SG11201407112UA - Curable composition, articles comprising the curable composition, and method of making the same - Google Patents

Curable composition, articles comprising the curable composition, and method of making the same

Info

Publication number
SG11201407112UA
SG11201407112UA SG11201407112UA SG11201407112UA SG11201407112UA SG 11201407112U A SG11201407112U A SG 11201407112UA SG 11201407112U A SG11201407112U A SG 11201407112UA SG 11201407112U A SG11201407112U A SG 11201407112UA SG 11201407112U A SG11201407112U A SG 11201407112UA
Authority
SG
Singapore
Prior art keywords
curable composition
articles
making
same
curable
Prior art date
Application number
SG11201407112UA
Inventor
Eric G Larson
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201407112UA publication Critical patent/SG11201407112UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
SG11201407112UA 2012-05-02 2013-04-05 Curable composition, articles comprising the curable composition, and method of making the same SG11201407112UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/461,957 US9056438B2 (en) 2012-05-02 2012-05-02 Curable composition, articles comprising the curable composition, and method of making the same
PCT/US2013/035410 WO2013165648A1 (en) 2012-05-02 2013-04-05 Curable composition, articles comprising the curable composition, and method of making the same

Publications (1)

Publication Number Publication Date
SG11201407112UA true SG11201407112UA (en) 2014-11-27

Family

ID=49512724

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201407112UA SG11201407112UA (en) 2012-05-02 2013-04-05 Curable composition, articles comprising the curable composition, and method of making the same

Country Status (5)

Country Link
US (1) US9056438B2 (en)
KR (1) KR101979977B1 (en)
SG (1) SG11201407112UA (en)
TW (1) TWI580751B (en)
WO (1) WO2013165648A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5935947B2 (en) * 2013-08-06 2016-06-15 千住金属工業株式会社 Conductive bonding agent and solder joint
JP7206829B2 (en) * 2018-11-15 2023-01-18 日本電気硝子株式会社 METHOD FOR MANUFACTURING PLATE MEMBER AND LAMINATE
CN111040691B (en) * 2019-11-29 2021-01-26 江苏富威尔电子材料科技有限公司 Multi-component metal conductive adhesive based on different melting points and preparation method thereof
TWI809295B (en) * 2020-08-07 2023-07-21 日商拓自達電線股份有限公司 Conductive composition
WO2022092047A1 (en) * 2020-10-29 2022-05-05 デクセリアルズ株式会社 Electrically conductive adhesive, anisotropic electrically conductive film, connection structure, and method for producing connection structure
KR102510546B1 (en) 2021-03-16 2023-03-16 김연환 Manufacturing method of high flame retardant sheath compound for electric cable having flexibility, oil resistance and thermal resistance

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3753968A (en) 1971-07-01 1973-08-21 Westvaco Corp Selective reaction of fatty acids and their separation
US4069202A (en) 1975-10-17 1978-01-17 Shell Oil Company Curable polyepoxide casting compositions
US4296231A (en) 1979-05-08 1981-10-20 Ciba-Geigy Corporation Curable epoxide resin mixtures
DE3639266A1 (en) 1985-12-27 1987-07-02 Fsk K K ADHESIVE FILM
US4769399A (en) 1987-03-12 1988-09-06 Minnesota Mining And Manufacturing Company Epoxy adhesive film for electronic applications
US5538789A (en) 1990-02-09 1996-07-23 Toranaga Technologies, Inc. Composite substrates for preparation of printed circuits
US5853622A (en) 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5948533A (en) 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
US5376403A (en) 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5716663A (en) 1990-02-09 1998-02-10 Toranaga Technologies Multilayer printed circuit
JPH09504568A (en) 1993-11-03 1997-05-06 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド Conductive adhesive
US5814180A (en) 1993-11-03 1998-09-29 W. L. Gore & Associates, Inc. Low temperature method for mounting electrical components
AU711287B2 (en) 1996-05-16 1999-10-07 Minnesota Mining And Manufacturing Company Adhesive compositions and methods of use
US5922397A (en) 1997-03-03 1999-07-13 Ormet Corporation Metal-plating of cured and sintered transient liquid phase sintering pastes
US5980785A (en) 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
US6127619A (en) 1998-06-08 2000-10-03 Ormet Corporation Process for producing high performance thermoelectric modules
US6085415A (en) 1998-07-27 2000-07-11 Ormet Corporation Methods to produce insulated conductive through-features in core materials for electric packaging
US6344157B1 (en) 1999-02-12 2002-02-05 National Starch And Chemical Investment Holding Corporation Conductive and resistive materials with electrical stability for use in electronics devices
US6759121B2 (en) 2000-07-13 2004-07-06 3M Innovative Properties Company Clear adhesive sheet
US6716036B2 (en) 2002-05-15 2004-04-06 Ormet Circuits, Inc. Method of attaching circuitry to a modular jack connector using electrically conductive paste
US7888411B2 (en) 2003-04-01 2011-02-15 Creative Electron, Inc. Thermally conductive adhesive composition and process for device attachment
US7910403B2 (en) 2005-03-09 2011-03-22 Panasonic Corporation Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same
CN101426875A (en) * 2006-04-27 2009-05-06 住友电木株式会社 Adhesive tape, semiconductor package, and electronic device
US8022145B2 (en) 2007-03-16 2011-09-20 3M Innovative Properties Company Dicing and die attach adhesive
US8308991B2 (en) 2007-09-13 2012-11-13 3M Innovative Properties Company Low temperature bonding electronic adhesives
JP2011506751A (en) 2007-12-18 2011-03-03 スリーエム イノベイティブ プロパティズ カンパニー Conductive adhesive precursor, method of using the same, and article
EP2257608A1 (en) 2008-03-07 2010-12-08 3M Innovative Properties Company Dicing tape and die attach adhesive with patterned backing
US20100227981A1 (en) 2009-03-04 2010-09-09 Air Products And Chemicals, Inc. Epoxide-based composition
US20110132537A1 (en) 2009-12-03 2011-06-09 3M Innovative Properties Company Composition, tape, and use thereof

Also Published As

Publication number Publication date
KR101979977B1 (en) 2019-05-17
US20130295311A1 (en) 2013-11-07
US9056438B2 (en) 2015-06-16
TWI580751B (en) 2017-05-01
TW201410819A (en) 2014-03-16
WO2013165648A1 (en) 2013-11-07
KR20150006866A (en) 2015-01-19

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