HK1099925A1 - Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel - Google Patents

Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel

Info

Publication number
HK1099925A1
HK1099925A1 HK07107510.9A HK07107510A HK1099925A1 HK 1099925 A1 HK1099925 A1 HK 1099925A1 HK 07107510 A HK07107510 A HK 07107510A HK 1099925 A1 HK1099925 A1 HK 1099925A1
Authority
HK
Hong Kong
Prior art keywords
cutter wheel
material substrate
manufacturing
fragile material
scribing
Prior art date
Application number
HK07107510.9A
Other languages
English (en)
Inventor
Kazuya Maekawa
Ryota Sakaguchi
Yoshitaka Miura
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34824510&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1099925(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of HK1099925A1 publication Critical patent/HK1099925A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
HK07107510.9A 2004-02-02 2007-07-13 Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel HK1099925A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004059772 2004-02-02
PCT/JP2005/001428 WO2005072926A1 (ja) 2004-02-02 2005-02-01 カッターホイールおよびこれを用いた脆性材料基板のスクライブ方法および分断方法、ならびにカッターホイールの製造方法

Publications (1)

Publication Number Publication Date
HK1099925A1 true HK1099925A1 (en) 2007-08-31

Family

ID=34824510

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07107510.9A HK1099925A1 (en) 2004-02-02 2007-07-13 Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel

Country Status (8)

Country Link
EP (2) EP2851172A1 (ja)
JP (4) JP5022602B2 (ja)
KR (7) KR20120068976A (ja)
CN (4) CN1914014B (ja)
HK (1) HK1099925A1 (ja)
SG (1) SG149824A1 (ja)
TW (5) TWI440613B (ja)
WO (1) WO2005072926A1 (ja)

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JP5022602B2 (ja) * 2004-02-02 2012-09-12 三星ダイヤモンド工業株式会社 カッターホイールおよびこれを用いた脆性材料基板のスクライブ方法および分断方法
AU2006266678A1 (en) * 2005-07-06 2007-01-11 Mitsuboshi Diamond Industrial Co., Ltd. Brittle material scribing wheel, method for manufacturing such brittle material scribing wheel, and scribing method, scribing apparatus and scribing tool using such brittle material scribing wheel
JP5139852B2 (ja) * 2008-03-17 2013-02-06 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
WO2009145026A1 (ja) * 2008-05-30 2009-12-03 三星ダイヤモンド工業株式会社 脆性材料基板の面取り方法
TWI432388B (zh) * 2008-06-05 2014-04-01 Mitsuboshi Diamond Ind Co Ltd Scribing method, method of marking the ceramic substrate and cutting method of ceramic substrate
CN101745990A (zh) * 2008-12-01 2010-06-23 孙春雨 一种切割脆性材料的刀轮及其加工方法
TWI477375B (zh) * 2009-05-08 2015-03-21 Sun Chun Yu Cutting wheel of brittle material and its processing method
JP5438422B2 (ja) * 2009-07-31 2014-03-12 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法並びに加工装置
CN102050568B (zh) * 2009-10-29 2013-02-13 孙春雨 一种切割玻璃材料的刀轮及其加工方法
JP5174112B2 (ja) * 2010-09-28 2013-04-03 三星ダイヤモンド工業株式会社 スクライビングホイール
JP5174118B2 (ja) * 2010-10-08 2013-04-03 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
JP5365602B2 (ja) * 2010-10-08 2013-12-11 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
JP5156080B2 (ja) 2010-11-05 2013-03-06 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
JP5244202B2 (ja) * 2011-01-27 2013-07-24 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
JP5966564B2 (ja) * 2011-06-08 2016-08-10 三星ダイヤモンド工業株式会社 スクライビングホイール及びスクライブ方法
JP5479424B2 (ja) * 2011-09-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料用スクライビングホイール、これを用いた脆性材料基板のスクライブ装置及びスクライブ工具
TWI474983B (zh) * 2011-10-04 2015-03-01 Mitsuboshi Diamond Ind Co Ltd Scoring Method and Breaking Method of Mother Substrate
JP2013079170A (ja) * 2011-10-04 2013-05-02 Mitsuboshi Diamond Industrial Co Ltd スクライブ方法
JP5867159B2 (ja) * 2012-02-27 2016-02-24 三星ダイヤモンド工業株式会社 セラミックス基板の割断方法
CN104136182B (zh) * 2012-03-08 2016-09-07 三星钻石工业股份有限公司 划线轮及其制造方法
JP5998574B2 (ja) * 2012-03-29 2016-09-28 三星ダイヤモンド工業株式会社 スクライビングホイールの製造方法
JP2013184388A (ja) * 2012-03-08 2013-09-19 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール及びその製造方法
JP2013233793A (ja) * 2012-04-13 2013-11-21 Mitsuboshi Diamond Industrial Co Ltd スクライビングホイール及びその製造方法
US10358375B2 (en) * 2012-07-27 2019-07-23 Ehwa Diamond Industrial Co., Ltd. Scribing wheel having fine structure recess
CN103864452B (zh) 2012-12-10 2015-10-21 富泰华精密电子（郑州）有限公司 面板及其制造方法
JP5499150B2 (ja) * 2012-12-21 2014-05-21 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
WO2014125999A1 (ja) 2013-02-12 2014-08-21 ポリプラスチックス株式会社 溝付き樹脂成形品
JP2015143174A (ja) * 2013-12-27 2015-08-06 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス板の製造方法、シートガラスのスクライブ装置、及びガラス板の製造装置
JP5884852B2 (ja) * 2014-04-18 2016-03-15 坂東機工株式会社 炭化珪素板のスクライブ方法及びスクライブ装置
JP2016007739A (ja) * 2014-06-24 2016-01-18 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
CN106660853B (zh) * 2014-08-04 2019-05-14 Agc 株式会社 无碱玻璃板的切割方法、显示面板的切割方法、无碱玻璃板的制造方法、以及显示面板的制造方法
CN104609717B (zh) * 2014-12-08 2016-09-07 福州大学 一种手工切割玻璃瓶的简易方法
KR101667229B1 (ko) 2015-05-19 2016-10-28 주식회사 비츠로테크 전원절환개폐기의 구동부 구조
JP6234418B2 (ja) * 2015-10-28 2017-11-22 三星ダイヤモンド工業株式会社 スクライビングホイール
JP2016106046A (ja) * 2015-12-28 2016-06-16 三星ダイヤモンド工業株式会社 スクライビングホイールの製造方法
TW202039193A (zh) * 2016-02-26 2020-11-01 日商三星鑽石工業股份有限公司 脆性基板之分斷方法
JP6234534B2 (ja) * 2016-10-31 2017-11-22 三星ダイヤモンド工業株式会社 スクライビングホイール
JP2018086785A (ja) * 2016-11-29 2018-06-07 三星ダイヤモンド工業株式会社 スクライビングホイール及びそのスクライブ方法
JP6255467B2 (ja) * 2016-11-30 2017-12-27 三星ダイヤモンド工業株式会社 スクライビングホイールの製造方法
KR20180071649A (ko) * 2016-12-20 2018-06-28 현대자동차주식회사 연성 평면 케이블, 이를 포함하는 차량 및 연성 평면 케이블의 제조방법
JP6869527B2 (ja) * 2016-12-28 2021-05-12 三星ダイヤモンド工業株式会社 スクライビングホイール
JP6897950B2 (ja) * 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 カッターホイール
JP6897951B2 (ja) * 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 カッターホイール
CN107672065B (zh) * 2017-10-10 2019-04-05 新昌县群娇农业发展有限公司 硅片的裂片装置
CN110526563A (zh) * 2019-09-09 2019-12-03 东莞通华液晶有限公司 一种薄型液晶玻璃基板的切割裂片方法
JP2022038435A (ja) * 2020-08-26 2022-03-10 ファインテック株式会社 脆性材料基板用のスクライビングホイール及びその製造方法
CN113075908B (zh) * 2021-03-23 2022-04-19 王豪 数控雕铣加工宝玉石工艺品的方法

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Also Published As

Publication number Publication date
KR101267832B1 (ko) 2013-05-27
KR20120121922A (ko) 2012-11-06
JP2011207760A (ja) 2011-10-20
KR20100028659A (ko) 2010-03-12
KR101203903B1 (ko) 2012-11-23
TW201206853A (en) 2012-02-16
KR101185753B1 (ko) 2012-09-26
CN102161219A (zh) 2011-08-24
JP5022602B2 (ja) 2012-09-12
CN1914014A (zh) 2007-02-14
TWI532694B (zh) 2016-05-11
TWI435852B (zh) 2014-05-01
KR101213020B1 (ko) 2012-12-18
CN102161218A (zh) 2011-08-24
JP2011213589A (ja) 2011-10-27
KR20120068976A (ko) 2012-06-27
TW201425247A (zh) 2014-07-01
JP5452547B2 (ja) 2014-03-26
KR20110074940A (ko) 2011-07-04
TW200536796A (en) 2005-11-16
CN102161218B (zh) 2015-03-25
JP5695134B2 (ja) 2015-04-01
KR20120068975A (ko) 2012-06-27
TWI466838B (zh) 2015-01-01
CN1914014B (zh) 2011-04-06
JP2013199131A (ja) 2013-10-03
CN101774754A (zh) 2010-07-14
WO2005072926A1 (ja) 2005-08-11
JPWO2005072926A1 (ja) 2007-09-13
TW201141800A (en) 2011-12-01
KR101213018B1 (ko) 2012-12-18
EP2851172A1 (en) 2015-03-25
KR20060122926A (ko) 2006-11-30
TWI435853B (zh) 2014-05-01
TWI440613B (zh) 2014-06-11
SG149824A1 (en) 2009-02-27
TW201144244A (en) 2011-12-16
CN101774754B (zh) 2015-11-25
KR20120108060A (ko) 2012-10-04
JP5185412B2 (ja) 2013-04-17
EP1712339A4 (en) 2010-03-24
EP1712339A1 (en) 2006-10-18

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Effective date: 20210201