PL2573829T3 - Moduł diody elektroluminescencyjnej - Google Patents
Moduł diody elektroluminescencyjnejInfo
- Publication number
- PL2573829T3 PL2573829T3 PL12198155T PL12198155T PL2573829T3 PL 2573829 T3 PL2573829 T3 PL 2573829T3 PL 12198155 T PL12198155 T PL 12198155T PL 12198155 T PL12198155 T PL 12198155T PL 2573829 T3 PL2573829 T3 PL 2573829T3
- Authority
- PL
- Poland
- Prior art keywords
- light emitting
- emitting diode
- diode module
- module
- light
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06022064A EP1914809A1 (en) | 2006-10-20 | 2006-10-20 | Cover for optoelectronic components |
EP07819030.3A EP2082441B1 (en) | 2006-10-20 | 2007-10-16 | Light emitting diode module and method for manufacturing the same |
EP12198155.9A EP2573829B8 (en) | 2006-10-20 | 2007-10-16 | Light emitting diode module |
PCT/EP2007/008960 WO2008046583A1 (en) | 2006-10-20 | 2007-10-16 | Cover for optoelectronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
PL2573829T3 true PL2573829T3 (pl) | 2020-11-30 |
Family
ID=37846062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL12198155T PL2573829T3 (pl) | 2006-10-20 | 2007-10-16 | Moduł diody elektroluminescencyjnej |
Country Status (6)
Country | Link |
---|---|
EP (4) | EP1914809A1 (pl) |
DE (1) | DE202007019330U1 (pl) |
HU (1) | HUE048971T2 (pl) |
PL (1) | PL2573829T3 (pl) |
TW (2) | TWI435469B (pl) |
WO (1) | WO2008046583A1 (pl) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8247827B2 (en) * | 2008-09-30 | 2012-08-21 | Bridgelux, Inc. | LED phosphor deposition |
EP2448028B1 (en) * | 2010-10-29 | 2017-05-31 | Nichia Corporation | Light emitting apparatus and production method thereof |
US8373183B2 (en) | 2011-02-22 | 2013-02-12 | Hong Kong Applied Science and Technology Research Institute Company Limited | LED package for uniform color emission |
CN103149648B (zh) * | 2011-12-07 | 2016-03-02 | 鸿富锦精密工业(深圳)有限公司 | 光电模组 |
AT14124U1 (de) * | 2012-02-13 | 2015-04-15 | Tridonic Jennersdorf Gmbh | LED-Modul mit Flächenverguß |
DE102013224600A1 (de) * | 2013-11-29 | 2015-06-03 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements |
CN110349510A (zh) * | 2018-04-08 | 2019-10-18 | 北京环宇蓝博科技有限公司 | 一种用于led显示屏幕的幕罩 |
EP3598510B1 (en) * | 2018-07-18 | 2022-02-23 | Lumileds LLC | Light emitting diode device and producing methods thereof |
CN111477732B (zh) | 2019-01-24 | 2021-10-08 | 隆达电子股份有限公司 | 发光装置 |
DE102019119182A1 (de) * | 2019-07-16 | 2021-01-21 | Wobben Properties Gmbh | Verfahren zum Herstellen eines Segmentblechpaketes für einen Stator eines Generators einer Windenergieanlage |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07297324A (ja) | 1994-04-25 | 1995-11-10 | Sony Corp | 半導体装置およびその製造方法 |
JP3393247B2 (ja) * | 1995-09-29 | 2003-04-07 | ソニー株式会社 | 光学装置およびその製造方法 |
DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
NL1004651C2 (nl) * | 1996-11-29 | 1998-06-03 | Nedcard | Werkwijze voor het inkapselen van een chip op een drager. |
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
EP1059667A3 (en) * | 1999-06-09 | 2007-07-04 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
CN1225801C (zh) | 2000-02-09 | 2005-11-02 | 日本光源股份有限公司 | 光源装置 |
DE10024336A1 (de) * | 2000-05-17 | 2001-11-22 | Heidenhain Gmbh Dr Johannes | Bauelementanordnung und Verfahren zur Herstellung einer Bauelementanordnung |
JP4101468B2 (ja) | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
DE10153259A1 (de) | 2001-10-31 | 2003-05-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE10245946C1 (de) * | 2002-09-30 | 2003-10-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Lichtquellenmoduls |
DE10310844B4 (de) | 2003-03-10 | 2021-06-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement mit einem Gehäusekörper aus Kunststoff |
EP1641050B1 (en) * | 2003-11-14 | 2019-02-20 | Harison Toshiba Lighting Corporation | Semiconductor light-emitting element package and production method therefor |
US8975646B2 (en) * | 2004-05-31 | 2015-03-10 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and housing base for such a component |
WO2006017484A1 (en) | 2004-08-06 | 2006-02-16 | Hitek Power Corporation | Selective encapsulation of electronic components |
JP2006066786A (ja) * | 2004-08-30 | 2006-03-09 | Seiwa Electric Mfg Co Ltd | 発光ダイオード |
DE102004053116A1 (de) * | 2004-11-03 | 2006-05-04 | Tridonic Optoelectronics Gmbh | Leuchtdioden-Anordnung mit Farbkonversions-Material |
US7365371B2 (en) * | 2005-08-04 | 2008-04-29 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
-
2006
- 2006-10-20 EP EP06022064A patent/EP1914809A1/en not_active Withdrawn
-
2007
- 2007-10-16 EP EP10184330.8A patent/EP2290716B1/en active Active
- 2007-10-16 EP EP07819030.3A patent/EP2082441B1/en active Active
- 2007-10-16 HU HUE12198155A patent/HUE048971T2/hu unknown
- 2007-10-16 WO PCT/EP2007/008960 patent/WO2008046583A1/en active Search and Examination
- 2007-10-16 EP EP12198155.9A patent/EP2573829B8/en active Active
- 2007-10-16 PL PL12198155T patent/PL2573829T3/pl unknown
- 2007-10-16 DE DE202007019330U patent/DE202007019330U1/de not_active Expired - Lifetime
- 2007-10-19 TW TW096139378A patent/TWI435469B/zh active
- 2007-10-19 TW TW101212117U patent/TWM456497U/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200834985A (en) | 2008-08-16 |
EP1914809A1 (en) | 2008-04-23 |
EP2573829A3 (en) | 2017-01-25 |
EP2290716B1 (en) | 2019-06-12 |
EP2082441B1 (en) | 2013-12-18 |
HUE048971T2 (hu) | 2020-09-28 |
EP2573829B8 (en) | 2020-06-10 |
TWI435469B (zh) | 2014-04-21 |
EP2290716A2 (en) | 2011-03-02 |
EP2573829B1 (en) | 2020-04-22 |
EP2290716A3 (en) | 2013-01-23 |
EP2082441A1 (en) | 2009-07-29 |
WO2008046583A1 (en) | 2008-04-24 |
EP2573829A2 (en) | 2013-03-27 |
TWM456497U (zh) | 2013-07-01 |
DE202007019330U1 (de) | 2011-10-27 |
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