SG11201500374RA - Radiation curable composition for water scavenging layer, and method of manufacturing the same - Google Patents

Radiation curable composition for water scavenging layer, and method of manufacturing the same

Info

Publication number
SG11201500374RA
SG11201500374RA SG11201500374RA SG11201500374RA SG11201500374RA SG 11201500374R A SG11201500374R A SG 11201500374RA SG 11201500374R A SG11201500374R A SG 11201500374RA SG 11201500374R A SG11201500374R A SG 11201500374RA SG 11201500374R A SG11201500374R A SG 11201500374RA
Authority
SG
Singapore
Prior art keywords
manufacturing
same
curable composition
radiation curable
scavenging layer
Prior art date
Application number
SG11201500374RA
Other languages
English (en)
Inventor
Emilie Galand
Richard Frantz
Zoubair Cherkaoui
Zakaria Belbakra
Original Assignee
Rolic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rolic Ag filed Critical Rolic Ag
Publication of SG11201500374RA publication Critical patent/SG11201500374RA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
SG11201500374RA 2012-07-19 2013-07-16 Radiation curable composition for water scavenging layer, and method of manufacturing the same SG11201500374RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12177006 2012-07-19
PCT/EP2013/065012 WO2014012931A1 (en) 2012-07-19 2013-07-16 Radiation curable composition for water scavenging layer, and method of manufacturing the same

Publications (1)

Publication Number Publication Date
SG11201500374RA true SG11201500374RA (en) 2015-02-27

Family

ID=48795574

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201500374RA SG11201500374RA (en) 2012-07-19 2013-07-16 Radiation curable composition for water scavenging layer, and method of manufacturing the same

Country Status (9)

Country Link
US (1) US10559777B2 (enExample)
EP (1) EP2875070B1 (enExample)
JP (1) JP6270837B2 (enExample)
KR (1) KR102108867B1 (enExample)
CN (1) CN104704035B (enExample)
HK (1) HK1207874A1 (enExample)
MY (1) MY176545A (enExample)
SG (1) SG11201500374RA (enExample)
WO (1) WO2014012931A1 (enExample)

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KR20220061267A (ko) * 2016-10-19 2022-05-12 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
WO2018074507A1 (ja) * 2016-10-19 2018-04-26 積水化学工業株式会社 有機ｅｌ表示素子用封止剤及び有機ｅｌ表示素子用封止剤の製造方法
KR102392854B1 (ko) * 2016-10-19 2022-04-29 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
JP6649243B2 (ja) * 2016-12-27 2020-02-19 双葉電子工業株式会社 乾燥剤組成物、封止構造、及び有機ｅｌ素子
JP6887258B2 (ja) * 2017-01-27 2021-06-16 デンカ株式会社 組成物
CN111788265B (zh) * 2017-04-21 2024-04-23 柯狄公司 用于形成有机薄膜的组合物和技术
JP6369790B1 (ja) * 2017-08-09 2018-08-08 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
KR102626849B1 (ko) * 2017-10-26 2024-01-18 덴카 주식회사 유기 일렉트로 루미네센스 표시 소자용 봉지제
JP6493845B1 (ja) * 2017-12-08 2019-04-03 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
CN111902493A (zh) * 2018-03-23 2020-11-06 科迪华公司 用于形成有机薄膜的组合物和技术
JP7497155B2 (ja) * 2018-04-20 2024-06-10 積水化学工業株式会社 有機ｅｌ表示素子用封止剤及びトップエミッション型有機ｅｌ表示素子
CN111837457B (zh) * 2018-04-20 2024-08-13 积水化学工业株式会社 有机el显示元件用密封剂
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Also Published As

Publication number Publication date
MY176545A (en) 2020-08-16
EP2875070B1 (en) 2020-09-09
JP2015524494A (ja) 2015-08-24
WO2014012931A1 (en) 2014-01-23
US10559777B2 (en) 2020-02-11
KR102108867B1 (ko) 2020-05-12
US20150179976A1 (en) 2015-06-25
CN104704035A (zh) 2015-06-10
KR20150038183A (ko) 2015-04-08
EP2875070A1 (en) 2015-05-27
CN104704035B (zh) 2018-10-19
JP6270837B2 (ja) 2018-01-31
HK1207874A1 (en) 2016-02-12

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