HK1075351A1 - Flexible substrate - Google Patents
Flexible substrateInfo
- Publication number
- HK1075351A1 HK1075351A1 HK05107636A HK05107636A HK1075351A1 HK 1075351 A1 HK1075351 A1 HK 1075351A1 HK 05107636 A HK05107636 A HK 05107636A HK 05107636 A HK05107636 A HK 05107636A HK 1075351 A1 HK1075351 A1 HK 1075351A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- flexible substrate
- flexible
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23935899A JP3183653B2 (ja) | 1999-08-26 | 1999-08-26 | フレキシブル基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1075351A1 true HK1075351A1 (en) | 2005-12-09 |
Family
ID=17043579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05107636A HK1075351A1 (en) | 1999-08-26 | 2005-08-31 | Flexible substrate |
Country Status (6)
Country | Link |
---|---|
US (2) | US6737588B1 (fr) |
EP (1) | EP1079676A3 (fr) |
JP (1) | JP3183653B2 (fr) |
CN (2) | CN1203740C (fr) |
HK (1) | HK1075351A1 (fr) |
TW (1) | TWI233326B (fr) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100881336B1 (ko) * | 2002-04-03 | 2009-02-02 | 삼성테크윈 주식회사 | 반도체 팩키지용 필름 기판 및, 그것의 제조 방법 |
TW530377B (en) | 2002-05-28 | 2003-05-01 | Via Tech Inc | Structure of laminated substrate with high integration and method of production thereof |
WO2004019668A1 (fr) * | 2002-08-21 | 2004-03-04 | Hoya Corporation | Substrat perfore, son procede de fabrication et carte de contact a tranche pleine |
JP2004186307A (ja) | 2002-12-02 | 2004-07-02 | Tdk Corp | 電子部品の製造方法および、電子部品 |
JP4247880B2 (ja) * | 2002-12-24 | 2009-04-02 | Tdk株式会社 | 電子部品の製造方法 |
GB0323285D0 (en) * | 2003-10-04 | 2003-11-05 | Koninkl Philips Electronics Nv | Device and method of making a device having a patterned layer on a flexible substrate |
JP2006269558A (ja) * | 2005-03-22 | 2006-10-05 | Nippon Steel Chem Co Ltd | フレキシブル積層基板の製造方法 |
US7631423B2 (en) * | 2006-02-13 | 2009-12-15 | Sanmina-Sci Corporation | Method and process for embedding electrically conductive elements in a dielectric layer |
JP4947137B2 (ja) * | 2007-03-22 | 2012-06-06 | 株式会社村田製作所 | 電子写真印刷法によるビアホール導体の形成方法 |
KR20110113980A (ko) * | 2010-04-12 | 2011-10-19 | 삼성전자주식회사 | 필름을 포함한 다층 인쇄회로기판 및 그 제조 방법 |
TW201340807A (zh) * | 2011-12-28 | 2013-10-01 | Panasonic Corp | 撓性配線基板與其製造方法、使用其之裝載製品、及撓性多層配線基板 |
CN103517558B (zh) * | 2012-06-20 | 2017-03-22 | 碁鼎科技秦皇岛有限公司 | 封装基板制作方法 |
JP5942725B2 (ja) | 2012-09-18 | 2016-06-29 | デクセリアルズ株式会社 | 導電性シート |
CN103852948B (zh) * | 2012-12-04 | 2016-12-21 | 汉王科技股份有限公司 | 一种制备柔性薄膜夹层基板的方法 |
KR101962986B1 (ko) * | 2014-11-18 | 2019-03-27 | 셍기 테크놀로지 코. 엘티디. | 연성 금속 적층체 |
CN105050335A (zh) * | 2015-06-12 | 2015-11-11 | 上海安费诺永亿通讯电子有限公司 | 一种用超声波连接双面印刷线路板和焊接电子元件的方法 |
WO2018037434A1 (fr) * | 2016-08-24 | 2018-03-01 | パナソニックIpマネジメント株式会社 | Procédé de fabrication de substrat de circuit |
CN106954352A (zh) * | 2017-05-16 | 2017-07-14 | 重庆艾申特电子科技有限公司 | 一种电路板用过炉工装 |
CN114521057B (zh) * | 2020-11-18 | 2024-07-05 | 深南电路股份有限公司 | 一种印制线路板及其制备方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1765926A1 (de) | 1968-08-09 | 1971-11-18 | Ibm Deutschland | Verfahren zur Herstellung einer gedruckten Schaltung |
GB1353671A (en) * | 1971-06-10 | 1974-05-22 | Int Computers Ltd | Methods of forming circuit interconnections |
JPS60147192A (ja) * | 1984-01-11 | 1985-08-03 | 株式会社日立製作所 | プリント配線板の製造方法 |
JPS6453591A (en) | 1987-08-25 | 1989-03-01 | Sumitomo Electric Industries | Manufacture of flexible circuit board |
JP2753746B2 (ja) * | 1989-11-06 | 1998-05-20 | 日本メクトロン株式会社 | Ic搭載用可撓性回路基板及びその製造法 |
US4991285A (en) * | 1989-11-17 | 1991-02-12 | Rockwell International Corporation | Method of fabricating multi-layer board |
JP3142951B2 (ja) | 1992-04-21 | 2001-03-07 | 日東電工株式会社 | 両面基板の製造方法 |
US5374469A (en) * | 1991-09-19 | 1994-12-20 | Nitto Denko Corporation | Flexible printed substrate |
CA2109687A1 (fr) * | 1993-01-26 | 1995-05-23 | Walter Schmidt | Methode de placage pour la realisation de traces metalliques |
US5600103A (en) * | 1993-04-16 | 1997-02-04 | Kabushiki Kaisha Toshiba | Circuit devices and fabrication method of the same |
US5401913A (en) | 1993-06-08 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
DE69419219T2 (de) * | 1993-09-03 | 2000-01-05 | Kabushiki Kaisha Toshiba, Kawasaki | Leiterplatte und Verfahren zur Herstellung solcher Leiterplatten |
JP3474894B2 (ja) | 1993-09-03 | 2003-12-08 | 株式会社東芝 | 印刷配線板およびその製造方法 |
JP3474896B2 (ja) | 1993-09-10 | 2003-12-08 | 株式会社東芝 | 印刷配線板およびその製造方法 |
JP3591854B2 (ja) | 1993-09-07 | 2004-11-24 | 松下電器産業株式会社 | 回路基板製造法 |
JP3087152B2 (ja) * | 1993-09-08 | 2000-09-11 | 富士通株式会社 | 樹脂フィルム多層回路基板の製造方法 |
JP3474937B2 (ja) * | 1994-10-07 | 2003-12-08 | 株式会社東芝 | 実装用配線板の製造方法、半導体パッケージの製造方法 |
JPH08125344A (ja) | 1994-10-26 | 1996-05-17 | Toshiba Corp | 印刷配線板の製造方法 |
JPH08264939A (ja) | 1995-03-28 | 1996-10-11 | Toshiba Corp | 印刷配線板の製造方法 |
JP3345541B2 (ja) * | 1996-01-16 | 2002-11-18 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
-
1999
- 1999-08-26 JP JP23935899A patent/JP3183653B2/ja not_active Expired - Fee Related
-
2000
- 2000-07-31 TW TW089115314A patent/TWI233326B/zh not_active IP Right Cessation
- 2000-08-18 US US09/640,862 patent/US6737588B1/en not_active Expired - Fee Related
- 2000-08-22 EP EP00118009A patent/EP1079676A3/fr not_active Withdrawn
- 2000-08-25 CN CNB001260456A patent/CN1203740C/zh not_active Expired - Fee Related
- 2000-08-25 CN CNB2004100974715A patent/CN1310577C/zh not_active Expired - Fee Related
-
2002
- 2002-08-29 US US10/230,329 patent/US6729022B2/en not_active Expired - Fee Related
-
2005
- 2005-08-31 HK HK05107636A patent/HK1075351A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2001068850A (ja) | 2001-03-16 |
CN1203740C (zh) | 2005-05-25 |
US6729022B2 (en) | 2004-05-04 |
EP1079676A3 (fr) | 2003-08-27 |
EP1079676A2 (fr) | 2001-02-28 |
JP3183653B2 (ja) | 2001-07-09 |
US6737588B1 (en) | 2004-05-18 |
CN1310577C (zh) | 2007-04-11 |
US20020189857A1 (en) | 2002-12-19 |
CN1607894A (zh) | 2005-04-20 |
TWI233326B (en) | 2005-05-21 |
CN1286591A (zh) | 2001-03-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20110825 |