HK1088116A1 - Protection element - Google Patents

Protection element

Info

Publication number
HK1088116A1
HK1088116A1 HK06108436.9A HK06108436A HK1088116A1 HK 1088116 A1 HK1088116 A1 HK 1088116A1 HK 06108436 A HK06108436 A HK 06108436A HK 1088116 A1 HK1088116 A1 HK 1088116A1
Authority
HK
Hong Kong
Prior art keywords
protection element
protection
Prior art date
Application number
HK06108436.9A
Other languages
English (en)
Inventor
Yuji Furuuchi
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1088116A1 publication Critical patent/HK1088116A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/48—Protective devices wherein the fuse is carried or held directly by the base

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Fuses (AREA)
HK06108436.9A 2003-02-05 2006-07-28 Protection element HK1088116A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003028541A JP2004265618A (ja) 2003-02-05 2003-02-05 保護素子
PCT/JP2004/000905 WO2004070759A1 (ja) 2003-02-05 2004-01-30 保護素子

Publications (1)

Publication Number Publication Date
HK1088116A1 true HK1088116A1 (en) 2006-10-27

Family

ID=32844205

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06108436.9A HK1088116A1 (en) 2003-02-05 2006-07-28 Protection element

Country Status (7)

Country Link
US (1) US7088216B2 (xx)
JP (1) JP2004265618A (xx)
KR (1) KR20050099523A (xx)
CN (1) CN100461321C (xx)
HK (1) HK1088116A1 (xx)
TW (1) TWI228741B (xx)
WO (1) WO2004070759A1 (xx)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004033251B3 (de) * 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
DE102005024346B4 (de) * 2005-05-27 2012-04-26 Infineon Technologies Ag Sicherungselement mit Auslöseunterstützung
US20070075822A1 (en) * 2005-10-03 2007-04-05 Littlefuse, Inc. Fuse with cavity forming enclosure
JP4708310B2 (ja) * 2006-06-19 2011-06-22 三菱電機株式会社 回路遮断装置
JP2008311161A (ja) * 2007-06-18 2008-12-25 Sony Chemical & Information Device Corp 保護素子
JP5072796B2 (ja) * 2008-05-23 2012-11-14 ソニーケミカル＆インフォメーションデバイス株式会社 保護素子及び二次電池装置
US20100164677A1 (en) * 2008-12-29 2010-07-01 Chin-Chi Yang Fuse
JP5130233B2 (ja) 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
JP5301298B2 (ja) * 2009-01-21 2013-09-25 デクセリアルズ株式会社 保護素子
JP5130232B2 (ja) 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
KR101060013B1 (ko) * 2009-04-21 2011-08-26 스마트전자 주식회사 퓨즈저항기 및 그 제조방법과 설치방법
KR101038237B1 (ko) * 2009-04-21 2011-05-31 스마트전자 주식회사 퓨즈 저항기
TWI385695B (zh) * 2009-09-04 2013-02-11 Cyntec Co Ltd 保護元件及其製作方法
TWI385696B (zh) * 2009-09-04 2013-02-11 Cyntec Co Ltd 保護元件
US9129769B2 (en) * 2009-09-04 2015-09-08 Cyntec Co., Ltd. Protective device
KR101094039B1 (ko) * 2009-10-01 2011-12-19 삼성에스디아이 주식회사 전류차단소자 및 이를 구비한 이차 전지
US8531263B2 (en) * 2009-11-24 2013-09-10 Littelfuse, Inc. Circuit protection device
JP5571466B2 (ja) * 2010-06-10 2014-08-13 イビデン株式会社 プリント配線板、電子デバイス、及びプリント配線板の製造方法
PL2408277T3 (pl) * 2010-07-16 2016-08-31 Schurter Ag Element bezpiecznikowy
CN201774742U (zh) * 2010-08-19 2011-03-23 依必安派特风机(上海)有限公司 集成于印刷电路板上的保险单元以及印刷电路板
US8976001B2 (en) 2010-11-08 2015-03-10 Cyntec Co., Ltd. Protective device
CN102468645B (zh) * 2010-11-09 2015-09-02 乾坤科技股份有限公司 保护组件
US8461956B2 (en) * 2011-07-20 2013-06-11 Polytronics Technology Corp. Over-current protection device
JP6249600B2 (ja) 2012-03-29 2017-12-20 デクセリアルズ株式会社 保護素子
JP2014022050A (ja) * 2012-07-12 2014-02-03 Dexerials Corp 保護素子
JP6081096B2 (ja) * 2012-08-01 2017-02-15 デクセリアルズ株式会社 保護素子及びバッテリパック
JP5807969B2 (ja) * 2012-11-07 2015-11-10 エヌイーシー ショット コンポーネンツ株式会社 保護素子用フラックス組成物およびそれを利用した回路保護素子
JP6420053B2 (ja) * 2013-03-28 2018-11-07 デクセリアルズ株式会社 ヒューズエレメント、及びヒューズ素子
CN104347312A (zh) * 2013-07-29 2015-02-11 泰科电子日本合同会社 保护元件
TWI680482B (zh) * 2014-01-15 2019-12-21 日商迪睿合股份有限公司 保護元件
CN103887631A (zh) * 2014-04-04 2014-06-25 郭瑞 一种低熔点金属电缆连接端子
KR101533996B1 (ko) * 2014-10-23 2015-07-06 주식회사 에스엠하이테크 온도 퓨즈 기능을 가진 smd형 마이크로 복합 퓨즈 및 그 제조방법
JP6622960B2 (ja) * 2014-12-18 2019-12-18 デクセリアルズ株式会社 スイッチ素子
KR101741563B1 (ko) 2015-08-17 2017-05-31 스마트전자 주식회사 회로 보호 소자 및 그의 제조 방법
TWI627652B (zh) * 2017-05-05 2018-06-21 聚鼎科技股份有限公司 保護元件及其電路保護裝置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4494104A (en) * 1983-07-18 1985-01-15 Northern Telecom Limited Thermal Fuse
DE3743857A1 (de) * 1987-07-30 1989-02-09 Wickmann Werke Gmbh Elektrische sicherung und verfahren zu ihrer herstellung
US5097247A (en) * 1991-06-03 1992-03-17 North American Philips Corporation Heat actuated fuse apparatus with solder link
JPH0660047U (ja) * 1993-01-25 1994-08-19 石川島播磨重工業株式会社 ヒューズ素子
JP2790433B2 (ja) 1993-08-31 1998-08-27 ソニー株式会社 保護素子及び回路基板
US5712610C1 (en) * 1994-08-19 2002-06-25 Sony Chemicals Corp Protective device
JP3067011B2 (ja) 1994-11-30 2000-07-17 ソニーケミカル株式会社 保護素子及びその製造方法
JP3768621B2 (ja) 1996-10-12 2006-04-19 内橋エステック株式会社 保護素子の使用方法
JP3782176B2 (ja) 1996-10-12 2006-06-07 内橋エステック株式会社 保護素子の使用方法及び保護装置
US6373371B1 (en) * 1997-08-29 2002-04-16 Microelectronic Modules Corp. Preformed thermal fuse
JP4015240B2 (ja) 1997-10-03 2007-11-28 内橋エステック株式会社 基板型温度ヒュ−ズの製造方法及び基板型抵抗体付き・温度ヒュ−ズの製造方法
JP4396787B2 (ja) * 1998-06-11 2010-01-13 内橋エステック株式会社 薄型温度ヒュ−ズ及び薄型温度ヒュ−ズの製造方法
CN2330064Y (zh) * 1998-06-16 1999-07-21 刘旭东 闭管式熔断器汇流排条
JP2000164092A (ja) * 1998-11-25 2000-06-16 Nec Kansai Ltd 抵抗付き温度ヒューズ
US6300859B1 (en) * 1999-08-24 2001-10-09 Tyco Electronics Corporation Circuit protection devices
JP4301474B2 (ja) * 1999-10-18 2009-07-22 エヌイーシー ショット コンポーネンツ株式会社 保護素子
JP2001243867A (ja) * 2000-02-28 2001-09-07 Anzen Dengu Kk 温度ヒューズ
JP4269264B2 (ja) * 2002-07-22 2009-05-27 内橋エステック株式会社 薄型温度ヒューズ

Also Published As

Publication number Publication date
CN1748279A (zh) 2006-03-15
JP2004265618A (ja) 2004-09-24
KR20050099523A (ko) 2005-10-13
US20050264394A1 (en) 2005-12-01
US7088216B2 (en) 2006-08-08
WO2004070759A1 (ja) 2004-08-19
TW200416763A (en) 2004-09-01
TWI228741B (en) 2005-03-01
CN100461321C (zh) 2009-02-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190130