HK169395A - High efficiency lamp or light accepter - Google Patents
High efficiency lamp or light accepterInfo
- Publication number
- HK169395A HK169395A HK169395A HK169395A HK169395A HK 169395 A HK169395 A HK 169395A HK 169395 A HK169395 A HK 169395A HK 169395 A HK169395 A HK 169395A HK 169395 A HK169395 A HK 169395A
- Authority
- HK
- Hong Kong
- Prior art keywords
- accepter
- light
- high efficiency
- efficiency lamp
- lamp
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/399,832 US5055892A (en) | 1989-08-29 | 1989-08-29 | High efficiency lamp or light accepter |
Publications (1)
Publication Number | Publication Date |
---|---|
HK169395A true HK169395A (en) | 1995-11-10 |
Family
ID=23581141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK169395A HK169395A (en) | 1989-08-29 | 1995-11-02 | High efficiency lamp or light accepter |
Country Status (5)
Country | Link |
---|---|
US (1) | US5055892A (xx) |
EP (1) | EP0415640B1 (xx) |
JP (1) | JP2891525B2 (xx) |
DE (1) | DE69016885T2 (xx) |
HK (1) | HK169395A (xx) |
Families Citing this family (91)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0582078B1 (en) * | 1992-08-05 | 2000-08-16 | Motorola, Inc. | Superluminescent edge emitting device |
JPH0794785A (ja) * | 1993-09-22 | 1995-04-07 | Stanley Electric Co Ltd | 発光ダイオ−ド |
US6864570B2 (en) * | 1993-12-17 | 2005-03-08 | The Regents Of The University Of California | Method and apparatus for fabricating self-assembling microstructures |
USH1645H (en) * | 1995-01-03 | 1997-05-06 | Lewis; Michael L. | Underwater multi-mode night vision apparatus |
US6577332B2 (en) * | 1997-09-12 | 2003-06-10 | Ricoh Company, Ltd. | Optical apparatus and method of manufacturing optical apparatus |
US6006668A (en) * | 1998-04-20 | 1999-12-28 | Hewlett-Packard Company | Glossy or matte-finish media detector and method for use in a printing device |
US6670207B1 (en) * | 1999-03-15 | 2003-12-30 | Gentex Corporation | Radiation emitter device having an integral micro-groove lens |
US6335548B1 (en) * | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
WO2001069300A2 (en) | 2000-03-16 | 2001-09-20 | Led Products, Inc. | High efficiency non-imaging optics |
US7320632B2 (en) * | 2000-06-15 | 2008-01-22 | Lednium Pty Limited | Method of producing a lamp |
AUPQ818100A0 (en) * | 2000-06-15 | 2000-07-06 | Arlec Australia Limited | Led lamp |
GB0017659D0 (en) * | 2000-07-19 | 2000-09-06 | Secr Defence | Light emitting diode with lens |
US7064355B2 (en) * | 2000-09-12 | 2006-06-20 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
JP2002141556A (ja) * | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
US7053419B1 (en) * | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
DE10054966A1 (de) * | 2000-11-06 | 2002-05-16 | Osram Opto Semiconductors Gmbh | Bauelement für die Optoelektronik |
US6940704B2 (en) | 2001-01-24 | 2005-09-06 | Gelcore, Llc | Semiconductor light emitting device |
US6987613B2 (en) | 2001-03-30 | 2006-01-17 | Lumileds Lighting U.S., Llc | Forming an optical element on the surface of a light emitting device for improved light extraction |
US6455878B1 (en) | 2001-05-15 | 2002-09-24 | Lumileds Lighting U.S., Llc | Semiconductor LED flip-chip having low refractive index underfill |
US7728345B2 (en) * | 2001-08-24 | 2010-06-01 | Cao Group, Inc. | Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame |
US7976211B2 (en) * | 2001-08-24 | 2011-07-12 | Densen Cao | Light bulb utilizing a replaceable LED light source |
US8201985B2 (en) | 2001-08-24 | 2012-06-19 | Cao Group, Inc. | Light bulb utilizing a replaceable LED light source |
US8569785B2 (en) * | 2001-08-24 | 2013-10-29 | Cao Group, Inc. | Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame |
WO2003107423A1 (en) * | 2002-06-14 | 2003-12-24 | Lednium Pty. Ltd. | A lamp and method of producing a lamp |
US7479662B2 (en) | 2002-08-30 | 2009-01-20 | Lumination Llc | Coated LED with improved efficiency |
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
EP1930959B1 (en) * | 2002-08-30 | 2019-05-08 | GE Lighting Solutions, LLC | Phosphor-coated light emitting diode with improved efficiency |
US7800121B2 (en) | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
US6896381B2 (en) * | 2002-10-11 | 2005-05-24 | Light Prescriptions Innovators, Llc | Compact folded-optics illumination lens |
JP4143732B2 (ja) * | 2002-10-16 | 2008-09-03 | スタンレー電気株式会社 | 車載用波長変換素子 |
US7042655B2 (en) * | 2002-12-02 | 2006-05-09 | Light Prescriptions Innovators, Llc | Apparatus and method for use in fulfilling illumination prescription |
US7377671B2 (en) * | 2003-02-04 | 2008-05-27 | Light Prescriptions Innovators, Llc | Etendue-squeezing illumination optics |
NZ542269A (en) * | 2003-03-12 | 2008-03-28 | Lednium Technology Pty Ltd | A lamp assembly and a process for producing a lamp assembly |
US7021797B2 (en) * | 2003-05-13 | 2006-04-04 | Light Prescriptions Innovators, Llc | Optical device for repositioning and redistributing an LED's light |
US7329029B2 (en) | 2003-05-13 | 2008-02-12 | Light Prescriptions Innovators, Llc | Optical device for LED-based lamp |
US8075147B2 (en) | 2003-05-13 | 2011-12-13 | Light Prescriptions Innovators, Llc | Optical device for LED-based lamp |
US6803607B1 (en) * | 2003-06-13 | 2004-10-12 | Cotco Holdings Limited | Surface mountable light emitting device |
WO2005012951A2 (en) * | 2003-07-28 | 2005-02-10 | Light Prescriptions Innovators, Llc | Three-dimensional simultaneous multiple-surface method and free-form illumination-optics designed therefrom |
WO2005012952A2 (en) * | 2003-07-29 | 2005-02-10 | Light Prescriptions Innovators, Llc | Circumferentially emitting luminaires and lens elements formed by transverse-axis profile-sweeps |
US7009213B2 (en) * | 2003-07-31 | 2006-03-07 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
US7070301B2 (en) | 2003-11-04 | 2006-07-04 | 3M Innovative Properties Company | Side reflector for illumination using light emitting diode |
US7090357B2 (en) * | 2003-12-23 | 2006-08-15 | 3M Innovative Properties Company | Combined light source for projection display |
US8174036B2 (en) * | 2003-12-30 | 2012-05-08 | Osram Opto Semiconductors Gmbh | Lighting device |
US7246923B2 (en) | 2004-02-11 | 2007-07-24 | 3M Innovative Properties Company | Reshaping light source modules and illumination systems using the same |
US7300177B2 (en) | 2004-02-11 | 2007-11-27 | 3M Innovative Properties | Illumination system having a plurality of light source modules disposed in an array with a non-radially symmetrical aperture |
US7427146B2 (en) | 2004-02-11 | 2008-09-23 | 3M Innovative Properties Company | Light-collecting illumination system |
JP3892030B2 (ja) * | 2004-02-26 | 2007-03-14 | 松下電器産業株式会社 | Led光源 |
US7101050B2 (en) | 2004-05-14 | 2006-09-05 | 3M Innovative Properties Company | Illumination system with non-radially symmetrical aperture |
US7390097B2 (en) | 2004-08-23 | 2008-06-24 | 3M Innovative Properties Company | Multiple channel illumination system |
KR100638657B1 (ko) | 2004-10-20 | 2006-10-30 | 삼성전기주식회사 | 양극성 측면 방출형 발광 다이오드 렌즈 및 이를 구비하는발광 다이오드 모듈 |
US20060091414A1 (en) * | 2004-10-29 | 2006-05-04 | Ouderkirk Andrew J | LED package with front surface heat extractor |
US7329982B2 (en) * | 2004-10-29 | 2008-02-12 | 3M Innovative Properties Company | LED package with non-bonded optical element |
JP4627177B2 (ja) * | 2004-11-10 | 2011-02-09 | スタンレー電気株式会社 | Ledの製造方法 |
US7462502B2 (en) * | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
US7419839B2 (en) * | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
TWI521748B (zh) * | 2005-02-18 | 2016-02-11 | 日亞化學工業股份有限公司 | 具備控制配光特性用之透鏡之發光裝置 |
CN101203965B (zh) * | 2005-06-23 | 2010-04-21 | 皇家飞利浦电子股份有限公司 | 发光设备和用于发光设备设计的方法 |
EP1920285A4 (en) | 2005-07-28 | 2010-11-03 | Light Prescriptions Innovators | OPEN-FREE LENTICULAR OPTICAL ELEMENTS AND THEIR APPLICATION TO CAPACITORS AND PROJECTORS |
JP2009503793A (ja) | 2005-07-28 | 2009-01-29 | ライト プレスクリプションズ イノベーターズ エルエルシー | バックライトおよびフロントライト用のエテンデュ保存型照明光学部品 |
US8631787B2 (en) | 2005-07-28 | 2014-01-21 | Light Prescriptions Innovators, Llc | Multi-junction solar cells with a homogenizer system and coupled non-imaging light concentrator |
US20070257271A1 (en) * | 2006-05-02 | 2007-11-08 | 3M Innovative Properties Company | Led package with encapsulated converging optical element |
US20070257270A1 (en) * | 2006-05-02 | 2007-11-08 | 3M Innovative Properties Company | Led package with wedge-shaped optical element |
US7390117B2 (en) * | 2006-05-02 | 2008-06-24 | 3M Innovative Properties Company | LED package with compound converging optical element |
US7525126B2 (en) | 2006-05-02 | 2009-04-28 | 3M Innovative Properties Company | LED package with converging optical element |
US7953293B2 (en) * | 2006-05-02 | 2011-05-31 | Ati Technologies Ulc | Field sequence detector, method and video device |
US20070258241A1 (en) * | 2006-05-02 | 2007-11-08 | 3M Innovative Properties Company | Led package with non-bonded converging optical element |
WO2008008994A2 (en) | 2006-07-14 | 2008-01-17 | Light Prescriptions Innovators, Llc | Brightness-enhancing film |
US20080012034A1 (en) * | 2006-07-17 | 2008-01-17 | 3M Innovative Properties Company | Led package with converging extractor |
WO2008022065A2 (en) | 2006-08-11 | 2008-02-21 | Light Prescriptions Innovators, Llc | Led luminance-enhancement and color-mixing by rotationally multiplexed beam-combining |
US8791631B2 (en) | 2007-07-19 | 2014-07-29 | Quarkstar Llc | Light emitting device |
DE102007049799A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
WO2009105198A2 (en) * | 2008-02-21 | 2009-08-27 | Light Prescriptions Innovators, Llc | Spherically emitting remote phosphor |
US20090273940A1 (en) | 2008-05-01 | 2009-11-05 | Cao Group, Inc. | LED lighting device |
CN102301181A (zh) * | 2009-02-17 | 2011-12-28 | 西尔欧集团 | 用于空间照明的led灯泡 |
JP5343831B2 (ja) * | 2009-04-16 | 2013-11-13 | 日亜化学工業株式会社 | 発光装置 |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
WO2012014758A1 (en) * | 2010-07-26 | 2012-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and lighting device |
CN101950789A (zh) * | 2010-08-06 | 2011-01-19 | 李晓锋 | 一种聚光led及其聚光结构 |
US20130126900A1 (en) * | 2010-08-09 | 2013-05-23 | Panasonic Corporation | Semiconductor light-emitting device |
EP2783398B1 (en) * | 2011-11-23 | 2017-10-04 | Quarkstar LLC | Light-emitting devices providing asymmetrical propagation of light |
KR20130107536A (ko) * | 2012-03-22 | 2013-10-02 | 삼성전자주식회사 | Led패키지 및 그 제조방법 |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
JP6553143B2 (ja) * | 2012-05-09 | 2019-07-31 | ローム株式会社 | 半導体発光装置 |
EP3392917B8 (en) | 2012-09-13 | 2024-04-03 | Quarkstar LLC | Light-emitting device with remote scattering element and total internal reflection extractor element |
US9915410B2 (en) | 2012-09-13 | 2018-03-13 | Quarkstar Llc | Light-emitting devices with reflective elements |
US9683710B2 (en) | 2013-03-07 | 2017-06-20 | Quarkstar Llc | Illumination device with multi-color light-emitting elements |
US9752757B2 (en) | 2013-03-07 | 2017-09-05 | Quarkstar Llc | Light-emitting device with light guide for two way illumination |
US10811576B2 (en) | 2013-03-15 | 2020-10-20 | Quarkstar Llc | Color tuning of light-emitting devices |
EP3022779B1 (en) * | 2013-07-19 | 2020-03-18 | Lumileds Holding B.V. | Pc led with optical element and without substrate carrier |
CN105723530B (zh) * | 2013-09-12 | 2019-07-16 | 夸克星有限责任公司 | 光发射装置和集成所述光发射装置的照明设备 |
US11107957B2 (en) * | 2019-03-08 | 2021-08-31 | Foshan Nationstar Optoelectronics Co., Ltd. | LED device and backlight module |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3964157A (en) * | 1974-10-31 | 1976-06-22 | Bell Telephone Laboratories, Incorporated | Method of mounting semiconductor chips |
FR2294549A1 (fr) * | 1974-12-09 | 1976-07-09 | Radiotechnique Compelec | Procede de realisation de dispositifs optoelectroniques |
DE2634264A1 (de) * | 1976-07-30 | 1978-02-02 | Licentia Gmbh | Halbleiter-lumineszenzbauelement |
US4165474A (en) * | 1977-12-27 | 1979-08-21 | Texas Instruments Incorporated | Optoelectronic displays using uniformly spaced arrays of semi-sphere light-emitting diodes |
US4267359A (en) * | 1978-05-04 | 1981-05-12 | Zoecon Corporation | Novel carboxylic acid esters |
JPS5586175A (en) * | 1978-12-22 | 1980-06-28 | Canon Inc | Photodiode |
JPS5925283A (ja) * | 1982-08-02 | 1984-02-09 | Toshiba Corp | 光半導体装置 |
JPS604275A (ja) * | 1983-06-22 | 1985-01-10 | Toshiba Corp | 半導体発光素子 |
DE8500013U1 (de) * | 1985-01-04 | 1985-04-25 | Siemens AG, 1000 Berlin und 8000 München | Optisches Sender- oder Detektorbauelement mit variabler Abstrahl- bzw. Empfangscharakteristik |
JPS61210685A (ja) * | 1985-03-15 | 1986-09-18 | Toshiba Corp | 光半導体装置 |
JPS61280676A (ja) * | 1985-06-05 | 1986-12-11 | Clarion Co Ltd | フオトセンサicの製造方法 |
JPS62144369A (ja) * | 1985-12-18 | 1987-06-27 | Mitsubishi Cable Ind Ltd | 光電変換装置 |
DE3719338A1 (de) * | 1987-06-10 | 1988-12-29 | Yue Wen Cheng | Leuchtdioden-anzeigevorrichtung |
-
1989
- 1989-08-29 US US07/399,832 patent/US5055892A/en not_active Expired - Lifetime
-
1990
- 1990-08-22 DE DE69016885T patent/DE69016885T2/de not_active Expired - Lifetime
- 1990-08-22 EP EP90309214A patent/EP0415640B1/en not_active Expired - Lifetime
- 1990-08-29 JP JP2227858A patent/JP2891525B2/ja not_active Expired - Lifetime
-
1995
- 1995-11-02 HK HK169395A patent/HK169395A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5055892A (en) | 1991-10-08 |
DE69016885D1 (de) | 1995-03-23 |
EP0415640A2 (en) | 1991-03-06 |
EP0415640B1 (en) | 1995-02-15 |
EP0415640A3 (en) | 1991-08-07 |
JP2891525B2 (ja) | 1999-05-17 |
DE69016885T2 (de) | 1995-06-08 |
JPH0397277A (ja) | 1991-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |