HK1207874A1 - Radiation curable composition for water scavenging layer, and method of manufacturing the same - Google Patents

Radiation curable composition for water scavenging layer, and method of manufacturing the same Download PDF

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Publication number
HK1207874A1
HK1207874A1 HK15108471.4A HK15108471A HK1207874A1 HK 1207874 A1 HK1207874 A1 HK 1207874A1 HK 15108471 A HK15108471 A HK 15108471A HK 1207874 A1 HK1207874 A1 HK 1207874A1
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HK
Hong Kong
Prior art keywords
acrylate
meth
component
organic layer
layer
Prior art date
Application number
HK15108471.4A
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English (en)
Chinese (zh)
Inventor
．加蘭德
E．加兰德
．貝爾巴克拉
Z．贝尔巴克拉
．弗蘭茨
R.弗兰茨
．謝考伊
Z．谢考伊
Original Assignee
罗利克有限公司
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Publication date
Application filed by 罗利克有限公司 filed Critical 罗利克有限公司
Publication of HK1207874A1 publication Critical patent/HK1207874A1/xx

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
HK15108471.4A 2012-07-19 2013-07-16 Radiation curable composition for water scavenging layer, and method of manufacturing the same HK1207874A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12177006.9 2012-07-19
EP12177006 2012-07-19
PCT/EP2013/065012 WO2014012931A1 (en) 2012-07-19 2013-07-16 Radiation curable composition for water scavenging layer, and method of manufacturing the same

Publications (1)

Publication Number Publication Date
HK1207874A1 true HK1207874A1 (en) 2016-02-12

Family

ID=48795574

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15108471.4A HK1207874A1 (en) 2012-07-19 2013-07-16 Radiation curable composition for water scavenging layer, and method of manufacturing the same

Country Status (9)

Country Link
US (1) US10559777B2 (enExample)
EP (1) EP2875070B1 (enExample)
JP (1) JP6270837B2 (enExample)
KR (1) KR102108867B1 (enExample)
CN (1) CN104704035B (enExample)
HK (1) HK1207874A1 (enExample)
MY (1) MY176545A (enExample)
SG (1) SG11201500374RA (enExample)
WO (1) WO2014012931A1 (enExample)

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KR102392854B1 (ko) * 2016-10-19 2022-04-29 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
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KR102607711B1 (ko) * 2017-04-21 2023-11-28 카티바, 인크. 유기 박막을 형성하기 위한 조성물 및 기술
JP6369790B1 (ja) * 2017-08-09 2018-08-08 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
KR102626849B1 (ko) * 2017-10-26 2024-01-18 덴카 주식회사 유기 일렉트로 루미네센스 표시 소자용 봉지제
JP6493845B1 (ja) * 2017-12-08 2019-04-03 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
KR102762844B1 (ko) 2018-03-23 2025-02-05 카티바, 인크. 유기 박막 형성을 위한 조성물 및 기술
KR20210003713A (ko) * 2018-04-20 2021-01-12 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
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Also Published As

Publication number Publication date
MY176545A (en) 2020-08-16
CN104704035B (zh) 2018-10-19
JP2015524494A (ja) 2015-08-24
EP2875070A1 (en) 2015-05-27
KR102108867B1 (ko) 2020-05-12
EP2875070B1 (en) 2020-09-09
US20150179976A1 (en) 2015-06-25
KR20150038183A (ko) 2015-04-08
US10559777B2 (en) 2020-02-11
SG11201500374RA (en) 2015-02-27
CN104704035A (zh) 2015-06-10
JP6270837B2 (ja) 2018-01-31
WO2014012931A1 (en) 2014-01-23

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