HK1052559A1 - 襯底及與該結構的製造相關的工藝 - Google Patents

襯底及與該結構的製造相關的工藝

Info

Publication number
HK1052559A1
HK1052559A1 HK03104798.3A HK03104798A HK1052559A1 HK 1052559 A1 HK1052559 A1 HK 1052559A1 HK 03104798 A HK03104798 A HK 03104798A HK 1052559 A1 HK1052559 A1 HK 1052559A1
Authority
HK
Hong Kong
Prior art keywords
structures
substrate
product
connection
Prior art date
Application number
HK03104798.3A
Other languages
English (en)
Inventor
Heidari Babak
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat Ab filed Critical Obducat Ab
Publication of HK1052559A1 publication Critical patent/HK1052559A1/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0331Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers for lift-off processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
HK03104798.3A 2000-04-18 2003-07-07 襯底及與該結構的製造相關的工藝 HK1052559A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0001430A SE516194C2 (sv) 2000-04-18 2000-04-18 Substrat för samt process vid tillverkning av strukturer
PCT/SE2001/000788 WO2001079933A1 (en) 2000-04-18 2001-04-10 A substrate for and a process in connection with the product of structures

Publications (1)

Publication Number Publication Date
HK1052559A1 true HK1052559A1 (zh) 2003-09-19

Family

ID=20279359

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03104798.3A HK1052559A1 (zh) 2000-04-18 2003-07-07 襯底及與該結構的製造相關的工藝

Country Status (8)

Country Link
US (1) US7041228B2 (zh)
EP (1) EP1275031A1 (zh)
JP (1) JP2004513504A (zh)
CN (1) CN1215528C (zh)
AU (1) AU2001248951A1 (zh)
HK (1) HK1052559A1 (zh)
SE (1) SE516194C2 (zh)
WO (1) WO2001079933A1 (zh)

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US7005335B2 (en) * 2003-07-15 2006-02-28 Hewlett-Packard Development, L.P. Array of nanoscopic mosfet transistors and fabrication methods
GB2406543B (en) * 2003-10-04 2006-06-07 Agilent Technologies Inc A method for fabricating masters for imprint lithography and related imprint process
CN100373259C (zh) * 2003-12-26 2008-03-05 中国科学院上海微系统与信息技术研究所 最小尺寸为纳米量级图形的印刻方法
EP1730591B1 (en) * 2004-01-12 2011-08-03 Regents of the University of California Nanoscale electric lithography
US7730834B2 (en) * 2004-03-04 2010-06-08 Asml Netherlands B.V. Printing apparatus and device manufacturing method
US7141275B2 (en) * 2004-06-16 2006-11-28 Hewlett-Packard Development Company, L.P. Imprinting lithography using the liquid/solid transition of metals and their alloys
US7676088B2 (en) * 2004-12-23 2010-03-09 Asml Netherlands B.V. Imprint lithography
US20060144274A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US20060144814A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US7686970B2 (en) * 2004-12-30 2010-03-30 Asml Netherlands B.V. Imprint lithography
US7490547B2 (en) * 2004-12-30 2009-02-17 Asml Netherlands B.V. Imprint lithography
US7354698B2 (en) * 2005-01-07 2008-04-08 Asml Netherlands B.V. Imprint lithography
US7922474B2 (en) * 2005-02-17 2011-04-12 Asml Netherlands B.V. Imprint lithography
US7523701B2 (en) * 2005-03-07 2009-04-28 Asml Netherlands B.V. Imprint lithography method and apparatus
US7611348B2 (en) * 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography
US7762186B2 (en) * 2005-04-19 2010-07-27 Asml Netherlands B.V. Imprint lithography
US7442029B2 (en) * 2005-05-16 2008-10-28 Asml Netherlands B.V. Imprint lithography
US7692771B2 (en) * 2005-05-27 2010-04-06 Asml Netherlands B.V. Imprint lithography
US7708924B2 (en) * 2005-07-21 2010-05-04 Asml Netherlands B.V. Imprint lithography
US20060267231A1 (en) * 2005-05-27 2006-11-30 Asml Netherlands B.V. Imprint lithography
US7418902B2 (en) * 2005-05-31 2008-09-02 Asml Netherlands B.V. Imprint lithography including alignment
US7377764B2 (en) * 2005-06-13 2008-05-27 Asml Netherlands B.V. Imprint lithography
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US20070023976A1 (en) * 2005-07-26 2007-02-01 Asml Netherlands B.V. Imprint lithography
US8011915B2 (en) 2005-11-04 2011-09-06 Asml Netherlands B.V. Imprint lithography
US7878791B2 (en) * 2005-11-04 2011-02-01 Asml Netherlands B.V. Imprint lithography
US20070138699A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Imprint lithography
US7517211B2 (en) 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
US8318520B2 (en) * 2005-12-30 2012-11-27 Lin Ming-Nung Method of microminiaturizing a nano-structure
US20070134943A2 (en) * 2006-04-02 2007-06-14 Dunnrowicz Clarence J Subtractive - Additive Edge Defined Lithography
US8850980B2 (en) 2006-04-03 2014-10-07 Canon Nanotechnologies, Inc. Tessellated patterns in imprint lithography
US8015939B2 (en) 2006-06-30 2011-09-13 Asml Netherlands B.V. Imprintable medium dispenser
US8318253B2 (en) * 2006-06-30 2012-11-27 Asml Netherlands B.V. Imprint lithography
US20090038636A1 (en) * 2007-08-09 2009-02-12 Asml Netherlands B.V. Cleaning method
US7854877B2 (en) 2007-08-14 2010-12-21 Asml Netherlands B.V. Lithography meandering order
US8144309B2 (en) * 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography
JP5441148B2 (ja) * 2008-09-01 2014-03-12 学校法人東京電機大学 レジストの積層構造体およびレジストパターンの形成方法
JP5692992B2 (ja) * 2008-12-19 2015-04-01 キヤノン株式会社 構造体の製造方法及びインクジェットヘッドの製造方法
US20100326819A1 (en) * 2009-06-24 2010-12-30 Hitachi Global Storage Technologies Netherlands B.V. Method for making a patterned perpendicular magnetic recording disk
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JP5443408B2 (ja) 2011-02-23 2014-03-19 株式会社東芝 半導体装置の製造方法
US9242498B2 (en) * 2011-07-26 2016-01-26 Seiko Epson Corporation Printing method, printing device, printed material and molded article
WO2013061209A1 (en) 2011-10-27 2013-05-02 Kimberly-Clark Worldwide, Inc. Implantable devices for delivery of bioactive agents
CN103365094B (zh) * 2012-04-09 2015-09-02 中芯国际集成电路制造(上海)有限公司 双重光刻胶结构及其处理方法
US20140093688A1 (en) * 2012-09-28 2014-04-03 Yindar Chuo Method for fabrication of nano-structures
CN103353708A (zh) * 2013-06-14 2013-10-16 大连理工大学 一种多层负性光刻胶模具制作方法
EP3238288B1 (en) * 2014-12-24 2020-07-29 Orthogonal Inc. Photolithographic patterning of electronic devices
EP3320399A1 (en) 2015-07-07 2018-05-16 Illumina, Inc. Selective surface patterning via nanoimprinting
US10672620B2 (en) 2016-02-01 2020-06-02 King Abdullah University Of Science And Technology Hybrid mask for deep etching
CN108037637A (zh) * 2017-11-30 2018-05-15 深圳华远微电科技有限公司 一种声表面波滤波器应用泛曝光的双层胶剥离工艺
CN110571145B (zh) * 2019-07-25 2022-03-11 西安电子科技大学 一种浮空y形栅的制备方法
CN110455033A (zh) * 2019-09-16 2019-11-15 长虹美菱股份有限公司 一种纳米压印多通道纹理的装饰型风道组件
JP7374826B2 (ja) * 2020-03-19 2023-11-07 キオクシア株式会社 テンプレートの製造方法
EP3958291A1 (en) * 2020-08-21 2022-02-23 Ams Ag Method for forming a lift-off mask structure
CN112195227A (zh) * 2020-09-18 2021-01-08 赛纳生物科技(北京)有限公司 一种基因测序基片的制备方法

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Also Published As

Publication number Publication date
US20040005444A1 (en) 2004-01-08
CN1437715A (zh) 2003-08-20
EP1275031A1 (en) 2003-01-15
WO2001079933A1 (en) 2001-10-25
SE0001430L (sv) 2001-10-19
SE516194C2 (sv) 2001-12-03
US7041228B2 (en) 2006-05-09
JP2004513504A (ja) 2004-04-30
CN1215528C (zh) 2005-08-17
AU2001248951A1 (en) 2001-10-30
SE0001430D0 (sv) 2000-04-18

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