HK1128360A1 - Package for a light emitting diode with integrated electrostatic discharge protection - Google Patents
Package for a light emitting diode with integrated electrostatic discharge protectionInfo
- Publication number
- HK1128360A1 HK1128360A1 HK09107474.1A HK09107474A HK1128360A1 HK 1128360 A1 HK1128360 A1 HK 1128360A1 HK 09107474 A HK09107474 A HK 09107474A HK 1128360 A1 HK1128360 A1 HK 1128360A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- package
- light emitting
- emitting diode
- electrostatic discharge
- discharge protection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/336,094 US7528422B2 (en) | 2006-01-20 | 2006-01-20 | Package for a light emitting element with integrated electrostatic discharge protection |
| PCT/IB2007/000543 WO2007083244A2 (en) | 2006-01-20 | 2007-01-16 | Package for a light emitting diode with integrated electrostatic discharge protection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK1128360A1 true HK1128360A1 (en) | 2009-10-23 |
Family
ID=38235266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK09107474.1A HK1128360A1 (en) | 2006-01-20 | 2009-08-14 | Package for a light emitting diode with integrated electrostatic discharge protection |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7528422B2 (xx) |
| EP (1) | EP1974381B1 (xx) |
| JP (1) | JP2009524234A (xx) |
| KR (1) | KR101262314B1 (xx) |
| CN (1) | CN101371358B (xx) |
| HK (1) | HK1128360A1 (xx) |
| TW (1) | TW200746466A (xx) |
| WO (1) | WO2007083244A2 (xx) |
Families Citing this family (58)
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| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
| TWI303872B (en) * | 2006-03-13 | 2008-12-01 | Ind Tech Res Inst | High power light emitting device assembly with esd preotection ability and the method of manufacturing the same |
| EP1848042A1 (en) * | 2006-04-21 | 2007-10-24 | LEXEDIS Lighting GmbH | LED package with submount |
| US7889421B2 (en) * | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
| KR100845856B1 (ko) * | 2006-12-21 | 2008-07-14 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
| US20100181590A1 (en) * | 2007-06-25 | 2010-07-22 | Jen-Shyan Chen | Light-emitting diode illuminating apparatus |
| DE102007044198A1 (de) * | 2007-09-17 | 2009-03-19 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement, Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Modul |
| US8866169B2 (en) * | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| US7732829B2 (en) * | 2008-02-05 | 2010-06-08 | Hymite A/S | Optoelectronic device submount |
| JP5104385B2 (ja) * | 2008-02-20 | 2012-12-19 | 豊田合成株式会社 | Ｌｅｄランプモジュール |
| US8188595B2 (en) * | 2008-08-13 | 2012-05-29 | Progressive Cooling Solutions, Inc. | Two-phase cooling for light-emitting devices |
| KR101012936B1 (ko) * | 2008-09-29 | 2011-02-08 | 한국광기술원 | 광투과성 기판을 사용하여 봉지된 발광다이오드 패키지 및 그의 제조방법 |
| TW201034256A (en) * | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
| US20100176507A1 (en) * | 2009-01-14 | 2010-07-15 | Hymite A/S | Semiconductor-based submount with electrically conductive feed-throughs |
| US8729591B2 (en) | 2009-02-13 | 2014-05-20 | Tsmc Solid State Lighting Ltd. | Opto-electronic device package with a semiconductor-based sub-mount having SMD metal contacts |
| US9000466B1 (en) | 2010-08-23 | 2015-04-07 | Soraa, Inc. | Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening |
| US8400064B2 (en) * | 2009-09-09 | 2013-03-19 | Koninklijke Philips Electronics N.V. | Zener diode protection network in submount for LEDs connected in series |
| US8207554B2 (en) | 2009-09-11 | 2012-06-26 | Soraa, Inc. | System and method for LED packaging |
| US8933644B2 (en) | 2009-09-18 | 2015-01-13 | Soraa, Inc. | LED lamps with improved quality of light |
| US8575642B1 (en) | 2009-10-30 | 2013-11-05 | Soraa, Inc. | Optical devices having reflection mode wavelength material |
| US8586963B2 (en) * | 2009-12-08 | 2013-11-19 | Lehigh University | Semiconductor light-emitting devices having concave microstructures providing improved light extraction efficiency and method for producing same |
| US8905588B2 (en) | 2010-02-03 | 2014-12-09 | Sorra, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| US10147850B1 (en) | 2010-02-03 | 2018-12-04 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| WO2011109442A2 (en) * | 2010-03-02 | 2011-09-09 | Oliver Steven D | Led packaging with integrated optics and methods of manufacturing the same |
| DE112010005894T5 (de) | 2010-09-21 | 2013-07-18 | Kuo-Kuang Chang | Herstellungsverfahren für Leuchtdioden mit Gehäuse |
| US8610161B2 (en) * | 2010-10-28 | 2013-12-17 | Tsmc Solid State Lighting Ltd. | Light emitting diode optical emitter with transparent electrical connectors |
| US8896235B1 (en) | 2010-11-17 | 2014-11-25 | Soraa, Inc. | High temperature LED system using an AC power source |
| DE202010016958U1 (de) * | 2010-12-23 | 2011-06-27 | Automotive Lighting Reutlingen GmbH, 72762 | Leuchtmodul für eine Beleuchtungseinrichtung eines Kraftfahrzeugs mit auf einem Silizium-Substrat angeordneten Halbleiterlichtquellen |
| US8349628B2 (en) * | 2011-03-22 | 2013-01-08 | Tsmc Solid State Lighting Ltd. | Methods of fabricating light emitting diode devices |
| KR101850432B1 (ko) * | 2011-07-11 | 2018-04-19 | 엘지이노텍 주식회사 | 발광 모듈 |
| US20140159061A1 (en) * | 2011-08-25 | 2014-06-12 | Panasonic Corporation | Protection element and light emitting device using same |
| US9490239B2 (en) | 2011-08-31 | 2016-11-08 | Micron Technology, Inc. | Solid state transducers with state detection, and associated systems and methods |
| US8809897B2 (en) | 2011-08-31 | 2014-08-19 | Micron Technology, Inc. | Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods |
| US9488324B2 (en) | 2011-09-02 | 2016-11-08 | Soraa, Inc. | Accessories for LED lamp systems |
| KR101920211B1 (ko) | 2011-12-19 | 2018-11-21 | 엘지이노텍 주식회사 | 발광소자 어레이 |
| US8985794B1 (en) | 2012-04-17 | 2015-03-24 | Soraa, Inc. | Providing remote blue phosphors in an LED lamp |
| DE102012108627B4 (de) | 2012-09-14 | 2021-06-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische Halbleitervorrichtung und Trägerverbund |
| US9978904B2 (en) | 2012-10-16 | 2018-05-22 | Soraa, Inc. | Indium gallium nitride light emitting devices |
| US9761763B2 (en) | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
| KR102071424B1 (ko) * | 2013-01-08 | 2020-01-30 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| US8994033B2 (en) | 2013-07-09 | 2015-03-31 | Soraa, Inc. | Contacts for an n-type gallium and nitrogen substrate for optical devices |
| US9419189B1 (en) | 2013-11-04 | 2016-08-16 | Soraa, Inc. | Small LED source with high brightness and high efficiency |
| CN104752579A (zh) * | 2013-12-25 | 2015-07-01 | 常州欧密格光电科技有限公司 | 超薄高效能Flash LED元件及其制备工艺 |
| US9209141B2 (en) | 2014-02-26 | 2015-12-08 | International Business Machines Corporation | Shielded package assemblies with integrated capacitor |
| US9722145B2 (en) | 2015-06-24 | 2017-08-01 | Sharp Laboratories Of America, Inc. | Light emitting device and fluidic manufacture thereof |
| US9892944B2 (en) | 2016-06-23 | 2018-02-13 | Sharp Kabushiki Kaisha | Diodes offering asymmetric stability during fluidic assembly |
| US9985190B2 (en) | 2016-05-18 | 2018-05-29 | eLux Inc. | Formation and structure of post enhanced diodes for orientation control |
| US10249599B2 (en) | 2016-06-29 | 2019-04-02 | eLux, Inc. | Laminated printed color conversion phosphor sheets |
| US9917226B1 (en) | 2016-09-15 | 2018-03-13 | Sharp Kabushiki Kaisha | Substrate features for enhanced fluidic assembly of electronic devices |
| US9755110B1 (en) | 2016-07-27 | 2017-09-05 | Sharp Laboratories Of America, Inc. | Substrate with topological features for steering fluidic assembly LED disks |
| DE102016100585A1 (de) | 2016-01-14 | 2017-07-20 | Epcos Ag | Bauelementsubstrat mit Schutzfunktion und Verfahren zur Herstellung |
| US9627437B1 (en) | 2016-06-30 | 2017-04-18 | Sharp Laboratories Of America, Inc. | Patterned phosphors in through hole via (THV) glass |
| US10243097B2 (en) | 2016-09-09 | 2019-03-26 | eLux Inc. | Fluidic assembly using tunable suspension flow |
| US9837390B1 (en) | 2016-11-07 | 2017-12-05 | Corning Incorporated | Systems and methods for creating fluidic assembly structures on a substrate |
| JP7233304B2 (ja) * | 2019-05-30 | 2023-03-06 | スタンレー電気株式会社 | 発光装置、および、その製造方法 |
| CN113394320B (zh) | 2020-03-11 | 2023-04-07 | 隆达电子股份有限公司 | 发光二极管封装结构 |
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| JPS6489544A (en) * | 1987-09-30 | 1989-04-04 | Nec Corp | Cap for photosemiconductor device case |
| JPH02125345U (xx) * | 1989-03-27 | 1990-10-16 | ||
| JPH11161197A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 画像表示装置 |
| JPH11251644A (ja) | 1998-02-27 | 1999-09-17 | Matsushita Electron Corp | 半導体発光装置 |
| US5914501A (en) * | 1998-08-27 | 1999-06-22 | Hewlett-Packard Company | Light emitting diode assembly having integrated electrostatic discharge protection |
| US6274924B1 (en) * | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
| JP2001015815A (ja) | 1999-04-28 | 2001-01-19 | Sanken Electric Co Ltd | 半導体発光装置 |
| DE10035564B4 (de) * | 2000-07-21 | 2006-03-30 | Conti Temic Microelectronic Gmbh | Mikromechanisches Gehäuse |
| JP5110744B2 (ja) * | 2000-12-21 | 2012-12-26 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 発光装置及びその製造方法 |
| US6531328B1 (en) | 2001-10-11 | 2003-03-11 | Solidlite Corporation | Packaging of light-emitting diode |
| US6818464B2 (en) * | 2001-10-17 | 2004-11-16 | Hymite A/S | Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes |
| JP2003158301A (ja) * | 2001-11-22 | 2003-05-30 | Citizen Electronics Co Ltd | 発光ダイオード |
| US7244965B2 (en) * | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
| US6969204B2 (en) * | 2002-11-26 | 2005-11-29 | Hymite A/S | Optical package with an integrated lens and optical assemblies incorporating the package |
| US6856717B2 (en) * | 2003-03-24 | 2005-02-15 | Hymite A/S | Package with a light emitting device |
| US7095053B2 (en) * | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
| US6876008B2 (en) * | 2003-07-31 | 2005-04-05 | Lumileds Lighting U.S., Llc | Mount for semiconductor light emitting device |
| US7518158B2 (en) * | 2003-12-09 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices and submounts |
| TWI227570B (en) * | 2003-12-11 | 2005-02-01 | South Epitaxy Corp | Light-emitting diode packaging structure |
| US7165896B2 (en) * | 2004-02-12 | 2007-01-23 | Hymite A/S | Light transmitting modules with optical power monitoring |
| TW200529465A (en) * | 2004-02-27 | 2005-09-01 | Opto Tech Corp | Light-emitting device with power supply substrate having reflective layer |
| US20050269688A1 (en) * | 2004-06-03 | 2005-12-08 | Lior Shiv | Microelectromechanical systems (MEMS) devices integrated in a hermetically sealed package |
| KR100623024B1 (ko) * | 2004-06-10 | 2006-09-19 | 엘지전자 주식회사 | 고출력 ｌｅｄ 패키지 |
| US6881980B1 (en) | 2004-06-17 | 2005-04-19 | Chunghwa Picture Tubes, Ltd. | Package structure of light emitting diode |
| US7329905B2 (en) * | 2004-06-30 | 2008-02-12 | Cree, Inc. | Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices |
| CN2720645Y (zh) * | 2004-07-29 | 2005-08-24 | 亿光电子工业股份有限公司 | 发光二极管防静电封装结构 |
-
2006
- 2006-01-20 US US11/336,094 patent/US7528422B2/en active Active
-
2007
- 2007-01-16 EP EP07705678.6A patent/EP1974381B1/en active Active
- 2007-01-16 WO PCT/IB2007/000543 patent/WO2007083244A2/en active Application Filing
- 2007-01-16 CN CN2007800027587A patent/CN101371358B/zh active Active
- 2007-01-16 JP JP2008550873A patent/JP2009524234A/ja active Pending
- 2007-01-19 TW TW096101985A patent/TW200746466A/zh unknown
-
2008
- 2008-07-18 KR KR1020087017700A patent/KR101262314B1/ko active IP Right Grant
-
2009
- 2009-08-14 HK HK09107474.1A patent/HK1128360A1/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN101371358B (zh) | 2010-06-23 |
| WO2007083244A2 (en) | 2007-07-26 |
| US20070170450A1 (en) | 2007-07-26 |
| KR101262314B1 (ko) | 2013-05-08 |
| CN101371358A (zh) | 2009-02-18 |
| KR20080086901A (ko) | 2008-09-26 |
| US7528422B2 (en) | 2009-05-05 |
| JP2009524234A (ja) | 2009-06-25 |
| EP1974381A2 (en) | 2008-10-01 |
| TW200746466A (en) | 2007-12-16 |
| WO2007083244A3 (en) | 2007-10-18 |
| EP1974381B1 (en) | 2017-10-11 |
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