HK1215308A1 - Substrate processing apparatus, device manufacturing method, and cylindrical mask - Google Patents

Substrate processing apparatus, device manufacturing method, and cylindrical mask

Info

Publication number
HK1215308A1
HK1215308A1 HK16103220.8A HK16103220A HK1215308A1 HK 1215308 A1 HK1215308 A1 HK 1215308A1 HK 16103220 A HK16103220 A HK 16103220A HK 1215308 A1 HK1215308 A1 HK 1215308A1
Authority
HK
Hong Kong
Prior art keywords
processing apparatus
substrate processing
device manufacturing
cylindrical mask
mask
Prior art date
Application number
HK16103220.8A
Other languages
Chinese (zh)
Inventor
加藤正紀
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1215308A1 publication Critical patent/HK1215308A1/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/24Curved surfaces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70275Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704Scanned exposure beam, e.g. raster-, rotary- and vector scanning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
HK16103220.8A 2013-04-30 2016-03-18 Substrate processing apparatus, device manufacturing method, and cylindrical mask HK1215308A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013095647 2013-04-30
PCT/JP2014/058590 WO2014178244A1 (en) 2013-04-30 2014-03-26 Substrate processing apparatus, device manufacturing method, and cylindrical mask

Publications (1)

Publication Number Publication Date
HK1215308A1 true HK1215308A1 (en) 2016-08-19

Family

ID=51843379

Family Applications (3)

Application Number Title Priority Date Filing Date
HK18105549.5A HK1246405B (en) 2013-04-30 2016-03-18 Cylindrical mask
HK16103220.8A HK1215308A1 (en) 2013-04-30 2016-03-18 Substrate processing apparatus, device manufacturing method, and cylindrical mask
HK18104875.2A HK1245419B (en) 2013-04-30 2016-03-18 Cylindrical mask

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK18105549.5A HK1246405B (en) 2013-04-30 2016-03-18 Cylindrical mask

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK18104875.2A HK1245419B (en) 2013-04-30 2016-03-18 Cylindrical mask

Country Status (6)

Country Link
JP (5) JP6269660B2 (en)
KR (5) KR101979562B1 (en)
CN (4) CN108227408B (en)
HK (3) HK1246405B (en)
TW (5) TWI717946B (en)
WO (1) WO2014178244A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108227408B (en) * 2013-04-30 2020-02-14 株式会社尼康 Exposure apparatus and exposure method
KR102541913B1 (en) * 2016-03-30 2023-06-13 가부시키가이샤 니콘 The apparatus for drawing pattern, and the pattern imaging method and device manufacturing method
WO2017199658A1 (en) * 2016-05-19 2017-11-23 株式会社ニコン Substrate support device, exposure device, and patterning device
JP7047986B2 (en) * 2020-01-31 2022-04-05 日本精工株式会社 Manufacturing method of rotation angle sensor, electric power steering device and rotation angle sensor

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6019037U (en) * 1983-07-18 1985-02-08 株式会社リコー exposure equipment
JPH01128069A (en) * 1987-11-12 1989-05-19 Dainippon Screen Mfg Co Ltd Trialingly photographed image exposing device for slit scan exposure type copying camera
JPH01175730A (en) * 1987-12-29 1989-07-12 Matsushita Electric Ind Co Ltd Aligner
US5640227A (en) 1993-12-06 1997-06-17 Nikon Corporation Exposure apparatus and exposure method for minimizing defocusing of the transferred pattern
US6018383A (en) * 1997-08-20 2000-01-25 Anvik Corporation Very large area patterning system for flexible substrates
JP2000035677A (en) * 1998-07-17 2000-02-02 Adtec Engineeng:Kk Aligner
US6411362B2 (en) * 1999-01-04 2002-06-25 International Business Machines Corporation Rotational mask scanning exposure method and apparatus
AU2003211404A1 (en) * 2002-02-28 2003-09-09 Fujitsu Limited Dynamic pressure bearing manufacturing method, dynamic pressure bearing, and dynamic pressure bearing manufacturing device
JP2007227438A (en) 2006-02-21 2007-09-06 Nikon Corp Exposure apparatus and exposure method, and mask for light exposure
JP4984631B2 (en) 2006-04-28 2012-07-25 株式会社ニコン EXPOSURE APPARATUS AND METHOD, EXPOSURE MASK, AND DEVICE MANUFACTURING METHOD
WO2008029917A1 (en) * 2006-09-08 2008-03-13 Nikon Corporation Mask, exposure apparatus and device manufacturing method
JP2009026933A (en) * 2007-07-19 2009-02-05 Konica Minolta Holdings Inc Method of manufacturing electromagnetic wave shield film, and electromagnetic wave shield film
JP2009237305A (en) * 2008-03-27 2009-10-15 Mitsubishi Paper Mills Ltd Winding mechanism of mask pattern film and exposure apparatus
JP2011221536A (en) 2010-04-13 2011-11-04 Nikon Corp Mask moving device, exposure device, substrate processor and device manufacturing method
JP5724564B2 (en) * 2010-04-13 2015-05-27 株式会社ニコン Mask case, mask unit, exposure apparatus, substrate processing apparatus, and device manufacturing method
CN102834778A (en) * 2010-04-13 2012-12-19 株式会社尼康 Exposure apparatus, substrate processing apparatus, and device manufacturing method
JP2012252076A (en) 2011-06-01 2012-12-20 Nikon Corp Exposure apparatus
JP6056756B2 (en) * 2011-09-06 2017-01-11 株式会社ニコン Substrate processing apparatus and pattern exposure method
CN103477286A (en) * 2011-09-07 2013-12-25 株式会社尼康 Substrate processing device
CN103958379B (en) 2011-11-04 2016-12-28 株式会社尼康 Substrate board treatment and substrate processing method using same
TWI641915B (en) 2012-01-12 2018-11-21 尼康股份有限公司 Substrate processing apparatus, substrate processing method, and cylindrical mask
JP5594328B2 (en) * 2012-07-19 2014-09-24 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method.
KR101405251B1 (en) * 2012-09-10 2014-06-17 경북대학교 산학협력단 Lithography and apparatus for processing substrate using the same
CN108227408B (en) * 2013-04-30 2020-02-14 株式会社尼康 Exposure apparatus and exposure method

Also Published As

Publication number Publication date
JP2019074769A (en) 2019-05-16
KR20200019782A (en) 2020-02-24
CN105359040B (en) 2018-01-19
KR101924255B1 (en) 2018-11-30
TWI646407B (en) 2019-01-01
WO2014178244A1 (en) 2014-11-06
CN108227408B (en) 2020-02-14
KR101979562B1 (en) 2019-05-16
TWI610143B (en) 2018-01-01
JP6816814B2 (en) 2021-01-20
CN108227408A (en) 2018-06-29
JP2020064317A (en) 2020-04-23
KR20160003181A (en) 2016-01-08
CN107390480B (en) 2019-08-13
KR20190104256A (en) 2019-09-06
TWI681263B (en) 2020-01-01
TW201809909A (en) 2018-03-16
CN107255910B (en) 2019-04-02
JP2019070840A (en) 2019-05-09
KR102079793B1 (en) 2020-02-21
HK1245419B (en) 2019-11-29
TW201445262A (en) 2014-12-01
TW201908880A (en) 2019-03-01
KR102096961B1 (en) 2020-04-03
JPWO2014178244A1 (en) 2017-02-23
JP2018081320A (en) 2018-05-24
CN107255910A (en) 2017-10-17
JP6269660B2 (en) 2018-01-31
JP6638835B2 (en) 2020-01-29
CN107390480A (en) 2017-11-24
JP6662473B2 (en) 2020-03-11
KR102019620B1 (en) 2019-09-06
TWI677767B (en) 2019-11-21
HK1246405B (en) 2020-05-15
TW201907244A (en) 2019-02-16
CN105359040A (en) 2016-02-24
JP6485535B2 (en) 2019-03-20
TW202014807A (en) 2020-04-16
KR20180128521A (en) 2018-12-03
TWI717946B (en) 2021-02-01
KR20180128520A (en) 2018-12-03

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20220328