HK1049566A1 - 電子元件壓力粘合機和壓力粘合方法 - Google Patents

電子元件壓力粘合機和壓力粘合方法

Info

Publication number
HK1049566A1
HK1049566A1 HK03101594.5A HK03101594A HK1049566A1 HK 1049566 A1 HK1049566 A1 HK 1049566A1 HK 03101594 A HK03101594 A HK 03101594A HK 1049566 A1 HK1049566 A1 HK 1049566A1
Authority
HK
Hong Kong
Prior art keywords
electric component
bonding machine
compression bonding
component compression
machine
Prior art date
Application number
HK03101594.5A
Other languages
English (en)
Inventor
小川佳次
荻本真一
岩永邦廣
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of HK1049566A1 publication Critical patent/HK1049566A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/46—Machines having sequentially arranged operating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
HK03101594.5A 2001-02-01 2003-03-04 電子元件壓力粘合機和壓力粘合方法 HK1049566A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001067793 2001-02-01

Publications (1)

Publication Number Publication Date
HK1049566A1 true HK1049566A1 (zh) 2003-05-16

Family

ID=18926080

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03101594.5A HK1049566A1 (zh) 2001-02-01 2003-03-04 電子元件壓力粘合機和壓力粘合方法

Country Status (5)

Country Link
US (1) US6623577B2 (zh)
KR (1) KR100470133B1 (zh)
CN (1) CN1223254C (zh)
HK (1) HK1049566A1 (zh)
TW (1) TWI233651B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7094814B2 (en) * 2000-09-01 2006-08-22 Toda Kogyo Corporation Coloring composition for color filter containing colorant and color filter using the same
KR100720420B1 (ko) * 2002-03-25 2007-05-22 엘지.필립스 엘시디 주식회사 액정표시소자용 합착 장치의 동작 제어 방법 및 그 장치
KR100502886B1 (ko) * 2003-01-22 2005-07-21 엘지전자 주식회사 플라즈마 디스플레이 패널의 상부기판 제조 방법
US20070084566A1 (en) * 2005-10-12 2007-04-19 Shingo Seki Press-bonding apparatus and press-bonding method
TW201114538A (en) * 2009-10-30 2011-05-01 Askey Computer Corp Press bonding method and press bonding jig
TW201248251A (en) * 2011-05-19 2012-12-01 Askey Computer Corp Carrier and its lamination apparatus
TWI441293B (zh) * 2011-06-29 2014-06-11 Au Optronics Corp 緩衝元件及應用此緩衝元件之覆晶軟膜接合方法
US8946561B2 (en) * 2012-01-18 2015-02-03 Apple Inc. Flexible circuitry with heat and pressure spreading layers
JP6019396B2 (ja) * 2012-08-27 2016-11-02 パナソニックＩｐマネジメント株式会社 部品実装装置
KR102005426B1 (ko) * 2013-05-09 2019-07-31 삼성디스플레이 주식회사 연성회로기판의 접합 방법, 패널 및 연성회로기판 조립체 및 이를 구비한 디스플레이 장치
CN104678612B (zh) * 2013-11-29 2018-12-14 芝浦机械电子装置株式会社 基板贴合装置、显示面板制造装置及显示面板制造方法
KR20160048301A (ko) * 2014-10-23 2016-05-04 삼성전자주식회사 본딩 장치 및 그를 포함하는 기판 제조 설비
JPWO2016114206A1 (ja) * 2015-01-14 2017-10-12 シャープ株式会社 実装基板の製造装置、及び実装基板の製造方法
CN106842643A (zh) * 2016-12-31 2017-06-13 固安翌光科技有限公司 一种本压设备及其操作工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106451A (en) * 1990-11-15 1992-04-21 International Business Machines Corporation Heat sink and method of attachment
KR0145258B1 (ko) * 1993-11-16 1998-08-17 모리시타 요이찌 전자부품의 본딩장치
JP3185578B2 (ja) * 1995-01-05 2001-07-11 松下電器産業株式会社 電子部品圧着装置
JP3239692B2 (ja) * 1995-07-10 2001-12-17 松下電器産業株式会社 電子部品圧着装置及び電子部品圧着方法
US5895554A (en) * 1997-02-21 1999-04-20 Gordon; Thomas A. Alignment method and apparatus for mounting electronic components
JP3355983B2 (ja) * 1997-03-12 2002-12-09 セイコーエプソン株式会社 電子部品の実装装置、及び液晶表示素子の製造装置
SI20041B (sl) * 1998-06-05 2006-10-31 Keko Oprema D.O.O. Postopek zlaganja vecslojnih pasivnih elektronskih komponent
JP3271606B2 (ja) * 1999-03-16 2002-04-02 松下電器産業株式会社 電子部品のボンディング装置およびボンディング方法

Also Published As

Publication number Publication date
CN1374830A (zh) 2002-10-16
US20020117267A1 (en) 2002-08-29
KR20020064679A (ko) 2002-08-09
CN1223254C (zh) 2005-10-12
US6623577B2 (en) 2003-09-23
KR100470133B1 (ko) 2005-02-04
TWI233651B (en) 2005-06-01

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