HK1066238A1 - Connecting material - Google Patents

Connecting material

Info

Publication number
HK1066238A1
HK1066238A1 HK04109282A HK04109282A HK1066238A1 HK 1066238 A1 HK1066238 A1 HK 1066238A1 HK 04109282 A HK04109282 A HK 04109282A HK 04109282 A HK04109282 A HK 04109282A HK 1066238 A1 HK1066238 A1 HK 1066238A1
Authority
HK
Hong Kong
Prior art keywords
connecting material
Prior art date
Application number
HK04109282A
Other languages
English (en)
Inventor
Hidekazu Yagi
Motohide Takeichi
Junji Shinozaki
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17400658&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1066238(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of HK1066238A1 publication Critical patent/HK1066238A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/903—Interpenetrating network

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
HK04109282A 1999-09-17 2004-11-24 Connecting material HK1066238A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26425699 1999-09-17

Publications (1)

Publication Number Publication Date
HK1066238A1 true HK1066238A1 (en) 2005-03-18

Family

ID=17400658

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04109282A HK1066238A1 (en) 1999-09-17 2004-11-24 Connecting material

Country Status (7)

Country Link
US (1) US6566422B1 (fr)
EP (2) EP1085790B9 (fr)
JP (1) JP3371894B2 (fr)
KR (1) KR100652915B1 (fr)
CN (2) CN1255868C (fr)
DE (2) DE60038253T2 (fr)
HK (1) HK1066238A1 (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3417354B2 (ja) * 1999-08-19 2003-06-16 ソニーケミカル株式会社 接着材料及び回路接続方法
JP2002327165A (ja) * 2001-04-20 2002-11-15 Three M Innovative Properties Co 熱硬化性の接着剤フィルム及びそれを用いた接着構造
JP4037619B2 (ja) 2001-04-27 2008-01-23 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤及び電気装置
EP1393368A2 (fr) * 2001-05-17 2004-03-03 Koninklijke Philips Electronics N.V. Produit comprenant un substrat et une puce fixee sur le substrat
JP3719234B2 (ja) * 2001-08-06 2005-11-24 日立化成工業株式会社 半導体用接着フィルム、およびこれを用いた半導体用接着フィルム付きリードフレームならびに半導体装置
JP3811120B2 (ja) * 2002-11-08 2006-08-16 株式会社巴川製紙所 半導体装置用接着テープ
US7394663B2 (en) * 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
US20060240198A1 (en) * 2003-06-04 2006-10-26 Sekisui Chemical Co., Ltd. Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device
WO2004108790A1 (fr) * 2003-06-04 2004-12-16 Sekisui Chemical Co., Ltd. Composition durcissable, materiau d'etancheite pour afficheur a cristaux liquides, et afficheur a cristaux liquides
CN100380741C (zh) 2003-06-25 2008-04-09 日立化成工业株式会社 电路连接材料、电路构件的连接结构及其制造方法
US20060035036A1 (en) * 2004-08-16 2006-02-16 Telephus Inc. Anisotropic conductive adhesive for fine pitch and COG packaged LCD module
JP4281656B2 (ja) 2004-09-22 2009-06-17 セイコーエプソン株式会社 電子部品の実装構造、電子部品の実装方法、電気光学装置および電子機器
US7888604B2 (en) 2005-04-11 2011-02-15 3M Innovative Properties Company Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
US7772040B2 (en) 2006-09-12 2010-08-10 Nitto Denko Corporation Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
JP5340558B2 (ja) * 2007-05-17 2013-11-13 日東電工株式会社 半導体封止用エポキシ樹脂組成物およびそれを用いて得られる半導体装置
ES2612560T3 (es) * 2007-07-13 2017-05-17 Senju Metal Industry Co., Ltd Circuito electrónico montado en vehículo
JP5558140B2 (ja) 2009-06-10 2014-07-23 デクセリアルズ株式会社 絶縁性樹脂フィルム、並びにこれを用いた接合体及びその製造方法
US8592260B2 (en) * 2009-06-26 2013-11-26 Nitto Denko Corporation Process for producing a semiconductor device
TWI503343B (zh) * 2009-09-30 2015-10-11 Sumitomo Bakelite Co 導電連接材料、端子間之連接方法及連接端子之製造方法
CN101781540B (zh) * 2010-03-19 2013-03-06 东华大学 一种高性能导电胶及其制备方法
JP6081693B2 (ja) * 2011-09-12 2017-02-15 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP2013091774A (ja) * 2011-10-05 2013-05-16 Canon Inc エポキシ樹脂組成物
JP2013094992A (ja) * 2011-10-28 2013-05-20 Canon Inc インクジェットヘッド用封止材
KR101597726B1 (ko) 2013-04-29 2016-02-25 제일모직주식회사 이방성 도전 필름 및 이를 이용한 디스플레이 장치
TWM495707U (zh) * 2014-09-16 2015-02-11 Syncmold Entpr Corp 可切換拉伸力的支撐架
TWI691977B (zh) * 2015-05-27 2020-04-21 日商迪睿合股份有限公司 異向導電性膜及連接構造體
JP6750197B2 (ja) * 2015-07-13 2020-09-02 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
JPWO2017090440A1 (ja) * 2015-11-24 2018-09-06 リンテック株式会社 回路部材接続用樹脂シート
JP6032345B2 (ja) * 2015-12-07 2016-11-24 住友ベークライト株式会社 接着フィルム
US20180352659A1 (en) * 2015-12-11 2018-12-06 Dic Corporation Thermosetting material used for reinforcing flexible printed circuit board, reinforced flexible printed circuit board, method for producing the reinforced flexible printed circuit board, and electronic device
JP6719550B2 (ja) * 2016-05-12 2020-07-08 日本メクトロン株式会社 導電性接着剤およびシールドフィルム
JP2017038081A (ja) * 2016-10-27 2017-02-16 住友ベークライト株式会社 半導体装置
JP2021024963A (ja) * 2019-08-06 2021-02-22 昭和電工マテリアルズ株式会社 半導体用接着剤、それを用いた半導体用接着剤フィルムの製造方法及び半導体装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833111B2 (ja) 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
JP3191432B2 (ja) * 1992-09-03 2001-07-23 セイコーエプソン株式会社 液晶装置
JP3648277B2 (ja) * 1995-01-12 2005-05-18 株式会社東芝 半導体装置
WO1998003047A1 (fr) * 1996-07-15 1998-01-22 Hitachi Chemical Company, Ltd. Adhesif du type film destine a la connexion d'un circuit et d'une plaquette de circuits
WO1998004000A1 (fr) * 1996-07-22 1998-01-29 Honda Giken Kogyo Kabushiki Kaisha Unite de commande electronique de type enfichable, structure de connexion entre un tableau de connexion et des fiches, unite de connexion entre des pieces electroniques et un tableau de connexion et procede de montage de pieces electroniques
JP3928753B2 (ja) * 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
JPH10154777A (ja) * 1996-11-25 1998-06-09 Hitachi Ltd 半導体装置
JP3678547B2 (ja) * 1997-07-24 2005-08-03 ソニーケミカル株式会社 多層異方導電性接着剤およびその製造方法
JP3135926B2 (ja) * 1997-08-07 2001-02-19 松下電工株式会社 半導体チップをモールドするためのエポキシ樹脂封止材料及びその製造方法
JPH11116934A (ja) * 1997-10-14 1999-04-27 Sumitomo Bakelite Co Ltd デバイス中空パッケージ封止用紫外線硬化型接着剤
US6926796B1 (en) * 1999-01-29 2005-08-09 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting method and device therefor
JP3773022B2 (ja) * 1999-02-12 2006-05-10 信越化学工業株式会社 フリップチップ型半導体装置

Also Published As

Publication number Publication date
KR20010050461A (ko) 2001-06-15
KR100652915B1 (ko) 2006-11-30
EP1277819A1 (fr) 2003-01-22
CN1255868C (zh) 2006-05-10
CN1192071C (zh) 2005-03-09
EP1085790B9 (fr) 2004-12-01
DE60011720T2 (de) 2005-07-14
DE60038253T2 (de) 2009-02-26
EP1085790B1 (fr) 2004-06-23
EP1085790A1 (fr) 2001-03-21
DE60038253D1 (de) 2008-04-17
US6566422B1 (en) 2003-05-20
CN1299852A (zh) 2001-06-20
DE60011720D1 (de) 2004-07-29
JP2001160568A (ja) 2001-06-12
JP3371894B2 (ja) 2003-01-27
EP1277819B1 (fr) 2008-03-05
CN1510092A (zh) 2004-07-07

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PE Patent expired

Effective date: 20200915