TW200746466A - Package for a light emitting element with integrated electrostatic discharge protection - Google Patents

Package for a light emitting element with integrated electrostatic discharge protection

Info

Publication number
TW200746466A
TW200746466A TW096101985A TW96101985A TW200746466A TW 200746466 A TW200746466 A TW 200746466A TW 096101985 A TW096101985 A TW 096101985A TW 96101985 A TW96101985 A TW 96101985A TW 200746466 A TW200746466 A TW 200746466A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting element
package
electrostatic discharge
discharge protection
Prior art date
Application number
TW096101985A
Other languages
English (en)
Inventor
Thomas Murphy
Original Assignee
Hymite As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hymite As filed Critical Hymite As
Publication of TW200746466A publication Critical patent/TW200746466A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
TW096101985A 2006-01-20 2007-01-19 Package for a light emitting element with integrated electrostatic discharge protection TW200746466A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/336,094 US7528422B2 (en) 2006-01-20 2006-01-20 Package for a light emitting element with integrated electrostatic discharge protection

Publications (1)

Publication Number Publication Date
TW200746466A true TW200746466A (en) 2007-12-16

Family

ID=38235266

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101985A TW200746466A (en) 2006-01-20 2007-01-19 Package for a light emitting element with integrated electrostatic discharge protection

Country Status (8)

Country Link
US (1) US7528422B2 (zh)
EP (1) EP1974381B1 (zh)
JP (1) JP2009524234A (zh)
KR (1) KR101262314B1 (zh)
CN (1) CN101371358B (zh)
HK (1) HK1128360A1 (zh)
TW (1) TW200746466A (zh)
WO (1) WO2007083244A2 (zh)

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TWI514926B (zh) * 2009-09-09 2015-12-21 Koninkl Philips Electronics Nv 在用於串聯連接發光二極體的基台之齊納二極體保護網路
US11670748B2 (en) 2020-03-11 2023-06-06 Lextar Electronics Corporation LED package structure

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI514926B (zh) * 2009-09-09 2015-12-21 Koninkl Philips Electronics Nv 在用於串聯連接發光二極體的基台之齊納二極體保護網路
US11670748B2 (en) 2020-03-11 2023-06-06 Lextar Electronics Corporation LED package structure

Also Published As

Publication number Publication date
WO2007083244A3 (en) 2007-10-18
CN101371358A (zh) 2009-02-18
HK1128360A1 (en) 2009-10-23
JP2009524234A (ja) 2009-06-25
EP1974381B1 (en) 2017-10-11
KR20080086901A (ko) 2008-09-26
US20070170450A1 (en) 2007-07-26
CN101371358B (zh) 2010-06-23
EP1974381A2 (en) 2008-10-01
KR101262314B1 (ko) 2013-05-08
US7528422B2 (en) 2009-05-05
WO2007083244A2 (en) 2007-07-26

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