ATE324341T1 - Mehrkammerreaktor mit zwei entlüftungs-/kühl- schleusekammern - Google Patents

Mehrkammerreaktor mit zwei entlüftungs-/kühl- schleusekammern

Info

Publication number
ATE324341T1
ATE324341T1 AT01950859T AT01950859T ATE324341T1 AT E324341 T1 ATE324341 T1 AT E324341T1 AT 01950859 T AT01950859 T AT 01950859T AT 01950859 T AT01950859 T AT 01950859T AT E324341 T1 ATE324341 T1 AT E324341T1
Authority
AT
Austria
Prior art keywords
wafer
chamber
cooling
loadlock
bell portion
Prior art date
Application number
AT01950859T
Other languages
English (en)
Inventor
Andrew Clarke
Original Assignee
Tegal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/609,733 external-priority patent/US6235656B1/en
Application filed by Tegal Corp filed Critical Tegal Corp
Application granted granted Critical
Publication of ATE324341T1 publication Critical patent/ATE324341T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Earth Drilling (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
AT01950859T 2000-07-03 2001-07-02 Mehrkammerreaktor mit zwei entlüftungs-/kühl- schleusekammern ATE324341T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/609,733 US6235656B1 (en) 2000-07-03 2000-07-03 Dual degas/cool loadlock cluster tool
US09/798,048 US6562141B2 (en) 2000-07-03 2001-03-05 Dual degas/cool loadlock cluster tool

Publications (1)

Publication Number Publication Date
ATE324341T1 true ATE324341T1 (de) 2006-05-15

Family

ID=27086108

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01950859T ATE324341T1 (de) 2000-07-03 2001-07-02 Mehrkammerreaktor mit zwei entlüftungs-/kühl- schleusekammern

Country Status (9)

Country Link
US (2) US6562141B2 (de)
EP (1) EP1303449B1 (de)
JP (1) JP5048198B2 (de)
KR (1) KR20020047143A (de)
CN (1) CN1193922C (de)
AT (1) ATE324341T1 (de)
DE (1) DE60119119T2 (de)
HK (1) HK1051992A1 (de)
WO (1) WO2002002445A1 (de)

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SG115631A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
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US8617347B2 (en) * 2009-08-06 2013-12-31 Applied Materials, Inc. Vacuum processing chambers incorporating a moveable flow equalizer
JP5257328B2 (ja) * 2009-11-04 2013-08-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR101739606B1 (ko) * 2009-11-17 2017-05-24 에바텍 어드벤스드 테크놀로지스 아크티엔게젤샤프트 기판을 프로세싱하기 위한 방법 및 장치
JP5310512B2 (ja) * 2009-12-02 2013-10-09 東京エレクトロン株式会社 基板処理装置
JP5553588B2 (ja) * 2009-12-10 2014-07-16 東京エレクトロン株式会社 成膜装置
KR100996210B1 (ko) * 2010-04-12 2010-11-24 세메스 주식회사 가스 분사 유닛 및 이를 이용한 박막 증착 장치 및 방법
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DE102012104013A1 (de) * 2012-05-08 2013-11-14 Schmid Vacuum Technology Gmbh Hochvakuumanlage und Verfahren zum Evakuieren
KR20160083084A (ko) 2013-11-04 2016-07-11 어플라이드 머티어리얼스, 인코포레이티드 증가된 개수의 측들을 갖는 이송 챔버들, 반도체 디바이스 제조 프로세싱 툴들, 및 프로세싱 방법들
CN104746008B (zh) * 2013-12-30 2017-06-06 北京北方微电子基地设备工艺研究中心有限责任公司 去气腔室
US9453614B2 (en) * 2014-03-17 2016-09-27 Lam Research Corporation Systems and methods for cooling and removing reactants from a substrate processing chamber
JP6408904B2 (ja) * 2014-12-25 2018-10-17 東京エレクトロン株式会社 真空引き方法及び真空処理装置
TW201639063A (zh) 2015-01-22 2016-11-01 應用材料股份有限公司 批量加熱和冷卻腔室或負載鎖定裝置
WO2016184487A1 (en) * 2015-05-15 2016-11-24 Applied Materials, Inc. Load lock chamber, vacuum processing system with load lock chamber and method for evacuating a load lock chamber
CN106298585B (zh) * 2015-06-03 2020-10-16 北京北方华创微电子装备有限公司 腔室及半导体加工设备
DE102015110711A1 (de) 2015-07-02 2017-01-05 Endress+Hauser Flowtec Ag MEMS Sensor zu Messung mindestens einer Messgröße eines strömenden Fluids
CN107958851B (zh) * 2016-10-14 2022-08-16 北京北方华创微电子装备有限公司 传输腔室及半导体加工设备
US11802340B2 (en) * 2016-12-12 2023-10-31 Applied Materials, Inc. UHV in-situ cryo-cool chamber
WO2021044622A1 (ja) * 2019-09-06 2021-03-11 キヤノンアネルバ株式会社 ロードロック装置
JP7451436B2 (ja) 2020-02-14 2024-03-18 芝浦メカトロニクス株式会社 成膜装置及び成膜装置の水分除去方法
CN113265626B (zh) * 2020-02-14 2023-06-16 芝浦机械电子装置株式会社 成膜装置及成膜装置的水分去除方法
CN114875381B (zh) * 2022-05-13 2023-03-31 广东华升纳米科技股份有限公司 真空镀膜腔和真空镀膜设备

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Also Published As

Publication number Publication date
DE60119119T2 (de) 2007-01-04
US20030066606A1 (en) 2003-04-10
JP2004503099A (ja) 2004-01-29
KR20020047143A (ko) 2002-06-21
JP5048198B2 (ja) 2012-10-17
DE60119119D1 (de) 2006-06-01
EP1303449B1 (de) 2006-04-26
EP1303449A1 (de) 2003-04-23
CN1193922C (zh) 2005-03-23
WO2002002445A1 (en) 2002-01-10
US6562141B2 (en) 2003-05-13
HK1051992A1 (zh) 2003-08-29
US20020000194A1 (en) 2002-01-03
CN1386105A (zh) 2002-12-18
EP1303449A4 (de) 2004-09-22

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