * | 1984-05-07 | 1987-03-24 | Shipley Company Inc. | Catalytic metal of reduced particle size |
JPS63203773A (ja) * | 1987-02-19 | 1988-08-23 | Nippon Mining Co Ltd | 基体への金属被膜の形成方法 |
US5007990A (en) * | 1987-07-10 | 1991-04-16 | Shipley Company Inc. | Electroplating process |
DE3741459C1 (de) * | 1987-12-08 | 1989-04-13 | Blasberg Oberflaechentech | Verfahren zur Herstellung durchkontaktierter Leiterplatten |
US5071517A (en) * | 1989-11-21 | 1991-12-10 | Solution Technology Systems | Method for directly electroplating a dielectric substrate and plated substrate so produced |
-
1992
- 1992-02-28 DE DE4206680A patent/DE4206680C1/de not_active Expired - Fee Related
-
1993
- 1993-02-17 JP JP5514447A patent/JP2799076B2/ja not_active Expired - Lifetime
- 1993-02-17 SG SG1996006772A patent/SG46616A1/en unknown
- 1993-02-17 EP EP93903816A patent/EP0627021B1/de not_active Expired - Lifetime
- 1993-02-17 DE DE59304131T patent/DE59304131D1/de not_active Expired - Lifetime
- 1993-02-17 WO PCT/DE1993/000153 patent/WO1993017153A1/de active IP Right Grant
- 1993-02-17 AT AT93903816T patent/ATE144007T1/de active
-
1994
- 1994-08-24 KR KR1019940702957A patent/KR100213528B1/ko not_active IP Right Cessation
-
1997
- 1997-05-08 HK HK62697A patent/HK62697A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2799076B2 (ja) | 1998-09-17 |
KR100213528B1 (en) | 1999-08-02 |
EP0627021B1 (de) | 1996-10-09 |
KR950700440A (ko) | 1995-01-16 |
DE59304131D1 (de) | 1996-11-14 |
JPH08501348A (ja) | 1996-02-13 |
DE4206680C1 (de) | 1994-01-27 |
ATE144007T1 (de) | 1996-10-15 |
EP0627021A1 (de) | 1994-12-07 |
SG46616A1 (en) | 1998-02-20 |
WO1993017153A1 (de) | 1993-09-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PE | Patent expired |
Effective date: 20130216 |