HK1069407A1 - Curable resin composition and cured product thereof - Google Patents

Curable resin composition and cured product thereof

Info

Publication number
HK1069407A1
HK1069407A1 HK05100742A HK05100742A HK1069407A1 HK 1069407 A1 HK1069407 A1 HK 1069407A1 HK 05100742 A HK05100742 A HK 05100742A HK 05100742 A HK05100742 A HK 05100742A HK 1069407 A1 HK1069407 A1 HK 1069407A1
Authority
HK
Hong Kong
Prior art keywords
resin composition
curable resin
cured product
cured
curable
Prior art date
Application number
HK05100742A
Other languages
English (en)
Inventor
Ishii Kenji
Norisue Yasumasa
Ohno Daisuke
Nawata Michio
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003009422A external-priority patent/JP4359746B2/ja
Priority claimed from JP2003020150A external-priority patent/JP4300401B2/ja
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of HK1069407A1 publication Critical patent/HK1069407A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/905—Polyphenylene oxide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
HK05100742A 2003-01-17 2005-01-28 Curable resin composition and cured product thereof HK1069407A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003009422A JP4359746B2 (ja) 2003-01-17 2003-01-17 硬化性樹脂組成物およびその硬化物
JP2003020150A JP4300401B2 (ja) 2003-01-29 2003-01-29 硬化性樹脂組成物およびその硬化物

Publications (1)

Publication Number Publication Date
HK1069407A1 true HK1069407A1 (en) 2005-05-20

Family

ID=32599322

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05100742A HK1069407A1 (en) 2003-01-17 2005-01-28 Curable resin composition and cured product thereof

Country Status (7)

Country Link
US (1) US7071266B2 (xx)
EP (1) EP1439209B1 (xx)
KR (1) KR101052312B1 (xx)
CN (1) CN1305962C (xx)
DE (1) DE602004000607T2 (xx)
HK (1) HK1069407A1 (xx)
TW (1) TWI309666B (xx)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235192B2 (en) 1999-12-01 2007-06-26 General Electric Company Capped poly(arylene ether) composition and method
JP4102112B2 (ja) * 2002-06-06 2008-06-18 株式会社東芝 半導体装置及びその製造方法
TW200416243A (en) * 2003-01-21 2004-09-01 Mitsubishi Gas Chemical Co Epoxy resin curing agent, curable epoxy resin composition and cured product
JP4288473B2 (ja) * 2003-04-24 2009-07-01 三菱瓦斯化学株式会社 新規ポリエステルおよびフィルムおよび積層体
JP4471073B2 (ja) * 2003-07-02 2010-06-02 三菱瓦斯化学株式会社 ２官能性フェニレンエーテルオリゴマー体の製造法
US7148296B2 (en) * 2003-10-03 2006-12-12 General Electric Company Capped poly(arylene ether) composition and process
US7329708B2 (en) * 2004-08-18 2008-02-12 General Electric Company Functionalized poly(arylene ether) composition and method
JP4867217B2 (ja) * 2004-08-19 2012-02-01 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化性フィルムおよびフィルム
US7429800B2 (en) * 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
DE102006022372A1 (de) * 2006-05-12 2007-11-15 Airbus Deutschland Gmbh Flammfeste, niedrigtemperaturhärtende, cyanatbasierte Prepregharze für Honeycomb-Sandwichbauteile mit exzellenten Oberflächen
US20080071035A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Curable poly(arylene ether) composition and method
US20080071036A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Cured poly(arylene ether) composition, method, and article
US7655278B2 (en) * 2007-01-30 2010-02-02 Sabic Innovative Plastics Ip B.V. Composite-forming method, composites formed thereby, and printed circuit boards incorporating them
US20090076307A1 (en) * 2007-08-13 2009-03-19 . Aromatic diamine compound and aromatic dinitro compound
JP2011095709A (ja) * 2009-09-30 2011-05-12 Fujifilm Corp 硬化性組成物、硬化性フィルム、硬化性積層体、永久パターン形成方法、及びプリント基板
CN103842397B (zh) 2011-09-30 2017-04-26 三菱瓦斯化学株式会社 树脂组合物、预浸料以及覆金属箔层叠板
KR101971757B1 (ko) 2012-03-29 2019-08-13 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 수지 시트 및 금속박 피복 적층판
US9914803B2 (en) 2013-06-28 2018-03-13 Saint-Gobain Performance Plastics Corporation Cyanate resin blends and radomes including them
CN107860833A (zh) * 2017-10-20 2018-03-30 广东生益科技股份有限公司 氰酸酯单体含量的测定方法
US10995182B2 (en) 2018-04-30 2021-05-04 Shpp Global Technologies B.V. Phenylene ether oligomer, curable composition comprising the phenylene ether oligomer, and thermoset composition derived therefrom
US11472920B2 (en) * 2019-01-22 2022-10-18 Shpp Global Technologies B.V. Method for preparing a poly(phenylene ether) and poly(phenylene ether) prepared thereby

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56141349A (en) * 1980-04-03 1981-11-05 Mitsubishi Gas Chem Co Inc Curable polyphenylene ether type resin composition
US4389516A (en) * 1980-03-24 1983-06-21 Mitsubishi Gas Chemical Company, Inc. Curable polyphenylene ether resin composition
US4983683A (en) * 1987-10-05 1991-01-08 Hi-Tek Polymers, Inc. Polycyanate esters of polyhydric phenols blended with thermoplastic polymers
JPH0565352A (ja) * 1991-09-09 1993-03-19 Mitsubishi Gas Chem Co Inc 熱硬化性シアナート化合物変性ポリフエニレンエーテル樹脂フイルムの製造方法
JP3265437B2 (ja) * 1993-01-11 2002-03-11 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
JP2842152B2 (ja) * 1993-06-11 1998-12-24 松下電工株式会社 熱硬化性樹脂組成物、プリプレグの製造方法及び積層板の製造方法
US6194495B1 (en) 1998-03-23 2001-02-27 General Electric Company Cyanate ester based thermoset compositions
JP2001261958A (ja) * 2000-03-21 2001-09-26 Hitachi Chem Co Ltd 誘電特性に優れる樹脂組成物、これを用いて作製されるワニス、プリプレグ及び金属張積層板
US6794481B2 (en) 2001-06-28 2004-09-21 Mitsubishi Gas Chemical Company, Inc. Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof
JP2003038887A (ja) * 2001-07-26 2003-02-12 Masayuki Yashiro 洗い機
JP2002194212A (ja) * 2001-10-29 2002-07-10 Hitachi Chem Co Ltd 積層板用変性シアネートエステル系硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP4039033B2 (ja) * 2001-10-31 2008-01-30 日立化成工業株式会社 変性シアネートエステル系樹脂組成物、樹脂フィルム、多層プリント配線板およびそれらの製造方法
US6835785B2 (en) 2002-01-28 2004-12-28 Mitsubishi Gas Chemical Company, Inc. Polyphenylene ether oligomer compound, derivatives thereof and use thereof

Also Published As

Publication number Publication date
TW200418903A (en) 2004-10-01
DE602004000607D1 (de) 2006-05-24
US7071266B2 (en) 2006-07-04
EP1439209A1 (en) 2004-07-21
CN1305962C (zh) 2007-03-21
EP1439209B1 (en) 2006-04-12
KR101052312B1 (ko) 2011-07-27
CN1517408A (zh) 2004-08-04
TWI309666B (en) 2009-05-11
US20040152848A1 (en) 2004-08-05
KR20040066727A (ko) 2004-07-27
DE602004000607T2 (de) 2006-10-05

Similar Documents

Publication Publication Date Title
HK1069407A1 (en) Curable resin composition and cured product thereof
EP1657268A4 (en) PHOTOSENSITIVE COMPOSITION AND CURED PRODUCT MANUFACTURED THEREFROM
AU2003277605A1 (en) Radiation curing resin composition and cured product thereof
EP1550699A4 (en) THERMOPLASTIC COMPOSITION AND FORM BODY THEREOF
HK1086851A1 (en) Curable resin composition, curable film and cured film
TWI367912B (en) Thermoplastic resin composition and shaped article
HK1086582A1 (en) Curable resins and curable resin compositions containing the same
EP1652891A4 (en) HARDENABLE RESIN AND COMPOSITE ADHESIVE AND ADHESIVE ADHESIVE
GB2405875B (en) Photosensitive resin, resin composition and cured product thereof
TWI367394B (en) Curable resin composition, cured article using the same and various object derived thereof
TWI370147B (en) Modified polyimide resin and curable resin composition
EP1852469A4 (en) CURABLE COMPOSITION CONTAINING SILICONE AND HARDENED PRODUCT
EP1869120A4 (en) ELECTRICALLY CURABLE HARDENING RESIN COMPOSITION, HARDENED PRODUCT THEREOF AND SHAPED ARTICLES THEREOF
EP1621562A4 (en) CURABLE RESIN COMPOSITION
HK1126235A1 (en) Two-part curable composition and polyurethane-polysiloxane resin mixture obtained therefrom
EP1876206A4 (en) THERMOPLASTIC RESIN COMPOSITION AND ITS FORMAT
EP1584639A4 (en) CURABLE RESIN COMPOSITION AND CURING PRODUCTS COMPONENT
AU2003266675A8 (en) Liquid curable resin composition
TWI367899B (en) Epoxy resin curing agent and epoxy resin composition
AU2003217483A8 (en) Electroconductive curable resin composition, cured product thereof and process for producing the same
AU2003219612A8 (en) Photocurable resin composition and optical component
TWI346111B (en) Photosensitive resin composition and products of cured product thereof
AU2003267865A8 (en) Photocurable resin composition and optical material
EP1734078A4 (en) THERMOPLASTIC RESIN COMPOSITION AND RESIN BODY
EP2023346A4 (en) UV-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20240115