HK1051992A1 - 除氣和冷却兩用的裝卸鎖定組合裝置 - Google Patents

除氣和冷却兩用的裝卸鎖定組合裝置

Info

Publication number
HK1051992A1
HK1051992A1 HK03104372.7A HK03104372A HK1051992A1 HK 1051992 A1 HK1051992 A1 HK 1051992A1 HK 03104372 A HK03104372 A HK 03104372A HK 1051992 A1 HK1051992 A1 HK 1051992A1
Authority
HK
Hong Kong
Prior art keywords
wafer
chamber
loadlock
cooling
bell portion
Prior art date
Application number
HK03104372.7A
Other languages
English (en)
Inventor
安德魯‧克拉克
Original Assignee
安德魯‧克拉克
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/609,733 external-priority patent/US6235656B1/en
Application filed by 安德魯‧克拉克 filed Critical 安德魯‧克拉克
Publication of HK1051992A1 publication Critical patent/HK1051992A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
HK03104372.7A 2000-07-03 2003-06-18 除氣和冷却兩用的裝卸鎖定組合裝置 HK1051992A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/609,733 US6235656B1 (en) 2000-07-03 2000-07-03 Dual degas/cool loadlock cluster tool
US09/798,048 US6562141B2 (en) 2000-07-03 2001-03-05 Dual degas/cool loadlock cluster tool
PCT/US2001/021206 WO2002002445A1 (en) 2000-07-03 2001-07-02 Dual degas/cool loadlock cluster tool

Publications (1)

Publication Number Publication Date
HK1051992A1 true HK1051992A1 (zh) 2003-08-29

Family

ID=27086108

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03104372.7A HK1051992A1 (zh) 2000-07-03 2003-06-18 除氣和冷却兩用的裝卸鎖定組合裝置

Country Status (9)

Country Link
US (2) US6562141B2 (zh)
EP (1) EP1303449B1 (zh)
JP (1) JP5048198B2 (zh)
KR (1) KR20020047143A (zh)
CN (1) CN1193922C (zh)
AT (1) ATE324341T1 (zh)
DE (1) DE60119119T2 (zh)
HK (1) HK1051992A1 (zh)
WO (1) WO2002002445A1 (zh)

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Also Published As

Publication number Publication date
DE60119119D1 (de) 2006-06-01
US6562141B2 (en) 2003-05-13
EP1303449A4 (en) 2004-09-22
JP2004503099A (ja) 2004-01-29
ATE324341T1 (de) 2006-05-15
DE60119119T2 (de) 2007-01-04
US20020000194A1 (en) 2002-01-03
US20030066606A1 (en) 2003-04-10
EP1303449B1 (en) 2006-04-26
KR20020047143A (ko) 2002-06-21
CN1386105A (zh) 2002-12-18
EP1303449A1 (en) 2003-04-23
WO2002002445A1 (en) 2002-01-10
CN1193922C (zh) 2005-03-23
JP5048198B2 (ja) 2012-10-17

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