HK1165179A1 - Multilayer film for electronic circuitry applications and methods relating thereto - Google Patents
Multilayer film for electronic circuitry applications and methods relating theretoInfo
- Publication number
- HK1165179A1 HK1165179A1 HK12105368.9A HK12105368A HK1165179A1 HK 1165179 A1 HK1165179 A1 HK 1165179A1 HK 12105368 A HK12105368 A HK 12105368A HK 1165179 A1 HK1165179 A1 HK 1165179A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- multilayer film
- electronic circuitry
- methods relating
- circuitry applications
- applications
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/584—Scratch resistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15807409P | 2009-03-06 | 2009-03-06 | |
PCT/US2010/025756 WO2010101822A1 (en) | 2009-03-06 | 2010-03-01 | Multilayer film for electronic circuitry applications and methods relating thereto |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1165179A1 true HK1165179A1 (en) | 2012-09-28 |
Family
ID=42115745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12105368.9A HK1165179A1 (en) | 2009-03-06 | 2012-06-01 | Multilayer film for electronic circuitry applications and methods relating thereto |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110287243A1 (ja) |
EP (1) | EP2404487B1 (ja) |
JP (2) | JP5611993B2 (ja) |
KR (1) | KR101708520B1 (ja) |
CN (1) | CN102342188B (ja) |
HK (1) | HK1165179A1 (ja) |
WO (1) | WO2010101822A1 (ja) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010126047A1 (ja) * | 2009-04-28 | 2010-11-04 | 宇部興産株式会社 | 多層ポリイミドフィルム |
US9631054B2 (en) | 2010-07-23 | 2017-04-25 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
US11203192B2 (en) | 2009-08-03 | 2021-12-21 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
US8574720B2 (en) | 2009-08-03 | 2013-11-05 | E.I. Du Pont De Nemours & Company | Matte finish polyimide films and methods relating thereto |
US8541107B2 (en) | 2009-08-13 | 2013-09-24 | E. I. Du Pont De Nemours And Company | Pigmented polyimide films and methods relating thereto |
US9926415B2 (en) | 2010-08-05 | 2018-03-27 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
DE102009045892A1 (de) | 2009-10-21 | 2011-04-28 | Evonik Degussa Gmbh | Folie aus Polyarylenetherketon |
EP2501740B1 (en) * | 2009-11-20 | 2016-03-16 | E. I. du Pont de Nemours and Company | Thin film transistor compositions, and methods relating thereto |
US8263202B2 (en) | 2010-03-19 | 2012-09-11 | Glenn Danny E | Film based heating device and methods relating thereto |
TW201302858A (zh) | 2011-06-24 | 2013-01-16 | Du Pont | 有色聚醯亞胺膜及與其有關之方法 |
US9267057B2 (en) * | 2011-12-16 | 2016-02-23 | Taimide Technology Incorporated | Polyimide film incorporating polyimide powder delustrant, and manufacture thereof |
CN105339434B (zh) * | 2013-06-21 | 2018-08-03 | 三菱工程塑料株式会社 | 结晶性热塑性树脂组合物及成型品 |
TWI481649B (zh) * | 2013-09-09 | 2015-04-21 | Taimide Technology Inc | 黑色聚醯亞胺膜及其加工方法 |
ES2768269T3 (es) * | 2013-12-03 | 2020-06-22 | Abb Schweiz Ag | Material de polímero dieléctrico multi-estratificado, condensador, uso del material y método de formación del mismo |
JP6434520B2 (ja) * | 2013-12-13 | 2018-12-05 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 多層フィルム |
WO2015094848A1 (en) * | 2013-12-17 | 2015-06-25 | E. I. Du Pont Nemours And Company | A multilayer film |
US9481150B2 (en) * | 2014-12-10 | 2016-11-01 | E I Du Pont De Nemours And Company | Multilayer film |
DE112014007245T5 (de) * | 2014-12-10 | 2017-09-28 | E.I. Du Pont De Nemours And Company | Mehrlagige Folie |
CN114786327A (zh) * | 2015-01-19 | 2022-07-22 | 松下知识产权经营株式会社 | 多层印刷线路板、多层覆金属层压板和涂布有树脂的金属箔 |
TWI735421B (zh) * | 2015-01-22 | 2021-08-11 | 日商尤尼吉可股份有限公司 | 積層體、其製造方法及使用方法、暨無鹼玻璃基板積層用聚醯亞胺前驅體溶液 |
JP2018536999A (ja) | 2015-09-14 | 2018-12-13 | ポリマープラス,エルエルシー | 多成分層状誘電体膜およびその使用 |
CN109891680B (zh) * | 2016-11-04 | 2021-11-16 | 阿莫技术有限公司 | 功能性接触器 |
WO2019050565A1 (en) * | 2017-09-11 | 2019-03-14 | Fujifilm Electronic Materials U.S.A., Inc. | COMPOSITION FORMING DIELECTRIC FILM |
CN109561526B (zh) * | 2017-09-26 | 2023-04-25 | 杜邦电子公司 | 加热元件和加热装置 |
CN110239163B (zh) * | 2019-06-13 | 2021-01-08 | 东莞市政潮电子科技有限公司 | 一种提高PI膜与Cu箔间粘结性能的柔性印刷电路板基材 |
CN111304578B (zh) * | 2020-02-28 | 2022-07-01 | 中国人民解放军国防科技大学 | 一种隔热/雷达吸波一体化复合涂层、表面涂覆复合涂层的钛合金材料及其制备方法 |
KR20230025652A (ko) * | 2020-06-16 | 2023-02-22 | 도요보 가부시키가이샤 | 무색 다층 폴리이미드 필름, 적층체, 플렉시블 전자 디바이스의 제조 방법 |
CN112409621B (zh) * | 2020-11-27 | 2022-09-09 | 桂林电器科学研究院有限公司 | 高强度低介电性聚酰亚胺多层膜及其制备方法 |
EP4219159A1 (en) * | 2022-01-26 | 2023-08-02 | SHPP Global Technologies B.V. | Molded parts with reduced microwave reflections and transmission |
CN114559721A (zh) * | 2022-03-04 | 2022-05-31 | 西南科技大学 | 三明治结构高储能密度聚酰亚胺基复合薄膜及其制备方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61111359A (ja) | 1984-11-06 | 1986-05-29 | Ube Ind Ltd | ポリイミド膜 |
US4906731A (en) * | 1987-06-01 | 1990-03-06 | E. I. Du Pont De Nemours And Company | Polyimide molecular weight enhancement by solvent extraction |
US4997716A (en) * | 1987-10-28 | 1991-03-05 | The Dow Chemical Company | Fire shielding composite structures |
US5031017A (en) * | 1988-01-29 | 1991-07-09 | Hewlett-Packard Company | Composite optical shielding |
JPH0722741A (ja) | 1993-07-01 | 1995-01-24 | Japan Gore Tex Inc | カバーレイフィルム及びカバーレイフィルム被覆回路基板 |
EP0659553A1 (en) * | 1993-12-22 | 1995-06-28 | E.I. Du Pont De Nemours And Company | Coextruded multi-layer aromatic polyimide film and preparation thereof |
JP2000273288A (ja) * | 1999-03-29 | 2000-10-03 | Citizen Watch Co Ltd | 封止樹脂組成物 |
JP2003064204A (ja) * | 2001-08-30 | 2003-03-05 | Sumitomo Bakelite Co Ltd | 導電性耐熱シート及びtab用スペーステープ |
JP4445375B2 (ja) * | 2003-12-19 | 2010-04-07 | 株式会社リコー | 中間転写体とその成膜液組成物 |
US7220490B2 (en) * | 2003-12-30 | 2007-05-22 | E. I. Du Pont De Nemours And Company | Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |
DE102004003890A1 (de) * | 2004-01-27 | 2005-08-11 | Mitsubishi Polyester Film Gmbh | Mittels elektromagnetischer Strahlung ein- oder mehrschichtige, orientierte strukturierbare Folie aus thermoplastischem Polymer, Verfahren zu ihrer Herstellung und ihre Verwendung |
JP2005259908A (ja) * | 2004-03-10 | 2005-09-22 | Sanyo Electric Co Ltd | 配線基板 |
JPWO2005111165A1 (ja) * | 2004-05-18 | 2008-03-27 | 株式会社カネカ | 接着フィルムの製造方法 |
US20060083939A1 (en) * | 2004-10-20 | 2006-04-20 | Dunbar Meredith L | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
JP2006306067A (ja) * | 2005-03-29 | 2006-11-09 | Kaneka Corp | 熱伝導シート |
JP4668688B2 (ja) * | 2005-05-30 | 2011-04-13 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP4827460B2 (ja) * | 2005-08-24 | 2011-11-30 | 三井・デュポンフロロケミカル株式会社 | 含フッ素樹脂積層体 |
WO2007108284A1 (ja) * | 2006-03-17 | 2007-09-27 | Kaneka Corporation | 接着フィルム |
US8303852B2 (en) * | 2006-09-19 | 2012-11-06 | Gunze Limited | Carbon black-dispersed polyamic acid solution composition, and process for producing semiconductive polyimide resin belt therewith |
JP4470974B2 (ja) * | 2007-08-28 | 2010-06-02 | 富士ゼロックス株式会社 | 無端ベルト、その製造方法および画像形成装置 |
-
2010
- 2010-03-01 KR KR1020117023394A patent/KR101708520B1/ko active IP Right Grant
- 2010-03-01 US US13/146,481 patent/US20110287243A1/en not_active Abandoned
- 2010-03-01 JP JP2011553008A patent/JP5611993B2/ja active Active
- 2010-03-01 EP EP20100706879 patent/EP2404487B1/en active Active
- 2010-03-01 CN CN201080011415.9A patent/CN102342188B/zh active Active
- 2010-03-01 WO PCT/US2010/025756 patent/WO2010101822A1/en active Application Filing
-
2012
- 2012-06-01 HK HK12105368.9A patent/HK1165179A1/xx unknown
-
2014
- 2014-09-03 JP JP2014179388A patent/JP5898278B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
EP2404487B1 (en) | 2015-04-22 |
KR20110125264A (ko) | 2011-11-18 |
WO2010101822A1 (en) | 2010-09-10 |
JP2012519960A (ja) | 2012-08-30 |
CN102342188B (zh) | 2014-08-27 |
US20110287243A1 (en) | 2011-11-24 |
JP2014232890A (ja) | 2014-12-11 |
EP2404487A1 (en) | 2012-01-11 |
JP5898278B2 (ja) | 2016-04-06 |
KR101708520B1 (ko) | 2017-02-20 |
JP5611993B2 (ja) | 2014-10-22 |
CN102342188A (zh) | 2012-02-01 |
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