HK1060722A1 - High thermal expansion glass and tape composition - Google Patents

High thermal expansion glass and tape composition

Info

Publication number
HK1060722A1
HK1060722A1 HK04103769A HK04103769A HK1060722A1 HK 1060722 A1 HK1060722 A1 HK 1060722A1 HK 04103769 A HK04103769 A HK 04103769A HK 04103769 A HK04103769 A HK 04103769A HK 1060722 A1 HK1060722 A1 HK 1060722A1
Authority
HK
Hong Kong
Prior art keywords
thermal expansion
high thermal
expansion glass
tape composition
tape
Prior art date
Application number
HK04103769A
Other languages
English (en)
Inventor
Yong Cho
Kenneth Warren Hang
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of HK1060722A1 publication Critical patent/HK1060722A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C03C4/02—Compositions for glass with special properties for coloured glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Glass Compositions (AREA)
  • Inorganic Insulating Materials (AREA)
HK04103769A 2002-06-04 2004-05-27 High thermal expansion glass and tape composition HK1060722A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38570102P 2002-06-04 2002-06-04

Publications (1)

Publication Number Publication Date
HK1060722A1 true HK1060722A1 (en) 2004-08-20

Family

ID=29550203

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04103769A HK1060722A1 (en) 2002-06-04 2004-05-27 High thermal expansion glass and tape composition

Country Status (8)

Country Link
US (1) US6835682B2 (xx)
EP (1) EP1369397B1 (xx)
JP (1) JP3890321B2 (xx)
KR (1) KR100517845B1 (xx)
CN (1) CN1332902C (xx)
DE (1) DE60334049D1 (xx)
HK (1) HK1060722A1 (xx)
TW (1) TWI278441B (xx)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1353542B1 (en) * 2001-12-25 2018-05-16 Ngk Spark Plug Co., Ltd Process for production of multilayered wiring board
US7438829B2 (en) * 2003-11-13 2008-10-21 E.I. Du Pont De Nemours And Company Thick film getter paste compositions for use in moisture control
US7611645B2 (en) * 2005-04-25 2009-11-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions and the use thereof in LTCC circuits and devices
US20070013305A1 (en) * 2005-07-18 2007-01-18 Wang Carl B Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
US7687417B2 (en) 2005-11-16 2010-03-30 E.I. Du Pont De Nemours And Company Lead free glass(es), thick film paste(s), tape composition(s) and low temperature cofired ceramic devices made therefrom
TW200732270A (en) * 2006-02-17 2007-09-01 Delta Electronics Inc Dielectric glass-ceramic composition, dielectric glass-ceramic substrate and manufacturing method thereof
DE102007038514A1 (de) * 2007-08-16 2009-02-19 Robert Bosch Gmbh Elektrische Schaltungsanordnung und Verfahren zur Herstellung einer elektrischen Schaltungsanordnung
JP5263112B2 (ja) * 2009-10-07 2013-08-14 旭硝子株式会社 セラミックス原料組成物
KR101037798B1 (ko) * 2010-09-07 2011-05-27 케이알텍 주식회사 고속철도 차량용 공기정화장치
KR101159063B1 (ko) 2011-02-08 2012-06-22 한국과학기술연구원 밀리미터파용 저손실 저온소성 유전체 세라믹 조성물
KR20140063716A (ko) * 2011-08-26 2014-05-27 헤레우스 프레셔스 메탈즈 노스 아메리카 콘쇼호켄 엘엘씨 SiNx 및 더 양호한 BSF 형성을 위한 파이어 스루 알루미늄 페이스트
JP6032014B2 (ja) 2012-04-24 2016-11-24 日本電気硝子株式会社 結晶性ガラス組成物
WO2014196348A1 (ja) * 2013-06-05 2014-12-11 株式会社村田製作所 セラミック基板用組成物およびセラミック回路部品
CN103482985B (zh) * 2013-09-16 2015-02-04 中国科学院上海硅酸盐研究所 一种低温共烧陶瓷生带材料及其制备方法和应用
TW201641461A (zh) * 2015-04-28 2016-12-01 賀利氏貴金屬北美康舍霍肯有限責任公司 介電物帶組合物
JP6260731B1 (ja) 2017-02-15 2018-01-17 Tdk株式会社 ガラスセラミックス焼結体およびコイル電子部品
CN107473717B (zh) * 2017-07-26 2019-12-20 广东风华高新科技股份有限公司 硼铝硅酸盐矿物材料、低温共烧陶瓷复合材料、低温共烧陶瓷、复合基板及其制备方法
CN107522407B (zh) * 2017-09-06 2020-10-13 嘉兴佳利电子有限公司 一种防静电低温共烧陶瓷材料及其制备方法和应用
CN109467426A (zh) * 2018-10-29 2019-03-15 中国电子科技集团公司第四十三研究所 一种低温共烧陶瓷基板材料及其制备方法
CN113045204B (zh) * 2021-03-10 2023-01-24 安徽华封电子科技有限公司 一种低损耗低温共烧陶瓷生瓷带及其制备方法
CN114380509B (zh) * 2022-03-24 2022-07-08 西安宏星电子浆料科技股份有限公司 一种高耐腐蚀性介质浆料

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4256796A (en) 1979-11-05 1981-03-17 Rca Corporation Partially devitrified porcelain composition and articles prepared with same
US4385127A (en) 1981-11-23 1983-05-24 Corning Glass Works Glass-ceramic coatings for use on metal substrates
US4358541A (en) 1981-11-23 1982-11-09 Corning Glass Works Glass-ceramic coatings for use on metal substrates
US4536535A (en) 1983-06-07 1985-08-20 E. I. Du Pont De Nemours And Company Castable ceramic compositions
JPS60172102A (ja) 1984-02-16 1985-09-05 株式会社フジクラ 鋼板被覆用結晶化ガラス組成物
US4830988A (en) * 1986-10-02 1989-05-16 General Electric Company Dielectric inks for multilayer copper circuits
US5002903A (en) 1988-12-01 1991-03-26 Ferro Corporation Porcelain enameled metal substrates
KR100320630B1 (ko) * 1995-01-27 2002-07-02 윌리암 제이. 버크 유전손실이낮은유리
JPH10245263A (ja) 1997-03-04 1998-09-14 Murata Mfg Co Ltd 低温焼結磁器組成物
CN1099388C (zh) * 1998-02-10 2003-01-22 株式会社小原 具有负向反常色散的光学玻璃
JP2000203878A (ja) * 1999-01-13 2000-07-25 Asahi Glass Co Ltd ガラスセラミックス組成物
US6589894B1 (en) * 2000-09-11 2003-07-08 Nippon Electric Glass Co., Ltd. Composition containing lead-oxide free glass powder of low softening point useful for barrier rib in PDP

Also Published As

Publication number Publication date
CN1467167A (zh) 2004-01-14
US6835682B2 (en) 2004-12-28
US20030224923A1 (en) 2003-12-04
KR20030094095A (ko) 2003-12-11
DE60334049D1 (de) 2010-10-21
JP3890321B2 (ja) 2007-03-07
CN1332902C (zh) 2007-08-22
TWI278441B (en) 2007-04-11
TW200307653A (en) 2003-12-16
EP1369397A1 (en) 2003-12-10
JP2004043297A (ja) 2004-02-12
KR100517845B1 (ko) 2005-09-30
EP1369397B1 (en) 2010-09-08

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110512