SE0001430L - Substrat för samt process vid tillverkning av strukturer - Google Patents

Substrat för samt process vid tillverkning av strukturer

Info

Publication number
SE0001430L
SE0001430L SE0001430A SE0001430A SE0001430L SE 0001430 L SE0001430 L SE 0001430L SE 0001430 A SE0001430 A SE 0001430A SE 0001430 A SE0001430 A SE 0001430A SE 0001430 L SE0001430 L SE 0001430L
Authority
SE
Sweden
Prior art keywords
coating layer
substrate
stage
coating
fabrication
Prior art date
Application number
SE0001430A
Other languages
Unknown language ( )
English (en)
Other versions
SE516194C2 (sv
SE0001430D0 (sv
Inventor
Babak Heidari
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat Ab filed Critical Obducat Ab
Priority to SE0001430A priority Critical patent/SE516194C2/sv
Publication of SE0001430D0 publication Critical patent/SE0001430D0/sv
Priority to AU2001248951A priority patent/AU2001248951A1/en
Priority to PCT/SE2001/000788 priority patent/WO2001079933A1/en
Priority to US10/258,027 priority patent/US7041228B2/en
Priority to JP2001576539A priority patent/JP2004513504A/ja
Priority to EP01922176A priority patent/EP1275031A1/en
Priority to CNB018113737A priority patent/CN1215528C/zh
Publication of SE0001430L publication Critical patent/SE0001430L/sv
Publication of SE516194C2 publication Critical patent/SE516194C2/sv
Priority to HK03104798.3A priority patent/HK1052559A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0331—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers for lift-off processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SE0001430A 2000-04-18 2000-04-18 Substrat för samt process vid tillverkning av strukturer SE516194C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE0001430A SE516194C2 (sv) 2000-04-18 2000-04-18 Substrat för samt process vid tillverkning av strukturer
AU2001248951A AU2001248951A1 (en) 2000-04-18 2001-04-10 A substrate for and a process in connection with the product of structures
PCT/SE2001/000788 WO2001079933A1 (en) 2000-04-18 2001-04-10 A substrate for and a process in connection with the product of structures
US10/258,027 US7041228B2 (en) 2000-04-18 2001-04-10 Substrate for and a process in connection with the product of structures
JP2001576539A JP2004513504A (ja) 2000-04-18 2001-04-10 構造体に関連する基板及びその製造方法
EP01922176A EP1275031A1 (en) 2000-04-18 2001-04-10 A substrate for and a process in connection with the product of structures
CNB018113737A CN1215528C (zh) 2000-04-18 2001-04-10 衬底及与该结构的制造相关的工艺
HK03104798.3A HK1052559A1 (zh) 2000-04-18 2003-07-07 襯底及與該結構的製造相關的工藝

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0001430A SE516194C2 (sv) 2000-04-18 2000-04-18 Substrat för samt process vid tillverkning av strukturer

Publications (3)

Publication Number Publication Date
SE0001430D0 SE0001430D0 (sv) 2000-04-18
SE0001430L true SE0001430L (sv) 2001-10-19
SE516194C2 SE516194C2 (sv) 2001-12-03

Family

ID=20279359

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0001430A SE516194C2 (sv) 2000-04-18 2000-04-18 Substrat för samt process vid tillverkning av strukturer

Country Status (8)

Country Link
US (1) US7041228B2 (sv)
EP (1) EP1275031A1 (sv)
JP (1) JP2004513504A (sv)
CN (1) CN1215528C (sv)
AU (1) AU2001248951A1 (sv)
HK (1) HK1052559A1 (sv)
SE (1) SE516194C2 (sv)
WO (1) WO2001079933A1 (sv)

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JP4740518B2 (ja) 2000-07-17 2011-08-03 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム 転写リソグラフィ・プロセスのための自動液体ディスペンス方法およびシステム
FR2849221B1 (fr) * 2002-12-23 2005-10-07 Commissariat Energie Atomique Procede de lithographie par pressage d'un substrat mettant en oeuvre une nano-impression
US7005335B2 (en) * 2003-07-15 2006-02-28 Hewlett-Packard Development, L.P. Array of nanoscopic mosfet transistors and fabrication methods
GB2406543B (en) * 2003-10-04 2006-06-07 Agilent Technologies Inc A method for fabricating masters for imprint lithography and related imprint process
CN100373259C (zh) * 2003-12-26 2008-03-05 中国科学院上海微系统与信息技术研究所 最小尺寸为纳米量级图形的印刻方法
EP1730591B1 (en) * 2004-01-12 2011-08-03 Regents of the University of California Nanoscale electric lithography
US7730834B2 (en) * 2004-03-04 2010-06-08 Asml Netherlands B.V. Printing apparatus and device manufacturing method
US7141275B2 (en) * 2004-06-16 2006-11-28 Hewlett-Packard Development Company, L.P. Imprinting lithography using the liquid/solid transition of metals and their alloys
US7676088B2 (en) * 2004-12-23 2010-03-09 Asml Netherlands B.V. Imprint lithography
US20060144274A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US20060144814A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US7686970B2 (en) * 2004-12-30 2010-03-30 Asml Netherlands B.V. Imprint lithography
US7490547B2 (en) * 2004-12-30 2009-02-17 Asml Netherlands B.V. Imprint lithography
US7354698B2 (en) * 2005-01-07 2008-04-08 Asml Netherlands B.V. Imprint lithography
US7922474B2 (en) * 2005-02-17 2011-04-12 Asml Netherlands B.V. Imprint lithography
US7523701B2 (en) * 2005-03-07 2009-04-28 Asml Netherlands B.V. Imprint lithography method and apparatus
US7611348B2 (en) * 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography
US7762186B2 (en) * 2005-04-19 2010-07-27 Asml Netherlands B.V. Imprint lithography
US7442029B2 (en) * 2005-05-16 2008-10-28 Asml Netherlands B.V. Imprint lithography
US7692771B2 (en) * 2005-05-27 2010-04-06 Asml Netherlands B.V. Imprint lithography
US7708924B2 (en) * 2005-07-21 2010-05-04 Asml Netherlands B.V. Imprint lithography
US20060267231A1 (en) * 2005-05-27 2006-11-30 Asml Netherlands B.V. Imprint lithography
US7418902B2 (en) * 2005-05-31 2008-09-02 Asml Netherlands B.V. Imprint lithography including alignment
US7377764B2 (en) * 2005-06-13 2008-05-27 Asml Netherlands B.V. Imprint lithography
US7648641B2 (en) * 2005-06-17 2010-01-19 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for creating a topographically patterned substrate
US20070023976A1 (en) * 2005-07-26 2007-02-01 Asml Netherlands B.V. Imprint lithography
US8011915B2 (en) 2005-11-04 2011-09-06 Asml Netherlands B.V. Imprint lithography
US7878791B2 (en) * 2005-11-04 2011-02-01 Asml Netherlands B.V. Imprint lithography
US20070138699A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Imprint lithography
US7517211B2 (en) 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
US8318520B2 (en) * 2005-12-30 2012-11-27 Lin Ming-Nung Method of microminiaturizing a nano-structure
US20070134943A2 (en) * 2006-04-02 2007-06-14 Dunnrowicz Clarence J Subtractive - Additive Edge Defined Lithography
US8850980B2 (en) 2006-04-03 2014-10-07 Canon Nanotechnologies, Inc. Tessellated patterns in imprint lithography
US8015939B2 (en) 2006-06-30 2011-09-13 Asml Netherlands B.V. Imprintable medium dispenser
US8318253B2 (en) * 2006-06-30 2012-11-27 Asml Netherlands B.V. Imprint lithography
US20090038636A1 (en) * 2007-08-09 2009-02-12 Asml Netherlands B.V. Cleaning method
US7854877B2 (en) 2007-08-14 2010-12-21 Asml Netherlands B.V. Lithography meandering order
US8144309B2 (en) * 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography
JP5441148B2 (ja) * 2008-09-01 2014-03-12 学校法人東京電機大学 レジストの積層構造体およびレジストパターンの形成方法
JP5692992B2 (ja) * 2008-12-19 2015-04-01 キヤノン株式会社 構造体の製造方法及びインクジェットヘッドの製造方法
US20100326819A1 (en) * 2009-06-24 2010-12-30 Hitachi Global Storage Technologies Netherlands B.V. Method for making a patterned perpendicular magnetic recording disk
KR101790815B1 (ko) 2010-04-28 2017-10-26 킴벌리-클라크 월드와이드, 인크. 세포성 상호작용이 향상된 나노패턴화 의료 기구
JP5443408B2 (ja) 2011-02-23 2014-03-19 株式会社東芝 半導体装置の製造方法
US9242498B2 (en) * 2011-07-26 2016-01-26 Seiko Epson Corporation Printing method, printing device, printed material and molded article
WO2013061209A1 (en) 2011-10-27 2013-05-02 Kimberly-Clark Worldwide, Inc. Implantable devices for delivery of bioactive agents
CN103365094B (zh) * 2012-04-09 2015-09-02 中芯国际集成电路制造(上海)有限公司 双重光刻胶结构及其处理方法
US20140093688A1 (en) * 2012-09-28 2014-04-03 Yindar Chuo Method for fabrication of nano-structures
CN103353708A (zh) * 2013-06-14 2013-10-16 大连理工大学 一种多层负性光刻胶模具制作方法
EP3238288B1 (en) * 2014-12-24 2020-07-29 Orthogonal Inc. Photolithographic patterning of electronic devices
EP3320399A1 (en) 2015-07-07 2018-05-16 Illumina, Inc. Selective surface patterning via nanoimprinting
US10672620B2 (en) 2016-02-01 2020-06-02 King Abdullah University Of Science And Technology Hybrid mask for deep etching
CN108037637A (zh) * 2017-11-30 2018-05-15 深圳华远微电科技有限公司 一种声表面波滤波器应用泛曝光的双层胶剥离工艺
CN110571145B (zh) * 2019-07-25 2022-03-11 西安电子科技大学 一种浮空y形栅的制备方法
CN110455033A (zh) * 2019-09-16 2019-11-15 长虹美菱股份有限公司 一种纳米压印多通道纹理的装饰型风道组件
JP7374826B2 (ja) * 2020-03-19 2023-11-07 キオクシア株式会社 テンプレートの製造方法
EP3958291A1 (en) * 2020-08-21 2022-02-23 Ams Ag Method for forming a lift-off mask structure
CN112195227A (zh) * 2020-09-18 2021-01-08 赛纳生物科技(北京)有限公司 一种基因测序基片的制备方法

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Also Published As

Publication number Publication date
US20040005444A1 (en) 2004-01-08
CN1437715A (zh) 2003-08-20
EP1275031A1 (en) 2003-01-15
WO2001079933A1 (en) 2001-10-25
HK1052559A1 (zh) 2003-09-19
SE516194C2 (sv) 2001-12-03
US7041228B2 (en) 2006-05-09
JP2004513504A (ja) 2004-04-30
CN1215528C (zh) 2005-08-17
AU2001248951A1 (en) 2001-10-30
SE0001430D0 (sv) 2000-04-18

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