HK1171866A1 - 基板支承構件、基板搬送裝置、基板搬送方法、曝光裝置及元件製造方法 - Google Patents

基板支承構件、基板搬送裝置、基板搬送方法、曝光裝置及元件製造方法

Info

Publication number
HK1171866A1
HK1171866A1 HK12112480.8A HK12112480A HK1171866A1 HK 1171866 A1 HK1171866 A1 HK 1171866A1 HK 12112480 A HK12112480 A HK 12112480A HK 1171866 A1 HK1171866 A1 HK 1171866A1
Authority
HK
Hong Kong
Prior art keywords
substrate
substrate conveyance
support member
device manufacturing
exposure apparatus
Prior art date
Application number
HK12112480.8A
Other languages
English (en)
Chinese (zh)
Inventor
加藤正紀
戶口學
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1171866A1 publication Critical patent/HK1171866A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electroluminescent Light Sources (AREA)
HK12112480.8A 2009-12-16 2012-12-04 基板支承構件、基板搬送裝置、基板搬送方法、曝光裝置及元件製造方法 HK1171866A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009285412 2009-12-16
JP2009285413 2009-12-16
PCT/JP2010/072135 WO2011074474A1 (ja) 2009-12-16 2010-12-09 基板支持部材、基板搬送装置、基板搬送方法、露光装置及びデバイス製造方法

Publications (1)

Publication Number Publication Date
HK1171866A1 true HK1171866A1 (zh) 2013-04-05

Family

ID=44167230

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12112480.8A HK1171866A1 (zh) 2009-12-16 2012-12-04 基板支承構件、基板搬送裝置、基板搬送方法、曝光裝置及元件製造方法

Country Status (5)

Country Link
JP (2) JP5938904B2 (ja)
CN (1) CN102741993B (ja)
HK (1) HK1171866A1 (ja)
TW (1) TW201145439A (ja)
WO (1) WO2011074474A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5821395B2 (ja) * 2011-08-16 2015-11-24 大日本印刷株式会社 基板の基板保持用枠体への受け渡し方法と移載用架台への受け取り方法、および基板の移載用架台
KR102242065B1 (ko) * 2015-01-26 2021-04-19 가부시키가이샤 니콘 마스크 케이스, 보관 장치 및 방법, 반송 장치 및 방법, 그리고 노광 장치
CN106486409A (zh) * 2015-08-25 2017-03-08 英属开曼群岛商精曜有限公司 基板载具
JP6685213B2 (ja) * 2016-09-29 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板整列装置、基板処理装置、基板配列装置、基板整列方法、基板処理方法および基板配列方法
CN107010417B (zh) 2017-03-20 2020-03-06 京东方科技集团股份有限公司 用于显示屏基板的存放装置及取放显示屏基板的控制方法
JP6468540B2 (ja) * 2017-05-22 2019-02-13 キヤノントッキ株式会社 基板搬送機構、基板載置機構、成膜装置及びそれらの方法
JP7033303B2 (ja) * 2018-01-31 2022-03-10 三星ダイヤモンド工業株式会社 基板搬送装置
CN109433999A (zh) * 2018-12-03 2019-03-08 广东盛茂达自动控制科技有限公司 伸缩架自动铆压系统
CN110730611B (zh) * 2019-09-30 2020-12-08 云谷（固安）科技有限公司 曲面显示屏绑定装置及曲面显示屏绑定方法
US20230207379A1 (en) * 2020-06-29 2023-06-29 Ev Group E. Thallner Gmbh Method and device for bonding substrates
JP7433181B2 (ja) * 2020-09-23 2024-02-19 株式会社Ｓｃｒｅｅｎホールディングス 描画装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT399867B (de) * 1990-01-11 1995-08-25 Lisec Peter Anlage zur herstellung von isolierglasscheiben
JP3881062B2 (ja) * 1996-08-14 2007-02-14 大日本スクリーン製造株式会社 基板保持機構および基板処理装置
KR100825691B1 (ko) * 1999-07-26 2008-04-29 가부시키가이샤 니콘 기판지지장치 및 기판처리장치
JP2004273702A (ja) * 2003-03-07 2004-09-30 Nikon Corp 搬送装置及び搬送方法、露光装置
AU2003242481A1 (en) * 2003-06-19 2005-01-04 Rorze Corporation Thin plate-supporting body
JP2006312511A (ja) * 2005-05-06 2006-11-16 Kyokuhei Glass Kako Kk ガラス支持枠体
JP4873895B2 (ja) * 2005-07-04 2012-02-08 東芝機械株式会社 平板状搬送物の搬送方法及びその装置
JP2007114570A (ja) * 2005-10-21 2007-05-10 Nikon Corp 基板ホルダ、露光装置及びデバイスの製造方法
JP4858045B2 (ja) * 2006-09-28 2012-01-18 大日本印刷株式会社 板状物の受け取り方法および板状物の受け取り装置

Also Published As

Publication number Publication date
CN102741993B (zh) 2016-06-22
JP6245308B2 (ja) 2017-12-13
JP2016154266A (ja) 2016-08-25
CN102741993A (zh) 2012-10-17
WO2011074474A1 (ja) 2011-06-23
JP5938904B2 (ja) 2016-06-22
JPWO2011074474A1 (ja) 2013-04-25
TW201145439A (en) 2011-12-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20211207