HK1070940A1 - Micro-bridge structure - Google Patents

Micro-bridge structure

Info

Publication number
HK1070940A1
HK1070940A1 HK05103609A HK05103609A HK1070940A1 HK 1070940 A1 HK1070940 A1 HK 1070940A1 HK 05103609 A HK05103609 A HK 05103609A HK 05103609 A HK05103609 A HK 05103609A HK 1070940 A1 HK1070940 A1 HK 1070940A1
Authority
HK
Hong Kong
Prior art keywords
micro
substrate
providing
surface region
bridge structure
Prior art date
Application number
HK05103609A
Other languages
English (en)
Inventor
John Peter Gillham
Rex Watton
John Charles Alderman
Original Assignee
Qinetiq Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qinetiq Ltd filed Critical Qinetiq Ltd
Publication of HK1070940A1 publication Critical patent/HK1070940A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0853—Optical arrangements having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G01J5/22—Electrical features thereof
    • G01J5/24—Use of specially adapted circuits, e.g. bridge circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Inorganic Fibers (AREA)
  • Pressure Sensors (AREA)
  • Thermistors And Varistors (AREA)
  • Fire-Detection Mechanisms (AREA)
  • Solid State Image Pick-Up Elements (AREA)
HK05103609A 1999-08-24 2005-04-27 Micro-bridge structure HK1070940A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9919877.2A GB9919877D0 (en) 1999-08-24 1999-08-24 Micro-bridge structure

Publications (1)

Publication Number Publication Date
HK1070940A1 true HK1070940A1 (en) 2005-06-30

Family

ID=10859608

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05103609A HK1070940A1 (en) 1999-08-24 2005-04-27 Micro-bridge structure

Country Status (15)

Country Link
US (1) US7002153B1 (xx)
EP (1) EP1206687B1 (xx)
JP (1) JP4284019B2 (xx)
KR (1) KR100704518B1 (xx)
CN (2) CN1168960C (xx)
AT (1) ATE232972T1 (xx)
AU (1) AU761197B2 (xx)
CA (1) CA2381311C (xx)
DE (1) DE60001462T2 (xx)
ES (1) ES2192539T3 (xx)
GB (2) GB9919877D0 (xx)
HK (1) HK1070940A1 (xx)
TR (1) TR200200495T2 (xx)
TW (1) TW514723B (xx)
WO (1) WO2001014838A1 (xx)

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GB9919877D0 (en) * 1999-08-24 1999-10-27 Secr Defence Micro-bridge structure
US6489614B1 (en) * 1999-09-16 2002-12-03 Sharp Kabushiki Kaisha Thermal-type infrared radiation detector cell and image capture device incorporating the same
DE10144343A1 (de) * 2001-09-10 2003-03-27 Perkinelmer Optoelectronics Sensor zum berührugslosen Messen einer Temperatur
KR20040083497A (ko) 2002-02-02 2004-10-02 키네티큐 리미티드 헤드 위치 센서
GB0424934D0 (en) 2004-11-12 2004-12-15 Qinetiq Ltd Infrared detector
CN101249935B (zh) * 2007-03-31 2011-06-22 浙江大立科技股份有限公司 一种热绝缘微桥结构及其加工方法
US20090014657A1 (en) * 2007-05-01 2009-01-15 Honeywell International Inc. Infrared fire detection system
US7746236B2 (en) * 2007-05-01 2010-06-29 Honeywell International Inc. Fire detection system and method
KR101036329B1 (ko) * 2009-02-13 2011-05-23 조응래 건축용 비계의 보조결합구
CN101780944B (zh) * 2010-01-05 2015-04-29 上海集成电路研发中心有限公司 一种mems微桥结构的制备方法
JP5706174B2 (ja) * 2011-01-26 2015-04-22 三菱電機株式会社 赤外線センサおよび赤外線センサアレイ
JP5721597B2 (ja) * 2011-03-15 2015-05-20 三菱電機株式会社 半導体光素子および半導体光装置
TWI476969B (zh) * 2012-01-13 2015-03-11 Univ Nat Kaohsiung Applied Sci Metal silicide thermal sensor and its preparation method
US9698281B2 (en) * 2012-08-22 2017-07-04 Robert Bosch Gmbh CMOS bolometer
US9368658B2 (en) * 2012-08-31 2016-06-14 Robert Bosch Gmbh Serpentine IR sensor
CN102874735B (zh) * 2012-09-29 2015-01-07 姜利军 双材料微悬臂梁、电磁辐射探测器以及探测方法
EP2909591B1 (en) * 2012-10-17 2023-06-21 Robert Bosch GmbH Multi-stack film bolometer
EP3050105B1 (en) 2013-09-27 2020-11-11 Robert Bosch GmbH Semiconductor bolometer and method of fabrication thereof
CN105093356A (zh) * 2015-07-31 2015-11-25 哈尔滨工业大学 一种高能量利用率的微桥结构电阻阵列
CA3074067C (en) 2017-08-31 2023-09-12 Google Llc Quantum information processing device formation
KR101842955B1 (ko) 2017-09-28 2018-03-29 ㈜시리우스 선택식각 공정을 이용한 마이크로 볼로미터 제조방법 및 이에 따라 제조된 마이크로 볼로미터
CN111960377B (zh) * 2020-07-29 2024-03-15 上海集成电路研发中心有限公司 Mems传感器微桥桥面的制作方法
JP7485581B2 (ja) 2020-10-16 2024-05-16 セイコーＮｐｃ株式会社 赤外線センサ素子及び赤外線センサ
CN113720479B (zh) * 2021-03-26 2022-11-08 北京北方高业科技有限公司 基于cmos工艺的红外探测器像元和红外探测器
JP2023028860A (ja) 2021-08-20 2023-03-03 Tdk株式会社 電磁波センサ

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US5300915A (en) 1986-07-16 1994-04-05 Honeywell Inc. Thermal sensor
WO1988005166A1 (en) * 1987-01-08 1988-07-14 Massachusetts Institute Of Technology Turbulent shear force microsensor
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US5399897A (en) 1993-11-29 1995-03-21 Raytheon Company Microstructure and method of making such structure
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JP2710228B2 (ja) * 1994-08-11 1998-02-10 日本電気株式会社 ボロメータ型赤外線検知素子、その駆動方法、および検出用積分回路
DE4438704C1 (de) 1994-10-29 1996-04-04 Kali & Salz Ag Röhrenfreifallscheider zur Trennung von Kunststoffgemengen
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Also Published As

Publication number Publication date
ES2192539T3 (es) 2003-10-16
EP1206687B1 (en) 2003-02-19
GB9919877D0 (en) 1999-10-27
EP1206687A1 (en) 2002-05-22
WO2001014838A1 (en) 2001-03-01
CN1371474A (zh) 2002-09-25
GB0201115D0 (en) 2002-03-06
US7002153B1 (en) 2006-02-21
DE60001462T2 (de) 2003-12-04
TR200200495T2 (tr) 2002-06-21
DE60001462D1 (de) 2003-03-27
ATE232972T1 (de) 2003-03-15
KR100704518B1 (ko) 2007-04-09
JP2003507904A (ja) 2003-02-25
JP4284019B2 (ja) 2009-06-24
KR20020060692A (ko) 2002-07-18
CA2381311A1 (en) 2001-03-01
CN100383504C (zh) 2008-04-23
GB2370156A (en) 2002-06-19
CN1168960C (zh) 2004-09-29
CN1558193A (zh) 2004-12-29
CA2381311C (en) 2009-02-03
AU6711000A (en) 2001-03-19
AU761197B2 (en) 2003-05-29
TW514723B (en) 2002-12-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20160823