HK1169862A1 - Pattern formation apparatus, pattern formation method, and device manufacturing method - Google Patents

Pattern formation apparatus, pattern formation method, and device manufacturing method

Info

Publication number
HK1169862A1
HK1169862A1 HK12110489.3A HK12110489A HK1169862A1 HK 1169862 A1 HK1169862 A1 HK 1169862A1 HK 12110489 A HK12110489 A HK 12110489A HK 1169862 A1 HK1169862 A1 HK 1169862A1
Authority
HK
Hong Kong
Prior art keywords
pattern formation
device manufacturing
formation apparatus
pattern
formation method
Prior art date
Application number
HK12110489.3A
Other languages
English (en)
Chinese (zh)
Inventor
木內徹
水谷英夫
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1169862A1 publication Critical patent/HK1169862A1/xx

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK12110489.3A 2009-07-17 2012-10-22 Pattern formation apparatus, pattern formation method, and device manufacturing method HK1169862A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22643309P 2009-07-17 2009-07-17
US12/833,632 US8379186B2 (en) 2009-07-17 2010-07-09 Pattern formation apparatus, pattern formation method, and device manufacturing method
PCT/JP2010/062292 WO2011007896A1 (en) 2009-07-17 2010-07-14 Pattern formation apparatus, pattern formation method, and device manufacturing method

Publications (1)

Publication Number Publication Date
HK1169862A1 true HK1169862A1 (en) 2013-02-08

Family

ID=42790610

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12110489.3A HK1169862A1 (en) 2009-07-17 2012-10-22 Pattern formation apparatus, pattern formation method, and device manufacturing method

Country Status (7)

Country Link
US (1) US8379186B2 (xx)
JP (1) JP5605044B2 (xx)
KR (1) KR20120038446A (xx)
CN (1) CN102472978B (xx)
HK (1) HK1169862A1 (xx)
TW (1) TWI522748B (xx)
WO (1) WO2011007896A1 (xx)

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EP2095946A1 (en) * 2008-02-27 2009-09-02 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO A system for patterning flexible foils
US8379186B2 (en) * 2009-07-17 2013-02-19 Nikon Corporation Pattern formation apparatus, pattern formation method, and device manufacturing method
WO2012147658A1 (ja) * 2011-04-25 2012-11-01 株式会社ニコン 基板処理装置
JP6008165B2 (ja) * 2012-04-04 2016-10-19 株式会社ニコン 露光方法及び露光装置、並びにデバイス製造方法
JP5752088B2 (ja) * 2012-06-11 2015-07-22 株式会社アドテックエンジニアリング 露光装置
KR101243354B1 (ko) * 2012-12-04 2013-03-13 주식회사 쓰리디플러스 롤투롤 타입의 얼라인먼트 스테이지 장치
KR102007627B1 (ko) * 2013-07-08 2019-08-05 가부시키가이샤 니콘 기판 처리 장치, 디바이스 제조 시스템, 디바이스 제조 방법, 및 패턴 형성 장치
WO2015133391A1 (ja) * 2014-03-07 2015-09-11 富士フイルム株式会社 トランジスタの製造方法
JP6311450B2 (ja) * 2014-05-23 2018-04-18 株式会社ニコン 搬送装置
JP6746092B2 (ja) * 2015-03-31 2020-08-26 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
CN106406032B (zh) * 2015-07-29 2018-03-30 上海微电子装备(集团)股份有限公司 一种重载基板台的六自由度调整装置
CN105739235A (zh) * 2016-03-23 2016-07-06 常州鸿开电子科技有限公司 掩膜板检测用带背光多功能吸盘装置
US11067900B2 (en) 2016-05-19 2021-07-20 Nikon Corporation Dense line extreme ultraviolet lithography system with distortion matching
US11099483B2 (en) 2016-05-19 2021-08-24 Nikon Corporation Euv lithography system for dense line patterning
US10712671B2 (en) 2016-05-19 2020-07-14 Nikon Corporation Dense line extreme ultraviolet lithography system with distortion matching
US10295911B2 (en) * 2016-05-19 2019-05-21 Nikon Corporation Extreme ultraviolet lithography system that utilizes pattern stitching
JP6655753B2 (ja) * 2016-07-13 2020-02-26 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 照明源としてのマイクロledアレイ
US10908507B2 (en) * 2016-07-13 2021-02-02 Applied Materials, Inc. Micro LED array illumination source
US11934105B2 (en) 2017-04-19 2024-03-19 Nikon Corporation Optical objective for operation in EUV spectral region
US11054745B2 (en) 2017-04-26 2021-07-06 Nikon Corporation Illumination system with flat 1D-patterned mask for use in EUV-exposure tool
US11300884B2 (en) 2017-05-11 2022-04-12 Nikon Corporation Illumination system with curved 1d-patterned mask for use in EUV-exposure tool
JP6516030B2 (ja) * 2018-03-05 2019-05-22 株式会社ニコン パターン形成方法
JP2022512980A (ja) * 2018-11-14 2022-02-07 11093606 カナダ エルティーディー. 空間変調装置
US20220004109A1 (en) 2018-11-15 2022-01-06 Inspec Inc. Calibration system and drawing device
CN109856925B (zh) * 2019-03-22 2020-01-24 上海微电子装备(集团)股份有限公司 双工件台柔性卷带曝光装置及曝光方法

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US8379186B2 (en) 2009-07-17 2013-02-19 Nikon Corporation Pattern formation apparatus, pattern formation method, and device manufacturing method
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JP5630113B2 (ja) * 2009-07-17 2014-11-26 株式会社ニコン パターン形成装置及びパターン形成方法、並びにデバイス製造方法
JP2011164430A (ja) * 2010-02-10 2011-08-25 Nikon Corp 露光方法及び装置、並びにデバイス製造方法

Also Published As

Publication number Publication date
TWI522748B (zh) 2016-02-21
CN102472978A (zh) 2012-05-23
JP2011022583A (ja) 2011-02-03
WO2011007896A1 (en) 2011-01-20
US8379186B2 (en) 2013-02-19
CN102472978B (zh) 2015-06-24
US20110013162A1 (en) 2011-01-20
JP5605044B2 (ja) 2014-10-15
KR20120038446A (ko) 2012-04-23
TW201116943A (en) 2011-05-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200714