HUE048971T2 - Fénykibocsátó dióda modul - Google Patents
Fénykibocsátó dióda modulInfo
- Publication number
- HUE048971T2 HUE048971T2 HUE12198155A HUE12198155A HUE048971T2 HU E048971 T2 HUE048971 T2 HU E048971T2 HU E12198155 A HUE12198155 A HU E12198155A HU E12198155 A HUE12198155 A HU E12198155A HU E048971 T2 HUE048971 T2 HU E048971T2
- Authority
- HU
- Hungary
- Prior art keywords
- light emitting
- emitting diode
- diode module
- module
- light
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06022064A EP1914809A1 (en) | 2006-10-20 | 2006-10-20 | Cover for optoelectronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HUE048971T2 true HUE048971T2 (hu) | 2020-09-28 |
Family
ID=37846062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HUE12198155A HUE048971T2 (hu) | 2006-10-20 | 2007-10-16 | Fénykibocsátó dióda modul |
Country Status (6)
| Country | Link |
|---|---|
| EP (4) | EP1914809A1 (hu) |
| DE (1) | DE202007019330U1 (hu) |
| HU (1) | HUE048971T2 (hu) |
| PL (1) | PL2573829T3 (hu) |
| TW (2) | TWI435469B (hu) |
| WO (1) | WO2008046583A1 (hu) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8247827B2 (en) * | 2008-09-30 | 2012-08-21 | Bridgelux, Inc. | LED phosphor deposition |
| EP2448028B1 (en) | 2010-10-29 | 2017-05-31 | Nichia Corporation | Light emitting apparatus and production method thereof |
| US8373183B2 (en) | 2011-02-22 | 2013-02-12 | Hong Kong Applied Science and Technology Research Institute Company Limited | LED package for uniform color emission |
| CN103149648B (zh) * | 2011-12-07 | 2016-03-02 | 鸿富锦精密工业（深圳）有限公司 | 光电模组 |
| AT14124U1 (de) | 2012-02-13 | 2015-04-15 | Tridonic Jennersdorf Gmbh | LED-Modul mit Flächenverguß |
| DE102013224600A1 (de) * | 2013-11-29 | 2015-06-03 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements |
| EP3598510B1 (en) | 2018-07-18 | 2022-02-23 | Lumileds LLC | Light emitting diode device and producing methods thereof |
| CN111477732B (zh) | 2019-01-24 | 2021-10-08 | 隆达电子股份有限公司 | 发光装置 |
| DE102019119182A1 (de) * | 2019-07-16 | 2021-01-21 | Wobben Properties Gmbh | Verfahren zum Herstellen eines Segmentblechpaketes für einen Stator eines Generators einer Windenergieanlage |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07297324A (ja) | 1994-04-25 | 1995-11-10 | Sony Corp | 半導体装置およびその製造方法 |
| JP3393247B2 (ja) | 1995-09-29 | 2003-04-07 | ソニー株式会社 | 光学装置およびその製造方法 |
| DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| NL1004651C2 (nl) | 1996-11-29 | 1998-06-03 | Nedcard | Werkwijze voor het inkapselen van een chip op een drager. |
| US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
| EP1059667A3 (en) * | 1999-06-09 | 2007-07-04 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
| US6680568B2 (en) | 2000-02-09 | 2004-01-20 | Nippon Leiz Corporation | Light source |
| DE10024336A1 (de) * | 2000-05-17 | 2001-11-22 | Heidenhain Gmbh Dr Johannes | Bauelementanordnung und Verfahren zur Herstellung einer Bauelementanordnung |
| JP4101468B2 (ja) | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
| DE10153259A1 (de) | 2001-10-31 | 2003-05-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| DE10245946C1 (de) * | 2002-09-30 | 2003-10-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Lichtquellenmoduls |
| DE10310844B4 (de) | 2003-03-10 | 2021-06-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement mit einem Gehäusekörper aus Kunststoff |
| US7411222B2 (en) * | 2003-11-14 | 2008-08-12 | Harison Toshiba Lighting Corporation | Package for light emitting element and manufacturing method thereof |
| EP1751806B1 (de) * | 2004-05-31 | 2019-09-11 | OSRAM Opto Semiconductors GmbH | Optoelektronisches halbleiterbauelement und gehäuse-grundkörper für ein derartiges bauelement |
| EP1779421A1 (en) | 2004-08-06 | 2007-05-02 | Hitek Power Corporation | Selective encapsulation of electronic components |
| JP2006066786A (ja) | 2004-08-30 | 2006-03-09 | Seiwa Electric Mfg Co Ltd | 発光ダイオード |
| DE102004053116A1 (de) | 2004-11-03 | 2006-05-04 | Tridonic Optoelectronics Gmbh | Leuchtdioden-Anordnung mit Farbkonversions-Material |
| US7365371B2 (en) * | 2005-08-04 | 2008-04-29 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
-
2006
- 2006-10-20 EP EP06022064A patent/EP1914809A1/en not_active Withdrawn
-
2007
- 2007-10-16 EP EP10184330.8A patent/EP2290716B1/en active Active
- 2007-10-16 EP EP07819030.3A patent/EP2082441B1/en active Active
- 2007-10-16 EP EP12198155.9A patent/EP2573829B8/en active Active
- 2007-10-16 PL PL12198155T patent/PL2573829T3/pl unknown
- 2007-10-16 HU HUE12198155A patent/HUE048971T2/hu unknown
- 2007-10-16 DE DE202007019330U patent/DE202007019330U1/de not_active Expired - Lifetime
- 2007-10-16 WO PCT/EP2007/008960 patent/WO2008046583A1/en active Search and Examination
- 2007-10-19 TW TW096139378A patent/TWI435469B/zh active
- 2007-10-19 TW TW101212117U patent/TWM456497U/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP2290716A3 (en) | 2013-01-23 |
| EP2290716A2 (en) | 2011-03-02 |
| WO2008046583A1 (en) | 2008-04-24 |
| EP2082441A1 (en) | 2009-07-29 |
| EP2290716B1 (en) | 2019-06-12 |
| EP2573829A3 (en) | 2017-01-25 |
| EP2573829B1 (en) | 2020-04-22 |
| TWM456497U (zh) | 2013-07-01 |
| EP1914809A1 (en) | 2008-04-23 |
| TW200834985A (en) | 2008-08-16 |
| PL2573829T3 (pl) | 2020-11-30 |
| EP2082441B1 (en) | 2013-12-18 |
| EP2573829B8 (en) | 2020-06-10 |
| DE202007019330U1 (de) | 2011-10-27 |
| TWI435469B (zh) | 2014-04-21 |
| EP2573829A2 (en) | 2013-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI319629B (en) | Light emitting diode module | |
| EP2010819A4 (en) | PACKAGES OF LIGHT-EMITTING DIODES | |
| HK1163225A1 (en) | Light emitting diode module | |
| TWI372918B (en) | Edge lighting light-emitting diode backlight module | |
| EP1991907A4 (en) | LED PROJECTION SYSTEM | |
| IL204616A0 (en) | Light emitting diode recessed light fixture | |
| GB2447091B8 (en) | Vertical light emitting diodes | |
| PL2143303T3 (pl) | Zasilanie diod emitujących światło | |
| EP2264793B8 (en) | Light emitting diode | |
| TWI341039B (en) | Light emitting diode apparatus | |
| EP2232595A4 (en) | LEUCHTDIODENKAPSELUNG | |
| HK1142461A1 (en) | Light emitting diode | |
| EP2347170A4 (en) | Light emitting diode emergency lighting module | |
| PL2082167T3 (pl) | Urządzenie oświetlające diodą emitującą światło | |
| TWM312020U (en) | Light emitting diode package structure | |
| GB0823453D0 (en) | Semiconductor light emitting element | |
| GB0818659D0 (en) | Light emitting element | |
| PL2573829T3 (pl) | Moduł diody elektroluminescencyjnej | |
| TWI350600B (en) | Semiconductor light emitting element | |
| TWI383518B (en) | Light emitting diode | |
| EP2006920A4 (en) | VERTICAL RESONATOR TYPE ELECTROLUMINESCENT DIODE | |
| EP2376835A4 (en) | LED LIGHTING BODIES | |
| EP2098778A4 (en) | LEDS LIGHTING DEVICE | |
| TWI370298B (en) | Backlight unit using light emitting diode | |
| TWI371093B (en) | Light emitting diode heatsink |