HK1187065A1 - 聚酰胺樹脂薄膜及其製造方法 - Google Patents

聚酰胺樹脂薄膜及其製造方法

Info

Publication number
HK1187065A1
HK1187065A1 HK14100044.0A HK14100044A HK1187065A1 HK 1187065 A1 HK1187065 A1 HK 1187065A1 HK 14100044 A HK14100044 A HK 14100044A HK 1187065 A1 HK1187065 A1 HK 1187065A1
Authority
HK
Hong Kong
Prior art keywords
resin film
polyamide resin
manufacturing same
manufacturing
same
Prior art date
Application number
HK14100044.0A
Other languages
English (en)
Inventor
三田寺淳
Original Assignee
三菱瓦斯化學株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱瓦斯化學株式會社 filed Critical 三菱瓦斯化學株式會社
Publication of HK1187065A1 publication Critical patent/HK1187065A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
HK14100044.0A 2010-12-07 2014-01-03 聚酰胺樹脂薄膜及其製造方法 HK1187065A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010272142 2010-12-07
PCT/JP2011/076502 WO2012077473A1 (ja) 2010-12-07 2011-11-17 ポリアミド樹脂フィルム及びその製造方法

Publications (1)

Publication Number Publication Date
HK1187065A1 true HK1187065A1 (zh) 2014-03-28

Family

ID=46206971

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14100044.0A HK1187065A1 (zh) 2010-12-07 2014-01-03 聚酰胺樹脂薄膜及其製造方法

Country Status (9)

Country Link
US (1) US10100162B2 (zh)
EP (1) EP2650322B1 (zh)
JP (1) JP5842824B2 (zh)
KR (1) KR101877859B1 (zh)
CN (1) CN103249765B (zh)
CA (1) CA2820634A1 (zh)
HK (1) HK1187065A1 (zh)
TW (1) TWI538936B (zh)
WO (1) WO2012077473A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2615139B1 (en) 2011-04-12 2016-03-30 Mitsubishi Gas Chemical Company, Inc. Polyamide resin-based composite material and method for producing same
KR101775422B1 (ko) * 2015-07-16 2017-09-06 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 연신필름, 연신필름의 제조방법, 및, 폴리아미드 수지 조성물
US9999905B2 (en) 2016-01-08 2018-06-19 International Business Machines Corporation Polymeric coatings and coating method
KR20180119650A (ko) * 2016-04-03 2018-11-02 마사노리 후지타 그레인 패턴이 형성된 성형품의 제조 방법 및 그레인 패턴이 형성된 성형품
EP3663361B1 (en) * 2017-07-31 2021-03-17 Mitsubishi Gas Chemical Company, Inc. Easily-torn film, multilayer film, packaging material, and container
CN109897370A (zh) * 2019-02-25 2019-06-18 佛山金万达科技股份有限公司 一种生物基弹性体组合物及其制备的薄膜和层合物
JP7342439B2 (ja) 2019-06-11 2023-09-12 三菱瓦斯化学株式会社 延伸フィルムおよび多層体
WO2024024330A1 (ja) * 2022-07-25 2024-02-01 三菱瓦斯化学株式会社 樹脂組成物、および、成形品

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908272A (en) * 1987-04-27 1990-03-13 Mitsubishi Gas Chemical Company, Inc. Gas-barrier multilayered structure
JPH0485249A (ja) * 1990-07-26 1992-03-18 Konica Corp ウエブの巻取り方法
JPH05318992A (ja) * 1992-05-15 1993-12-03 Dainippon Printing Co Ltd 木目調エンボス版、木目調エンボス版の製造方法及び木目調化粧材
JP3322094B2 (ja) 1995-09-29 2002-09-09 東レ株式会社 ポリアミドフィルムおよびその製造方法
JP2002307518A (ja) * 2001-04-12 2002-10-23 Mitsubishi Chemicals Corp ポリアミドフィルムの製造方法
DE102005051126A1 (de) 2005-10-26 2007-05-03 Degussa Gmbh Folie mit Deckschicht aus einer Polyamidzusammensetzung
JP4773896B2 (ja) * 2006-06-22 2011-09-14 株式会社Ｎｔｔファシリティーズ 動力一体水ろ過装置及びそれを含む動力一体水ろ過システム
JP2008080687A (ja) * 2006-09-28 2008-04-10 Mitsubishi Gas Chem Co Inc ポリアミド延伸フィルム製造方法
JP2008080690A (ja) * 2006-09-28 2008-04-10 Mitsubishi Gas Chem Co Inc ポリアミド延伸フィルムおよび製造方法
CA2605628C (en) 2006-09-28 2015-03-17 Mitsubishi Gas Chemical Company, Inc. Biaxially stretched, multi-layereded polyamide film and production method thereof
JP2008094049A (ja) * 2006-10-16 2008-04-24 Mitsubishi Gas Chem Co Inc ポリアミド延伸フィルムおよび製造方法
JP5581567B2 (ja) * 2006-10-26 2014-09-03 三菱瓦斯化学株式会社 バリア性に優れた熱可塑性樹脂組成物
EP2078735B1 (en) * 2006-10-26 2015-01-14 Mitsubishi Gas Chemical Company, Inc. Thermoplastic resin composition excellent in barrier property
JP4980205B2 (ja) * 2007-12-11 2012-07-18 信越ポリマー株式会社 コンデンサ用フィルムの製造方法
PT2113380E (pt) * 2008-04-24 2014-10-13 Mitsubishi Gas Chemical Co Estrutura laminada com barreira elevada
JP2010000707A (ja) * 2008-06-20 2010-01-07 Toyobo Co Ltd 二軸延伸ポリアミドフィルムの製造方法
JP2010248418A (ja) * 2009-04-17 2010-11-04 Mitsubishi Gas Chemical Co Inc バリア性に優れた熱可塑性樹脂組成物
KR101796967B1 (ko) 2010-07-08 2017-11-13 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리아미드 수지 조성물
ES2620755T3 (es) 2010-07-27 2017-06-29 Mitsubishi Gas Chemical Company, Inc. Resina de poliamida
BR112013008038A2 (pt) 2010-10-08 2016-06-14 Mitsubishi Gas Chemical Co peça moldada de resina de poliamida, e, processo para a preparação de uma peça moldada de resina de poliamida
US8993677B2 (en) 2011-06-10 2015-03-31 Mitsubishi Gas Chemical Company, Inc. Reactive polyamide resins and polyamide resin compositions
JP2013003455A (ja) * 2011-06-20 2013-01-07 Hitachi Cable Ltd スポットサイズ変換導波路、及びその製造方法

Also Published As

Publication number Publication date
CN103249765B (zh) 2016-06-08
CA2820634A1 (en) 2012-06-14
WO2012077473A1 (ja) 2012-06-14
CN103249765A (zh) 2013-08-14
TWI538936B (zh) 2016-06-21
KR20130143072A (ko) 2013-12-30
EP2650322A1 (en) 2013-10-16
US20130230693A1 (en) 2013-09-05
TW201229104A (en) 2012-07-16
US10100162B2 (en) 2018-10-16
JPWO2012077473A1 (ja) 2014-05-19
EP2650322B1 (en) 2018-05-09
KR101877859B1 (ko) 2018-07-12
JP5842824B2 (ja) 2016-01-13
EP2650322A4 (en) 2016-12-07

Similar Documents

Publication Publication Date Title
HK1177946A1 (zh) 聚酰胺樹脂組合物和聚酰胺樹脂組合物的製造法
EP2740547A4 (en) METHOD OF MANUFACTURING A FUNCTIONAL FILM AND FUNCTIONAL FILM
ZA201208715B (en) Polyamide resin
EP2857433A4 (en) POLYESTER RESIN AND PROCESS FOR PRODUCING THE SAME
EP2592119A4 (en) ANTI-REFLECTION FOIL AND METHOD FOR THE PRODUCTION THEREOF
EP2857432A4 (en) POLYESTER RESIN AND METHOD FOR THE PRODUCTION THEREOF
EP2641391A4 (en) CAMERA MODULE AND MANUFACTURING METHOD THEREFOR
HK1187065A1 (zh) 聚酰胺樹脂薄膜及其製造方法
EP2711180A4 (en) PLASTIC MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
EP2769839A4 (en) MULTILAYER FILM AND METHOD OF MANUFACTURING THE SAME
EP2474570A4 (en) METHOD OF MANUFACTURING A THERMOPLASTIC RESIN COMPOSITION
EP2676991A4 (en) SUBSTRATE FILM AND METHOD FOR THE PRODUCTION THEREOF
EP2412524A4 (en) HIGHLY ADHERENT POLYAMIDE FILM AND PROCESS FOR PRODUCTION THEREOF
EP2599800A4 (en) COPOLYMER AND METHOD FOR PRODUCING THE SAME
EP2813540A4 (en) MULTILAYER FOIL AND METHOD FOR THE PRODUCTION THEREOF
EP2636215A4 (en) PHOTOGRAPHIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME
EP2631258A4 (en) POLYAMIDE RESIN
EP2891684A4 (en) POLYAMIDE RESIN COMPOSITION AND METHOD FOR MANUFACTURING THE SAME
EP2607962A4 (en) ELECTRICAL ELEMENT AND MANUFACTURING METHOD THEREFOR
TWI561367B (en) Bonding method for polymer film, and method for manufacturing polarized film
EP2796496A4 (en) THERMOPLASTIC RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME
HK1185900A1 (zh) 聚酰胺樹脂及其成形方法
EP2565216A4 (en) POLYAMIDE RESIN
EP2578621A4 (en) THERMOPLASTIC ELASTOMERIC COMPOSITION AND PROCESS FOR PRODUCING THE SAME
EP2589482A4 (en) FILM MANUFACTURING DEVICE AND FILM MANUFACTURING METHOD

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20221115