HK1215307A1 - Substrate processing apparatus, device manufacturing method, scanning exposure method, exposure apparatus, device manufacturing system, and device manufacturing method - Google Patents

Substrate processing apparatus, device manufacturing method, scanning exposure method, exposure apparatus, device manufacturing system, and device manufacturing method

Info

Publication number
HK1215307A1
HK1215307A1 HK16103193.1A HK16103193A HK1215307A1 HK 1215307 A1 HK1215307 A1 HK 1215307A1 HK 16103193 A HK16103193 A HK 16103193A HK 1215307 A1 HK1215307 A1 HK 1215307A1
Authority
HK
Hong Kong
Prior art keywords
device manufacturing
exposure
substrate processing
processing apparatus
scanning exposure
Prior art date
Application number
HK16103193.1A
Other languages
Chinese (zh)
Inventor
加藤正紀
鈴木智也
鬼頭義昭
堀正和
林田洋祐
木內徹
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1215307A1 publication Critical patent/HK1215307A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
HK16103193.1A 2013-04-18 2016-03-18 Substrate processing apparatus, device manufacturing method, scanning exposure method, exposure apparatus, device manufacturing system, and device manufacturing method HK1215307A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013087650 2013-04-18
JP2013154965 2013-07-25
PCT/JP2014/058109 WO2014171270A1 (en) 2013-04-18 2014-03-24 Substrate processing apparatus, device manufacturing method, scanning exposure method, exposure apparatus, device manufacturing system, and device manufacturing method

Publications (1)

Publication Number Publication Date
HK1215307A1 true HK1215307A1 (en) 2016-08-19

Family

ID=51731223

Family Applications (2)

Application Number Title Priority Date Filing Date
HK18114874.2A HK1255723A1 (en) 2013-04-18 2016-03-18 Scanning exposure apparatus
HK16103193.1A HK1215307A1 (en) 2013-04-18 2016-03-18 Substrate processing apparatus, device manufacturing method, scanning exposure method, exposure apparatus, device manufacturing system, and device manufacturing method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK18114874.2A HK1255723A1 (en) 2013-04-18 2016-03-18 Scanning exposure apparatus

Country Status (6)

Country Link
JP (4) JP6269658B2 (en)
KR (5) KR101956973B1 (en)
CN (4) CN106933066B (en)
HK (2) HK1255723A1 (en)
TW (4) TWI672568B (en)
WO (1) WO2014171270A1 (en)

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CN108885289B (en) * 2016-03-04 2021-09-03 应用材料公司 Wire grid polarizer manufacturing method
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
CN106950801A (en) * 2017-04-16 2017-07-14 合肥芯碁微电子装备有限公司 A kind of rapid edge exposure method without mask laser direct-write photoetching equipment
WO2019138940A1 (en) * 2018-01-10 2019-07-18 凸版印刷株式会社 Photomask
JP7232586B2 (en) * 2018-07-31 2023-03-03 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
JP7358970B2 (en) * 2018-12-26 2023-10-11 株式会社デンソーウェーブ optical information reader
CN109760407A (en) * 2019-03-09 2019-05-17 深圳市正鑫源实业有限公司 The control method and its letterpress system of intelligent letterpress force of impression
US10880528B1 (en) * 2019-10-31 2020-12-29 Christie Digital Systems Usa, Inc. Device, system and method for modulating light using a phase light modulator and a spatial light modulator
TWI724867B (en) * 2020-04-16 2021-04-11 光群雷射科技股份有限公司 Manufacturing method of transfer type roller and transfer type roller
CN111510141B (en) * 2020-06-03 2023-09-15 江苏集萃微纳自动化系统与装备技术研究所有限公司 Physical package of miniature atomic clock and miniature atomic clock
CN111965954B (en) * 2020-09-09 2022-12-30 中国科学院光电技术研究所 Exposure device with mask and substrate rotating coaxially relatively

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Also Published As

Publication number Publication date
KR20150143741A (en) 2015-12-23
JP6773168B2 (en) 2020-10-21
KR102204689B1 (en) 2021-01-19
TW201945865A (en) 2019-12-01
JP6269658B2 (en) 2018-01-31
TWI672568B (en) 2019-09-21
JP6380583B2 (en) 2018-08-29
CN108710263A (en) 2018-10-26
KR20190133074A (en) 2019-11-29
CN105339846B (en) 2018-06-12
TWI640841B (en) 2018-11-11
JP6515993B2 (en) 2019-05-22
CN108710263B (en) 2021-01-26
WO2014171270A1 (en) 2014-10-23
CN107908083A (en) 2018-04-13
CN105339846A (en) 2016-02-17
KR20190021483A (en) 2019-03-05
HK1255723A1 (en) 2019-08-23
KR20200078679A (en) 2020-07-01
TW201447501A (en) 2014-12-16
CN107908083B (en) 2020-09-18
KR102005701B1 (en) 2019-07-30
TWI707211B (en) 2020-10-11
KR102062509B1 (en) 2020-01-03
KR101956973B1 (en) 2019-06-24
CN106933066A (en) 2017-07-07
TW201901309A (en) 2019-01-01
TWI610142B (en) 2018-01-01
CN106933066B (en) 2018-10-23
JP2019135554A (en) 2019-08-15
JP2018081321A (en) 2018-05-24
KR102126981B1 (en) 2020-06-25
JPWO2014171270A1 (en) 2017-02-23
JP2017102489A (en) 2017-06-08
KR20190089237A (en) 2019-07-30
TW201804264A (en) 2018-02-01

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Legal Events

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PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230328