HK1187116A1 - 防塵薄膜組件 - Google Patents

防塵薄膜組件

Info

Publication number
HK1187116A1
HK1187116A1 HK13113681.2A HK13113681A HK1187116A1 HK 1187116 A1 HK1187116 A1 HK 1187116A1 HK 13113681 A HK13113681 A HK 13113681A HK 1187116 A1 HK1187116 A1 HK 1187116A1
Authority
HK
Hong Kong
Prior art keywords
dust
thin film
film assembly
proofing
proofing thin
Prior art date
Application number
HK13113681.2A
Other languages
English (en)
Chinese (zh)
Inventor
堀越淳
Original Assignee
信越化學工業株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越化學工業株式會社 filed Critical 信越化學工業株式會社
Publication of HK1187116A1 publication Critical patent/HK1187116A1/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
HK13113681.2A 2012-04-26 2013-12-09 防塵薄膜組件 HK1187116A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012100882A JP5749680B2 (ja) 2012-04-26 2012-04-26 ペリクル

Publications (1)

Publication Number Publication Date
HK1187116A1 true HK1187116A1 (zh) 2014-03-28

Family

ID=49461992

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13113681.2A HK1187116A1 (zh) 2012-04-26 2013-12-09 防塵薄膜組件

Country Status (5)

Country Link
JP (1) JP5749680B2 (ko)
KR (1) KR102040547B1 (ko)
CN (1) CN103376671B (ko)
HK (1) HK1187116A1 (ko)
TW (1) TWI475086B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6150300B2 (ja) * 2014-04-04 2017-06-21 信越化学工業株式会社 ペリクルの貼り付け部確認方法
JP6347741B2 (ja) * 2014-12-25 2018-06-27 信越化学工業株式会社 ペリクル
TWI566033B (zh) * 2015-04-17 2017-01-11 Micro Lithography Inc Mask dustproof frame structure
US10036951B2 (en) 2015-05-29 2018-07-31 Taiwan Semiconductor Manufacturing Company, Ltd. Pellicle assembly and fabrication methods thereof
US11143952B2 (en) * 2017-09-28 2021-10-12 Taiwan Semiconductor Manufacturing Company, Ltd. Pellicle removal method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219023A (ja) 1982-06-15 1983-12-20 Daicel Chem Ind Ltd 樹脂薄膜の製造方法
US4861402A (en) 1984-10-16 1989-08-29 Du Pont Tau Laboratories, Inc. Method of making a cellulose acetate butyrate pellicle
JPS6327707A (ja) 1986-07-21 1988-02-05 Matsushita Electric Ind Co Ltd 双曲面鏡検査装置
JPH06260398A (ja) * 1993-03-05 1994-09-16 Canon Inc Ｘ線マスク構造体及びその製造方法、ｘ線マスク構造体を用いたｘ線露光方法及びそのｘ線露光方法により製造される半導体デバイス
JP2000292908A (ja) * 1999-04-02 2000-10-20 Shin Etsu Chem Co Ltd リソグラフィー用ペリクル
JP2003307832A (ja) * 2002-04-16 2003-10-31 Asahi Glass Co Ltd ペリクル及びペリクル装着フォトマスク
EP1720070A3 (en) * 2002-12-09 2006-11-22 ASML Holding N.V. Pellicle frame with heightened bonding surfaces
JP4839041B2 (ja) * 2005-08-29 2011-12-14 東レ・ダウコーニング株式会社 絶縁性液状ダイボンディング剤および半導体装置
KR20110036777A (ko) * 2005-12-26 2011-04-08 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 재료 및 회로 부재의 접속 구조
JP2011028091A (ja) * 2009-07-28 2011-02-10 Shin-Etsu Chemical Co Ltd ペリクル
JP2011076042A (ja) * 2009-10-02 2011-04-14 Shin-Etsu Chemical Co Ltd ペリクル
KR101990345B1 (ko) * 2009-10-02 2019-06-18 신에쓰 가가꾸 고교 가부시끼가이샤 펠리클의 제조 방법
JP4951051B2 (ja) * 2009-10-30 2012-06-13 信越化学工業株式会社 ペリクルフレーム及びペリクル
JP5532845B2 (ja) * 2009-11-18 2014-06-25 信越化学工業株式会社 化粧料
JP5436296B2 (ja) * 2010-03-26 2014-03-05 信越化学工業株式会社 リソグラフィー用ペリクル

Also Published As

Publication number Publication date
TWI475086B (zh) 2015-03-01
TW201350554A (zh) 2013-12-16
CN103376671B (zh) 2016-07-13
KR102040547B1 (ko) 2019-11-05
JP2013228582A (ja) 2013-11-07
CN103376671A (zh) 2013-10-30
JP5749680B2 (ja) 2015-07-15
KR20130121005A (ko) 2013-11-05

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20220422