HK1209440A1 - Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication - Google Patents

Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication Download PDF

Info

Publication number
HK1209440A1
HK1209440A1 HK15110192.8A HK15110192A HK1209440A1 HK 1209440 A1 HK1209440 A1 HK 1209440A1 HK 15110192 A HK15110192 A HK 15110192A HK 1209440 A1 HK1209440 A1 HK 1209440A1
Authority
HK
Hong Kong
Prior art keywords
group
radiation curable
liquid radiation
component
curable composition
Prior art date
Application number
HK15110192.8A
Other languages
English (en)
Chinese (zh)
Inventor
何明波
貝斯．郎德特
贝斯．郎德特
任康太
卡洛琳．劉
卡洛琳．刘
李泰淵
李泰渊
Original Assignee
斯特塔西斯有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51845350&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1209440(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 斯特塔西斯有限公司 filed Critical 斯特塔西斯有限公司
Publication of HK1209440A1 publication Critical patent/HK1209440A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/02—Emulsion paints including aerosols
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0088—Blends of polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
    • B29K2105/246—Uncured, e.g. green
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
    • B29K2509/02—Ceramics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Composite Materials (AREA)
  • Structural Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
HK15110192.8A 2013-11-05 2015-10-16 Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication HK1209440A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361900044P 2013-11-05 2013-11-05
US61/900,044 2013-11-05
US201462074735P 2014-11-04 2014-11-04
US62/074,735 2014-11-04

Publications (1)

Publication Number Publication Date
HK1209440A1 true HK1209440A1 (en) 2016-04-01

Family

ID=51845350

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15110192.8A HK1209440A1 (en) 2013-11-05 2015-10-16 Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication

Country Status (5)

Country Link
US (7) US9228073B2 (https=)
EP (4) EP4491679A3 (https=)
JP (1) JP6056032B2 (https=)
CN (2) CN104610511B (https=)
HK (1) HK1209440A1 (https=)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6056032B2 (ja) * 2013-11-05 2017-01-11 ディーエスエム アイピー アセッツ ビー．ブイ． 付加造形用の安定化マトリックス充填液状放射線硬化性樹脂組成物
CN105643924A (zh) * 2014-11-25 2016-06-08 南京百川行远激光科技有限公司 蓝光光固化3d打印笔
US10974455B2 (en) * 2015-05-07 2021-04-13 Lg Chem, Ltd. 3D printer
JP2018517034A (ja) * 2015-06-08 2018-06-28 ディーエスエム アイピー アセッツ ビー．ブイ． 付加造形用液状ハイブリッドＵＶ／ｖｉｓ線硬化性樹脂組成物
CA2988827C (en) * 2015-06-16 2023-08-22 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Epoxy resin composition
CN108027558B (zh) * 2015-10-01 2022-03-25 科思创(荷兰)有限公司 用于加成法制造的液体、混杂的可紫外/可见光辐射固化树脂组合物
EP3377291B1 (en) 2015-11-17 2021-11-03 Covestro (Netherlands) B.V. Improved antimony-free radiation curable compositions for additive fabrication, and applications thereof in investment casting processes
JP6603127B2 (ja) * 2015-12-29 2019-11-06 サンアプロ株式会社 感光性組成物
EP3397426B1 (en) 2015-12-30 2021-06-23 3M Innovative Properties Company Abrasive articles and related methods
EP3397711B1 (en) * 2015-12-30 2023-02-15 3M Innovative Properties Company Dual stage structural bonding adhesive
CN108472786B (zh) 2015-12-30 2021-07-27 3M创新有限公司 磨料制品
CN108367492B (zh) * 2016-02-25 2020-03-06 惠普发展公司，有限责任合伙企业 使用烧结助剂/固定剂流体和液体功能材料的三维(3d)打印
CN108778688B (zh) * 2016-03-14 2022-05-13 科思创(荷兰)有限公司 具有改善韧性耐高温性的加成法制造用可辐射固化组合物
KR102142430B1 (ko) * 2016-09-07 2020-08-07 애경화학 주식회사 양이온경화 및 자외선경화 메커니즘을 동시에 가지는 지환족 에폭시 아크릴계 화합물
JP6774020B2 (ja) * 2016-09-29 2020-10-21 セイコーエプソン株式会社 三次元造形物の製造装置及び三次元造形物の製造方法
US10737984B2 (en) * 2016-11-30 2020-08-11 Hrl Laboratories, Llc Formulations and methods for 3D printing of ceramic matrix composites
WO2018119067A1 (en) * 2016-12-20 2018-06-28 Basf Se Photopolymer ceramic dispersion
TW201840510A (zh) * 2016-12-20 2018-11-16 德商巴地斯顏料化工廠 用於積層製造(additive fabrication)的光聚合物陶瓷分散液
US11421119B2 (en) 2017-01-12 2022-08-23 Konica Minolta, Inc. Resin composition, and three-dimensional moulding production method
JP7068270B2 (ja) * 2017-03-06 2022-05-16 マクセル株式会社 モデル材インクセット、サポート材組成物、インクセット、立体造形物および立体造形物の製造方法
US11274169B2 (en) * 2017-05-14 2022-03-15 Collider, Inc. Synthetic resin composition and method for hybrid manufacturing
US11097449B2 (en) 2017-05-17 2021-08-24 Formlabs, Inc. Techniques for casting from additively fabricated molds and related systems and methods
US10590042B2 (en) * 2017-06-29 2020-03-17 Hrl Laboratories, Llc Photopolymer resins with solid and liquid phases for polymer-derived ceramics
CA3069982C (en) * 2017-07-21 2023-08-01 Saint-Gobain Performance Plastics Corporation Method of forming a three-dimensional body
JP7115491B2 (ja) * 2017-09-22 2022-08-09 コニカミノルタ株式会社 樹脂組成物、およびこれを用いた立体造形物の製造方法、ならびに立体造形物
CN111788269B (zh) 2017-12-15 2023-10-20 科思创(荷兰)有限公司 用于高温喷射粘性热固性材料以经由增材制造创建固体制品的组合物和方法
JP6987355B2 (ja) * 2017-12-22 2021-12-22 日本電気硝子株式会社 立体造形用樹脂組成物
EP3732021A1 (en) * 2017-12-29 2020-11-04 DSM IP Assets B.V. Compositions and articles for additive fabrication and methods of using the same
WO2019167895A1 (ja) * 2018-03-01 2019-09-06 コニカミノルタ株式会社 樹脂組成物、およびこれを用いた立体造形物の製造方法、ならびに立体造形物
MX2020009963A (es) * 2018-03-28 2020-10-12 Henkel IP & Holding GmbH Composiciones fotocurables y metodo para formar caracteristicas topograficas en la superficie de una membrana al usar composiciones fotocurables.
EP4095603A1 (en) 2018-04-20 2022-11-30 Covestro (Netherlands) B.V. Method of producing a three-dimensional part via an additive fabrication process
KR20210005707A (ko) 2018-05-03 2021-01-14 디에스엠 아이피 어셋츠 비.브이. 적층 제조를 통하여 생성된 광-제작된 물품을 후처리하는 방법
DE102018006397A1 (de) * 2018-08-15 2020-02-20 DP Polar GmbH Verfahren zum Herstellen eines dreidimensionalen Formgegenstands mittels schichtweisem Materialauftrag
WO2020085912A1 (en) 2018-10-26 2020-04-30 Dsm Ip Assets B.V. Polyester powders and the use thereof in three-dimensional printing processes
CN109517340B (zh) * 2018-11-21 2021-03-23 中山大简科技有限公司 一种耐温透明3d打印用光敏树脂
US20220017773A1 (en) 2018-12-03 2022-01-20 Ms Holding B.V. Filled radiation curable compositions for coating optical fiber and the coatings produced therefrom
EP3946946A4 (en) * 2019-03-28 2022-08-31 Henkel AG & Co. KGaA LIGHT-CURING COMPOSITIONS FOR ADDITIONAL MANUFACTURING
WO2020213606A1 (ja) 2019-04-17 2020-10-22 キヤノン株式会社 光造形用樹脂組成物及び立体造形物
CN110041011A (zh) * 2019-05-28 2019-07-23 四川益好优科环保科技有限公司 一种高无机物填充的辐射交联聚乙烯醇材料及制备方法
TW202110899A (zh) * 2019-07-11 2021-03-16 德商夸茲沃克公司 用於3d列印的樹脂組合物
WO2021077065A1 (en) * 2019-10-17 2021-04-22 Molecule Corp. Additive manufacturing method to achieve three dimensional parts having superior properties
CN111233493A (zh) * 2020-01-17 2020-06-05 中国科学院金属研究所 一种熔模铸造用光固化硅基陶瓷型芯素坯烧结方法
CN111170730B (zh) * 2020-01-17 2021-07-23 中国科学院金属研究所 一种熔模铸造光固化用硅基陶瓷型芯浆料配制方法
KR102780988B1 (ko) 2020-02-04 2025-03-17 캐보트 코포레이션 액체-기반 적층 제조를 위한 조성물
CN111348906A (zh) * 2020-02-10 2020-06-30 中国科学院金属研究所 一种熔模铸造用光固化硅基陶瓷型芯素坯脱脂方法
CN116034117A (zh) 2020-07-24 2023-04-28 应用材料公司 具有用于uv-led固化的基于硫醇的交联剂的量子点配方
US11942576B2 (en) 2020-08-28 2024-03-26 Applied Materials, Inc. Blue color converter for micro LEDs
US11646397B2 (en) 2020-08-28 2023-05-09 Applied Materials, Inc. Chelating agents for quantum dot precursor materials in color conversion layers for micro-LEDs
US11404612B2 (en) 2020-08-28 2022-08-02 Applied Materials, Inc. LED device having blue photoluminescent material and red/green quantum dots
DE102020127603A1 (de) 2020-10-20 2022-04-21 Kurtz Gmbh Verfahren und Vorrichtung zum Gießen eines metallenen Gussteils mittels eines Sandkernes
WO2022090342A1 (en) 2020-10-28 2022-05-05 Covestro (Netherlands) Bv (meth)acrylate-functional radiation curable compositions for additive fabrication
US12415906B2 (en) 2021-02-09 2025-09-16 Illumina, Inc. Resin composition and flow cells incorporating the same
KR20230148344A (ko) * 2021-02-25 2023-10-24 바스프 에스이 코팅, 2d 물체 형성 및 3d 프린팅을 위한 광중합성 액체 및 에폭시 전구체를 포함하는 경화성 조성물
CN115247023B (zh) * 2021-04-25 2023-04-25 宁波安特弗新材料科技有限公司 一种光固化组合物及一种硬涂膜
KR20240011146A (ko) * 2021-04-27 2024-01-25 오티아이 루미오닉스 인크. 방출 영역 사이의 em 방사선 투과 영역을 포함하는 광전자 장치
EP4352136A1 (en) 2021-06-11 2024-04-17 Stratasys, Inc. Methods of making biodegradable and/or compostable biobased powders for additive manufacturing
US20230392027A1 (en) * 2022-06-06 2023-12-07 3M Innovative Properties Company Abrasion-resistant thermoformable coating and preparation of same

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575330A (en) 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
US5047568A (en) 1988-11-18 1991-09-10 International Business Machines Corporation Sulfonium salts and use and preparation thereof
US5626919A (en) 1990-03-01 1997-05-06 E. I. Du Pont De Nemours And Company Solid imaging apparatus and method with coating station
DE4225309A1 (de) 1992-07-31 1994-02-03 Roehm Gmbh Suspension für die Herstellung gefüllter Gießharze
US5380923A (en) 1993-04-29 1995-01-10 Minnesota Mining And Manufacturing Company Polymeric sulfonium salts and method of preparation thereof
US5648407A (en) 1995-05-16 1997-07-15 Minnesota Mining And Manufacturing Company Curable resin sols and fiber-reinforced composites derived therefrom
US5665792A (en) 1995-06-07 1997-09-09 E. I. Du Pont De Nemours And Company Stabilizers for use with photoacid precursor formulations
GB9522656D0 (en) 1995-11-04 1996-01-03 Zeneca Ltd Mould
ATE208703T1 (de) 1995-12-22 2001-11-15 Vantico Ag Verfahren zur stereolithografischen herstellung von dreidimensionalen gegenständen durch gebrauch eines strahlungshärtenden harzes mit füllstoff
KR100491736B1 (ko) 1996-07-29 2005-09-09 반티코 아게 입체리토그래피용방사선-경화성액체조성물
US20020045126A1 (en) 1996-09-20 2002-04-18 Tsuyoshi Watanabe Photo-curable resin compositions and process for preparing a resin-based mold
JPH1087963A (ja) 1996-09-20 1998-04-07 Japan Synthetic Rubber Co Ltd 樹脂組成物および繊維質材料成形型
JP3820289B2 (ja) 1996-09-20 2006-09-13 Ｊｓｒ株式会社 樹脂製成形用型製造用光硬化性樹脂組成物および樹脂製成形用型の製造方法
AU744727B2 (en) 1997-07-21 2002-02-28 Vantico Ag Sedimentation stabilized radiation-curable filled compositions
WO1999005572A2 (en) * 1997-07-21 1999-02-04 Ciba Specialty Chemicals Holding Inc. Viscosity stabilization of radiation-curable compositions
JP4204113B2 (ja) 1997-12-04 2009-01-07 株式会社Ａｄｅｋａ 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法
US6287745B1 (en) 1998-02-18 2001-09-11 Dsm N.V. Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound
US20030207959A1 (en) 2000-03-13 2003-11-06 Eduardo Napadensky Compositions and methods for use in three dimensional model printing
EP1236765A1 (de) 2001-02-28 2002-09-04 hanse chemie GmbH Siliciumdioxiddispersion
US6833231B2 (en) * 2002-07-31 2004-12-21 3D Systems, Inc. Toughened stereolithographic resin compositions
JP5131888B2 (ja) 2002-09-25 2013-01-30 株式会社Ａｄｅｋａ 新規な芳香族スルホニウム塩化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光学的立体造形用樹脂組成物並びに光学的立体造形法
US20040077745A1 (en) 2002-10-18 2004-04-22 Jigeng Xu Curable compositions and rapid prototyping process using the same
US6742456B1 (en) 2002-11-14 2004-06-01 Hewlett-Packard Development Company, L.P. Rapid prototyping material systems
AU2003303482A1 (en) 2002-12-23 2004-07-22 Aprilis, Inc. Fluoroarylsulfonium photoacid generators
EP1646493B1 (en) * 2003-07-23 2011-11-16 DSM IP Assets B.V. Viscosity reducible radiation curable resin composition
US20050040562A1 (en) * 2003-08-19 2005-02-24 3D Systems Inc. Nanoparticle-filled stereolithographic resins
US7230122B2 (en) 2003-11-04 2007-06-12 National Starch And Chemical Investment Holding Corporation Sulfonium salt photinitiators and use thereof
US20050101684A1 (en) * 2003-11-06 2005-05-12 Xiaorong You Curable compositions and rapid prototyping process using the same
JP2007513234A (ja) * 2003-12-02 2007-05-24 ディーエスエム アイピー アセッツ ビー．ブイ． 難燃性の放射線硬化性組成物
US7323248B2 (en) * 2004-03-13 2008-01-29 Ecology Coatings, Inc. Environmentally friendly coating compositions for coating composites, coated composites therefrom, and methods, processes and assemblages for coating thereof
US7591865B2 (en) * 2005-01-28 2009-09-22 Saint-Gobain Abrasives, Inc. Method of forming structured abrasive article
CN101277991B (zh) * 2005-09-29 2011-11-09 Cmet公司 用于立体平版印刷术的树脂组合物
EP1941322B1 (en) * 2005-10-27 2018-05-30 3D Systems, Inc. Antimony-free photocurable resin composition and three dimensional article
US7678528B2 (en) 2005-11-16 2010-03-16 Az Electronic Materials Usa Corp. Photoactive compounds
EP2019975B1 (en) * 2006-05-01 2017-08-16 DSM IP Assets B.V. Radiation curable resin composition and rapid three dimensional imaging process using the same
US8354160B2 (en) * 2006-06-23 2013-01-15 3M Innovative Properties Company Articles having durable hydrophobic surfaces
US20080081020A1 (en) * 2006-10-03 2008-04-03 Huang Yeong H Color change surgical prep solution
JP5304977B2 (ja) 2007-10-04 2013-10-02 セイコーエプソン株式会社 光硬化組成物を用いた硬化物の形成方法およびその硬化物
BRPI0816605A2 (pt) * 2007-10-10 2015-03-03 Ppg Ind Ohio Inc Composição de revestimento curável por radiação, revestimento curado por radiação e método para revestir um substrato
EP2218715B1 (en) 2007-11-28 2017-06-28 Sumitomo Seika Chemicals CO. LTD. Photoacid generator and photoreactive composition
JP5208573B2 (ja) 2008-05-06 2013-06-12 サンアプロ株式会社 スルホニウム塩、光酸発生剤、光硬化性組成物及びこの硬化体
EP2349993B1 (en) 2008-10-20 2012-12-12 Basf Se Sulfonium derivatives and the use therof as latent acids
CN102317258B (zh) 2009-02-20 2014-06-04 三亚普罗股份有限公司 锍盐、光酸产生剂及光敏性树脂组合物
JP5849350B2 (ja) * 2009-12-17 2016-01-27 ディーエスエム アイピー アセッツ ビー．ブイ． 基材を用いた積層造形法
KR101429038B1 (ko) * 2009-12-29 2014-09-22 생-고뱅 어브레이시브즈, 인코포레이티드 내구성이 우수한 연마포지 용품
JP2013525842A (ja) * 2010-04-23 2013-06-20 ジョンソン・アンド・ジョンソン・ビジョン・ケア・インコーポレイテッド レンズ回転の改善方法
EP2842980B1 (en) * 2013-08-09 2021-05-05 DSM IP Assets B.V. Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing
JP6056032B2 (ja) 2013-11-05 2017-01-11 ディーエスエム アイピー アセッツ ビー．ブイ． 付加造形用の安定化マトリックス充填液状放射線硬化性樹脂組成物

Also Published As

Publication number Publication date
US10526469B2 (en) 2020-01-07
CN109503761A (zh) 2019-03-22
US20170283580A9 (en) 2017-10-05
US12269933B2 (en) 2025-04-08
US20150125702A1 (en) 2015-05-07
US20200102442A1 (en) 2020-04-02
US20170145184A1 (en) 2017-05-25
CN104610511A (zh) 2015-05-13
EP4491679A3 (en) 2025-02-19
CN109503761B (zh) 2022-02-01
US9228073B2 (en) 2016-01-05
EP3971235A1 (en) 2022-03-23
US20240076471A1 (en) 2024-03-07
US20210189097A1 (en) 2021-06-24
EP2868692B1 (en) 2017-10-25
US11840618B2 (en) 2023-12-12
US20220185987A1 (en) 2022-06-16
EP2868692A1 (en) 2015-05-06
EP3266815B1 (en) 2021-11-03
JP6056032B2 (ja) 2017-01-11
CN104610511B (zh) 2018-11-16
EP3266815A1 (en) 2018-01-10
EP2868692B2 (en) 2025-07-16
JP2015089943A (ja) 2015-05-11
EP3971235B1 (en) 2025-01-01
US20180265669A1 (en) 2018-09-20
US9951198B2 (en) 2018-04-24
EP4491679A2 (en) 2025-01-15

Similar Documents

Publication Publication Date Title
CN109503761B (zh) 用于加成制造的稳定的基质填充的液体可辐射固化树脂组合物
JP6414411B2 (ja) 積層造形用の低粘度液状放射線硬化型歯科アライナー成形型用樹脂組成物
CN102858738B (zh) 用于加成法制造的包含三芳基锍硼酸盐阳离子光引发剂的液体可辐射固化树脂
US12296528B2 (en) Compositions and articles for additive fabrication and methods of using the same in particle image velocimetry testing
US20220134641A1 (en) Radiation curable compositions for additive fabrication with improved toughness and high temperature resistance