HK1207920A1 - Workpiece holder and method using same for detecting lateral displacement of workpiece - Google Patents

Workpiece holder and method using same for detecting lateral displacement of workpiece

Info

Publication number
HK1207920A1
HK1207920A1 HK15108491.0A HK15108491A HK1207920A1 HK 1207920 A1 HK1207920 A1 HK 1207920A1 HK 15108491 A HK15108491 A HK 15108491A HK 1207920 A1 HK1207920 A1 HK 1207920A1
Authority
HK
Hong Kong
Prior art keywords
workpiece
same
lateral displacement
detecting lateral
holder
Prior art date
Application number
HK15108491.0A
Other languages
English (en)
Chinese (zh)
Inventor
菅原利文
金銀善
辰己良昭
Original Assignee
Creative Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Tech Corp filed Critical Creative Tech Corp
Publication of HK1207920A1 publication Critical patent/HK1207920A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/002—Constructional details of contacts for gauges actuating one or more contacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/003—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring position, not involving coordinate determination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
HK15108491.0A 2012-10-11 2015-08-31 Workpiece holder and method using same for detecting lateral displacement of workpiece HK1207920A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012225830 2012-10-11
PCT/JP2013/076737 WO2014057843A1 (fr) 2012-10-11 2013-10-01 Porte-pièce et procédé utilisant celui-ci pour détecter un décalage latéral d'une pièce

Publications (1)

Publication Number Publication Date
HK1207920A1 true HK1207920A1 (en) 2016-02-12

Family

ID=50477310

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15108491.0A HK1207920A1 (en) 2012-10-11 2015-08-31 Workpiece holder and method using same for detecting lateral displacement of workpiece

Country Status (7)

Country Link
US (1) US9689656B2 (fr)
JP (1) JP6128400B2 (fr)
KR (1) KR102143448B1 (fr)
CN (1) CN104737282B (fr)
HK (1) HK1207920A1 (fr)
TW (1) TWI597793B (fr)
WO (1) WO2014057843A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014057843A1 (fr) * 2012-10-11 2014-04-17 株式会社クリエイティブ テクノロジー Porte-pièce et procédé utilisant celui-ci pour détecter un décalage latéral d'une pièce
CN105215760B (zh) 2015-09-23 2018-06-26 京东方科技集团股份有限公司 对位装置、对位检测方法及对位系统
US10276455B2 (en) * 2016-07-29 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for measurement of semiconductor device fabrication tool implement
US9967988B1 (en) * 2016-11-04 2018-05-08 Henge Docks Llc Retention system for an electronic device
JP6948873B2 (ja) * 2017-07-31 2021-10-13 東京エレクトロン株式会社 測定器を較正する方法、及び、ケース
CN108489369B (zh) * 2018-05-22 2023-08-15 天津普天单向器有限公司 一种圆弧位置监测装置及监测方法
US11670531B2 (en) 2019-04-25 2023-06-06 Meta Platforms Technologies, Llc Bridge pick-up head for transferring semiconductor devices
CN112309889B (zh) * 2019-08-02 2024-07-23 合肥晶合集成电路股份有限公司 一种基板检测装置及其检测方法
US11756810B1 (en) * 2019-12-27 2023-09-12 Meta Platforms Technologies, Llc Detection of force applied by pick-up tool for transferring semiconductor devices

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DE3788773T2 (de) * 1986-09-09 1994-08-04 Hitachi Construction Machinery Vorrichtung zur Feinverstellung und Vorrichtung zum Steuern dieser Verstellungen.
US5351412A (en) * 1991-06-11 1994-10-04 International Business Machines Corporation Micro positioning device
US5794080A (en) * 1994-08-31 1998-08-11 Nikon Corporation Piezoelectric vibration angular velocity meter and camera using the same
JPH09330975A (ja) 1996-06-11 1997-12-22 Nikon Corp 搬送装置
EP0866375A3 (fr) 1997-03-17 2000-05-24 Nikon Corporation Dispositif de positionnement d'un article et appareil d'exposition muni de celui-ci
JPH10256356A (ja) * 1997-03-17 1998-09-25 Nikon Corp 位置決め装置及び該装置を備えた露光装置
US6075375A (en) * 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
JPH1187228A (ja) 1997-09-01 1999-03-30 Nikon Corp 露光装置及び露光方法
JP4193264B2 (ja) 1999-02-04 2008-12-10 日新イオン機器株式会社 監視回路付基板保持装置
US6828806B1 (en) 1999-07-22 2004-12-07 Sumitomo Metal Industries, Ltd. Electrostatic capacitance sensor, electrostatic capacitance sensor component, object mounting body and object mounting apparatus
US6417743B1 (en) * 1999-09-21 2002-07-09 Rockwell Science Center, Llc Micro electromechanical isolator
US6618120B2 (en) * 2001-10-11 2003-09-09 Nikon Corporation Devices and methods for compensating for tilting of a leveling table in a microlithography apparatus
WO2003075343A1 (fr) * 2002-03-05 2003-09-12 Sharp Kabushiki Kaisha Procede visant a maintenir un substrat sous vide, procede de fabrication d'un dispositif d'affichage a cristaux liquides, et dispositif de support de substrat
JP2003303875A (ja) 2002-04-08 2003-10-24 Tamura Seisakusho Co Ltd 精密加工用ステージ装置
CN100510667C (zh) * 2004-07-02 2009-07-08 阿尔卑斯电气株式会社 玻璃衬底和使用了该玻璃衬底的静电电容式压力传感器
US20140163664A1 (en) * 2006-11-21 2014-06-12 David S. Goldsmith Integrated system for the ballistic and nonballistic infixion and retrieval of implants with or without drug targeting
JP4967780B2 (ja) * 2007-04-20 2012-07-04 セイコーエプソン株式会社 座標入力装置及び表示装置
JP5246746B2 (ja) 2008-01-21 2013-07-24 株式会社ジャパンディスプレイウェスト 電気光学装置、電気光学装置の製造方法及び電子機器
JP5395798B2 (ja) * 2008-08-27 2014-01-22 株式会社アルバック 静電チャック及び真空処理装置
JP5268013B2 (ja) 2009-03-31 2013-08-21 株式会社アルバック 保持装置及び搬送装置
JP2011150455A (ja) * 2010-01-20 2011-08-04 Sony Corp 入力装置、入力機能付き装置付き電気光学装置、および入力装置の製造方法
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JP5490741B2 (ja) 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
JP5382103B2 (ja) 2011-12-19 2014-01-08 富士通セミコンダクター株式会社 基板検知方法
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WO2014057843A1 (fr) * 2012-10-11 2014-04-17 株式会社クリエイティブ テクノロジー Porte-pièce et procédé utilisant celui-ci pour détecter un décalage latéral d'une pièce
US8870818B2 (en) * 2012-11-15 2014-10-28 Medtronic Minimed, Inc. Systems and methods for alignment and detection of a consumable component

Also Published As

Publication number Publication date
JP6128400B2 (ja) 2017-05-17
JPWO2014057843A1 (ja) 2016-09-05
KR20150067360A (ko) 2015-06-17
WO2014057843A1 (fr) 2014-04-17
TW201428870A (zh) 2014-07-16
CN104737282B (zh) 2017-06-20
KR102143448B1 (ko) 2020-08-11
US20150268026A1 (en) 2015-09-24
CN104737282A (zh) 2015-06-24
US9689656B2 (en) 2017-06-27
TWI597793B (zh) 2017-09-01

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