HK1137469A1 - Organic solvent dispersion of conductive polymer/dopant and composition containing the dispersion - Google Patents

Organic solvent dispersion of conductive polymer/dopant and composition containing the dispersion

Info

Publication number
HK1137469A1
HK1137469A1 HK10102322.3A HK10102322A HK1137469A1 HK 1137469 A1 HK1137469 A1 HK 1137469A1 HK 10102322 A HK10102322 A HK 10102322A HK 1137469 A1 HK1137469 A1 HK 1137469A1
Authority
HK
Hong Kong
Prior art keywords
dispersion
dopant
organic solvent
composition containing
conductive polymer
Prior art date
Application number
HK10102322.3A
Other languages
English (en)
Inventor
Masakazu Hirazaki
Toshiyuki Kimura
Tomohide Fukuzaki
Original Assignee
Arakawa Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Chem Ind filed Critical Arakawa Chem Ind
Publication of HK1137469A1 publication Critical patent/HK1137469A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C08J3/11—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids from solid polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
HK10102322.3A 2007-01-17 2010-03-04 Organic solvent dispersion of conductive polymer/dopant and composition containing the dispersion HK1137469A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007007579 2007-01-17
JP2007046242 2007-02-26
PCT/JP2008/050550 WO2008088028A1 (ja) 2007-01-17 2008-01-17 導電性高分子／ドーパントの有機溶媒分散体および該分散体を含有する組成物

Publications (1)

Publication Number Publication Date
HK1137469A1 true HK1137469A1 (en) 2010-07-30

Family

ID=39636029

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10102322.3A HK1137469A1 (en) 2007-01-17 2010-03-04 Organic solvent dispersion of conductive polymer/dopant and composition containing the dispersion

Country Status (6)

Country Link
JP (1) JP5316000B2 (zh)
KR (1) KR101447473B1 (zh)
CN (1) CN101583671B (zh)
HK (1) HK1137469A1 (zh)
TW (1) TWI419924B (zh)
WO (1) WO2008088028A1 (zh)

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JP2010257954A (ja) * 2009-04-02 2010-11-11 Sanyo Chem Ind Ltd リチウムイオン二次電池正極用結着剤及び正極材料
JP5537862B2 (ja) * 2009-08-12 2014-07-02 信越ポリマー株式会社 導電性高分子溶液および帯電防止性シート
JP5526660B2 (ja) * 2009-08-31 2014-06-18 三洋電機株式会社 導電性高分子膜、導電性高分子膜の製造方法、および電子デバイスの製造方法
JP5355313B2 (ja) * 2009-09-09 2013-11-27 テイカ株式会社 有機溶剤系導電性高分子分散液の製造方法およびその応用
KR101040739B1 (ko) * 2010-01-25 2011-06-10 전북대학교산학협력단 대전방지난반사 필름 및 그의 제조방법
JP5450307B2 (ja) * 2010-07-29 2014-03-26 信越ポリマー株式会社 導電性高分子溶液の製造方法
JP5682887B2 (ja) * 2010-11-02 2015-03-11 学校法人東京理科大学 導電性高分子ナノ微粒子分散溶液、当該分散溶液を用いた導電薄膜及び導電薄膜の製造方法
JP5759748B2 (ja) * 2011-02-25 2015-08-05 Hoya株式会社 プラスチックレンズ
JP5441952B2 (ja) * 2011-05-17 2014-03-12 Ｎｅｃトーキン株式会社 導電性高分子懸濁溶液およびその製造方法、導電性高分子材料、ならびに電解コンデンサおよびその製造方法
JP6017148B2 (ja) 2012-02-23 2016-10-26 Ｎｅｃトーキン株式会社 導電性高分子懸濁溶液、導電性高分子材料、ならびに電解コンデンサおよびその製造方法
CN104059432B (zh) * 2013-03-20 2016-01-06 北京阿格蕾雅科技发展有限公司 透明碳纳米管高分子复合导电墨水及其制备方法
CN104194280A (zh) * 2014-07-25 2014-12-10 深圳新宙邦科技股份有限公司 一种聚噻吩类衍生物水分散体及其制备方法
JP6380912B2 (ja) * 2015-02-25 2018-08-29 荒川化学工業株式会社 導電性コーティング剤、導電層及び導電層を備える基材
JP6640052B2 (ja) * 2015-08-26 2020-02-05 信越ポリマー株式会社 帯電防止性成形体の製造方法
JP6611317B2 (ja) * 2015-09-17 2019-11-27 信越ポリマー株式会社 導電性高分子分散液及びその製造方法、導電性フィルム及びその製造方法
JP6471661B2 (ja) * 2015-09-24 2019-02-20 日信化学工業株式会社 高誘電率樹脂成形物、フィルム及び電気・電子部品
JP6614927B2 (ja) * 2015-11-06 2019-12-04 信越ポリマー株式会社 キャパシタ及びその製造方法
KR101958203B1 (ko) * 2016-09-02 2019-03-14 주식회사 포리스 Pedot/pss 분산액, 상기 분산액으로 제조된 광경화형 대전 방지 코팅조성물, 및 상기 코팅조성물을 포함하는 집진통
KR102083074B1 (ko) * 2018-01-29 2020-02-28 도레이첨단소재 주식회사 대전방지용 도포액 조성물 및 이를 이용한 대전방지 폴리에스테르 필름
CN110010353B (zh) * 2018-09-29 2021-01-01 深圳新宙邦科技股份有限公司 一种聚合物分散体及固态电解电容器
CN109374696B (zh) * 2018-10-29 2021-03-26 玉环德谷新材料科技有限公司 一种气敏传感器的制备方法
JP2022068706A (ja) * 2020-10-22 2022-05-10 富士フイルムビジネスイノベーション株式会社 液状組成物、金属光沢膜及び物品
CN113345620B (zh) * 2021-05-21 2022-11-04 四川大学 一种均相导电高分子溶液及其制备方法

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KR100442408B1 (ko) * 1998-11-05 2004-11-06 제일모직주식회사 고전도성및고투명성을갖는폴리티오펜계전도성고분자용액조성물
US6692662B2 (en) 2001-02-16 2004-02-17 Elecon, Inc. Compositions produced by solvent exchange methods and uses thereof
US7455793B2 (en) * 2004-03-31 2008-11-25 E.I. Du Pont De Nemours And Company Non-aqueous dispersions comprising electrically doped conductive polymers and colloid-forming polymeric acids
WO2006025262A1 (ja) * 2004-08-30 2006-03-09 Shin-Etsu Polymer Co., Ltd. 導電性組成物及び導電性架橋体、コンデンサ及びその製造方法、並びに帯電防止塗料、帯電防止膜、帯電防止フィルム、光学フィルタ、及び光情報記録媒体
JP4689222B2 (ja) * 2004-09-22 2011-05-25 信越ポリマー株式会社 導電性塗布膜およびその製造方法
JP5283818B2 (ja) 2004-10-08 2013-09-04 信越ポリマー株式会社 導電性組成物及びその製造方法
CN101712764A (zh) * 2005-02-16 2010-05-26 日产化学工业株式会社 固有导电性高分子的有机溶剂分散液的制造方法
JP4776950B2 (ja) 2005-03-11 2011-09-21 信越ポリマー株式会社 導電性高分子溶液の製造方法
JP5380778B2 (ja) * 2006-02-24 2014-01-08 東洋インキＳｃホールディングス株式会社 導電性組成物

Also Published As

Publication number Publication date
CN101583671A (zh) 2009-11-18
CN101583671B (zh) 2012-05-23
WO2008088028A1 (ja) 2008-07-24
KR20090104807A (ko) 2009-10-06
JPWO2008088028A1 (ja) 2010-05-13
JP5316000B2 (ja) 2013-10-16
TW200837117A (en) 2008-09-16
TWI419924B (zh) 2013-12-21
KR101447473B1 (ko) 2014-10-06

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230115