HK1245419B - Cylindrical mask - Google Patents

Cylindrical mask

Info

Publication number
HK1245419B
HK1245419B HK18104875.2A HK18104875A HK1245419B HK 1245419 B HK1245419 B HK 1245419B HK 18104875 A HK18104875 A HK 18104875A HK 1245419 B HK1245419 B HK 1245419B
Authority
HK
Hong Kong
Prior art keywords
cylindrical mask
mask
cylindrical
Prior art date
Application number
HK18104875.2A
Other languages
Chinese (zh)
Inventor
加藤正紀
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1245419B publication Critical patent/HK1245419B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Liquid Crystal (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK18104875.2A 2013-04-30 2016-03-18 Cylindrical mask HK1245419B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013095647 2013-04-30

Publications (1)

Publication Number Publication Date
HK1245419B true HK1245419B (en) 2019-11-29

Family

ID=51843379

Family Applications (3)

Application Number Title Priority Date Filing Date
HK16103220.8A HK1215308A1 (en) 2013-04-30 2016-03-18 Substrate processing apparatus, device manufacturing method, and cylindrical mask
HK18104875.2A HK1245419B (en) 2013-04-30 2016-03-18 Cylindrical mask
HK18105549.5A HK1246405B (en) 2013-04-30 2016-03-18 Cylindrical mask

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK16103220.8A HK1215308A1 (en) 2013-04-30 2016-03-18 Substrate processing apparatus, device manufacturing method, and cylindrical mask

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK18105549.5A HK1246405B (en) 2013-04-30 2016-03-18 Cylindrical mask

Country Status (6)

Country Link
JP (5) JP6269660B2 (en)
KR (5) KR101979562B1 (en)
CN (4) CN107390480B (en)
HK (3) HK1215308A1 (en)
TW (5) TWI677767B (en)
WO (1) WO2014178244A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101979562B1 (en) * 2013-04-30 2019-05-16 가부시키가이샤 니콘 Cylindrical mask
KR102541913B1 (en) * 2016-03-30 2023-06-13 가부시키가이샤 니콘 The apparatus for drawing pattern, and the pattern imaging method and device manufacturing method
KR102379193B1 (en) * 2016-05-19 2022-03-28 가부시키가이샤 니콘 Substrate support apparatus, exposure apparatus, and patterning apparatus
WO2021153097A1 (en) * 2020-01-31 2021-08-05 日本精工株式会社 Rotation angle sensor, electric power steering device, and production method for rotation angle sensor

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6019037U (en) * 1983-07-18 1985-02-08 株式会社リコー exposure equipment
JPH01128069A (en) * 1987-11-12 1989-05-19 Dainippon Screen Mfg Co Ltd Trialingly photographed image exposing device for slit scan exposure type copying camera
JPH01175730A (en) * 1987-12-29 1989-07-12 Matsushita Electric Ind Co Ltd Aligner
US5640227A (en) 1993-12-06 1997-06-17 Nikon Corporation Exposure apparatus and exposure method for minimizing defocusing of the transferred pattern
US6018383A (en) * 1997-08-20 2000-01-25 Anvik Corporation Very large area patterning system for flexible substrates
JP2000035677A (en) * 1998-07-17 2000-02-02 Adtec Engineeng:Kk Aligner
US6411362B2 (en) * 1999-01-04 2002-06-25 International Business Machines Corporation Rotational mask scanning exposure method and apparatus
WO2003072967A1 (en) * 2002-02-28 2003-09-04 Fujitsu Limited Dynamic pressure bearing manufacturing method, dynamic pressure bearing, and dynamic pressure bearing manufacturing device
JP2007227438A (en) * 2006-02-21 2007-09-06 Nikon Corp Exposure apparatus and exposure method, and mask for light exposure
JP4984631B2 (en) * 2006-04-28 2012-07-25 株式会社ニコン EXPOSURE APPARATUS AND METHOD, EXPOSURE MASK, AND DEVICE MANUFACTURING METHOD
WO2008029917A1 (en) * 2006-09-08 2008-03-13 Nikon Corporation Mask, exposure apparatus and device manufacturing method
JP2009026933A (en) * 2007-07-19 2009-02-05 Konica Minolta Holdings Inc Method of manufacturing electromagnetic wave shield film, and electromagnetic wave shield film
JP2009237305A (en) * 2008-03-27 2009-10-15 Mitsubishi Paper Mills Ltd Winding mechanism of mask pattern film and exposure apparatus
JPWO2011129369A1 (en) * 2010-04-13 2013-07-18 株式会社ニコン Exposure apparatus, substrate processing apparatus, and device manufacturing method
JP2011221536A (en) * 2010-04-13 2011-11-04 Nikon Corp Mask moving device, exposure device, substrate processor and device manufacturing method
JP5724564B2 (en) * 2010-04-13 2015-05-27 株式会社ニコン Mask case, mask unit, exposure apparatus, substrate processing apparatus, and device manufacturing method
JP2012252076A (en) * 2011-06-01 2012-12-20 Nikon Corp Exposure apparatus
JP6056756B2 (en) * 2011-09-06 2017-01-11 株式会社ニコン Substrate processing apparatus and pattern exposure method
WO2013035661A1 (en) * 2011-09-07 2013-03-14 株式会社ニコン Substrate processing device
KR101623695B1 (en) * 2011-11-04 2016-05-23 가부시키가이샤 니콘 Substrate processing apparatus and substrate processing method
TWI641915B (en) * 2012-01-12 2018-11-21 尼康股份有限公司 Substrate processing apparatus, substrate processing method, and cylindrical mask
JP5594328B2 (en) * 2012-07-19 2014-09-24 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method.
KR101405251B1 (en) * 2012-09-10 2014-06-17 경북대학교 산학협력단 Lithography and apparatus for processing substrate using the same
KR101979562B1 (en) * 2013-04-30 2019-05-16 가부시키가이샤 니콘 Cylindrical mask

Also Published As

Publication number Publication date
KR101924255B1 (en) 2018-11-30
CN108227408A (en) 2018-06-29
KR20200019782A (en) 2020-02-24
JP6269660B2 (en) 2018-01-31
WO2014178244A1 (en) 2014-11-06
KR20180128521A (en) 2018-12-03
JPWO2014178244A1 (en) 2017-02-23
KR20180128520A (en) 2018-12-03
JP6816814B2 (en) 2021-01-20
KR20160003181A (en) 2016-01-08
JP2019074769A (en) 2019-05-16
JP6638835B2 (en) 2020-01-29
JP2019070840A (en) 2019-05-09
CN107255910B (en) 2019-04-02
KR20190104256A (en) 2019-09-06
TW201445262A (en) 2014-12-01
CN107390480A (en) 2017-11-24
TWI646407B (en) 2019-01-01
HK1246405B (en) 2020-05-15
TWI681263B (en) 2020-01-01
CN107255910A (en) 2017-10-17
TW201809909A (en) 2018-03-16
KR101979562B1 (en) 2019-05-16
TWI610143B (en) 2018-01-01
HK1215308A1 (en) 2016-08-19
KR102096961B1 (en) 2020-04-03
CN105359040B (en) 2018-01-19
CN105359040A (en) 2016-02-24
JP2018081320A (en) 2018-05-24
CN108227408B (en) 2020-02-14
TW201907244A (en) 2019-02-16
TW202014807A (en) 2020-04-16
KR102079793B1 (en) 2020-02-21
JP6485535B2 (en) 2019-03-20
JP6662473B2 (en) 2020-03-11
JP2020064317A (en) 2020-04-23
KR102019620B1 (en) 2019-09-06
CN107390480B (en) 2019-08-13
TWI717946B (en) 2021-02-01
TWI677767B (en) 2019-11-21
TW201908880A (en) 2019-03-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230325