HK1099129A1 - Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same - Google Patents

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Info

Publication number
HK1099129A1
HK1099129A1 HK07106585.1A HK07106585A HK1099129A1 HK 1099129 A1 HK1099129 A1 HK 1099129A1 HK 07106585 A HK07106585 A HK 07106585A HK 1099129 A1 HK1099129 A1 HK 1099129A1
Authority
HK
Hong Kong
Prior art keywords
die
thermoelectric elements
microelectronic assembly
cool
making
Prior art date
Application number
HK07106585.1A
Other languages
English (en)
Inventor
Shriram Ramanathan
Sarah Kim
Richard Scott List
Gregory Chrysler
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of HK1099129A1 publication Critical patent/HK1099129A1/xx

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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/367—Cooling facilitated by shape of device
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
HK07106585.1A 2003-10-08 2007-06-20 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same HK1099129A1 (en)

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US10/682,137 US7034394B2 (en) 2003-10-08 2003-10-08 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
PCT/US2004/032947 WO2005036642A2 (en) 2003-10-08 2004-10-06 A microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

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JP (1) JP4903048B2 (xx)
KR (1) KR100870292B1 (xx)
CN (1) CN100442486C (xx)
HK (1) HK1099129A1 (xx)
TW (1) TWI241882B (xx)
WO (1) WO2005036642A2 (xx)

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KR20060083426A (ko) 2006-07-20
TW200514494A (en) 2005-04-16
US20050077619A1 (en) 2005-04-14
CN1890803A (zh) 2007-01-03
JP2007507909A (ja) 2007-03-29
WO2005036642A3 (en) 2005-08-25
US7034394B2 (en) 2006-04-25
JP4903048B2 (ja) 2012-03-21
KR100870292B1 (ko) 2008-11-25
US7537954B2 (en) 2009-05-26
US20060097383A1 (en) 2006-05-11
WO2005036642A2 (en) 2005-04-21
TWI241882B (en) 2005-10-11
CN100442486C (zh) 2008-12-10

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