HK1047446B - 包含熱可膨脹微膠囊的粘合劑組合物 - Google Patents

包含熱可膨脹微膠囊的粘合劑組合物

Info

Publication number
HK1047446B
HK1047446B HK02106741.7A HK02106741A HK1047446B HK 1047446 B HK1047446 B HK 1047446B HK 02106741 A HK02106741 A HK 02106741A HK 1047446 B HK1047446 B HK 1047446B
Authority
HK
Hong Kong
Prior art keywords
microcapsules
adhesive composition
thermoexpandable
thermoexpandable microcapsules
adhesive
Prior art date
Application number
HK02106741.7A
Other languages
English (en)
Other versions
HK1047446A1 (en
Inventor
Stewart Bain Peter
Manfre Giovanni
Original Assignee
Stewart Bain Peter
Manfre Giovanni
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10854522&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1047446(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Stewart Bain Peter, Manfre Giovanni filed Critical Stewart Bain Peter
Publication of HK1047446A1 publication Critical patent/HK1047446A1/xx
Publication of HK1047446B publication Critical patent/HK1047446B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/45—Assembling sealing arrangements with vehicle parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
    • B60J10/00—Sealing arrangements
    • B60J10/70—Sealing arrangements specially adapted for windows or windscreens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00—Foams characterized by the expanding agent
    • C08J2203/22—Expandable microspheres, e.g. Expancel®
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2207/00—Foams characterised by their intended use
    • C08J2207/02—Adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Materials For Medical Uses (AREA)
HK02106741.7A 1999-06-02 2002-09-13 包含熱可膨脹微膠囊的粘合劑組合物 HK1047446B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9912694.8A GB9912694D0 (en) 1999-06-02 1999-06-02 Adhesive
PCT/GB2000/002059 WO2000075254A1 (en) 1999-06-02 2000-05-26 Adhesive composition comprising thermoexpandable microcapsules

Publications (2)

Publication Number Publication Date
HK1047446A1 HK1047446A1 (en) 2003-02-21
HK1047446B true HK1047446B (zh) 2005-09-23

Family

ID=10854522

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02106741.7A HK1047446B (zh) 1999-06-02 2002-09-13 包含熱可膨脹微膠囊的粘合劑組合物

Country Status (20)

Country Link
EP (1) EP1185594B2 (zh)
JP (1) JP2003501544A (zh)
KR (1) KR100696436B1 (zh)
CN (1) CN1192070C (zh)
AT (1) ATE292168T1 (zh)
AU (1) AU4940200A (zh)
BR (1) BR0011128B1 (zh)
CZ (1) CZ20014260A3 (zh)
DE (1) DE60019109T3 (zh)
ES (1) ES2239007T5 (zh)
GB (2) GB9912694D0 (zh)
HK (1) HK1047446B (zh)
HU (1) HUP0202982A2 (zh)
MX (1) MXPA01012504A (zh)
PL (1) PL352210A1 (zh)
PT (1) PT1185594E (zh)
RU (1) RU2265636C2 (zh)
TR (1) TR200103487T2 (zh)
WO (1) WO2000075254A1 (zh)
ZA (1) ZA200109817B (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7371300B2 (en) 1999-06-02 2008-05-13 De-Bonding Limited Adhesive composition comprising thermoexpandable microcapsules
US9511536B2 (en) * 2002-10-18 2016-12-06 The Boeing Company Method and apparatus to assist with removing an adhesive system
FR2852965B1 (fr) * 2003-03-25 2005-06-03 Rescoll Soc Procede de demontage des revetements et assemblages colles programme par utilisation de primaires d'adhesion modifies
WO2004087826A2 (en) 2003-04-01 2004-10-14 De-Bonding Limited Method and apparatus for bonding and debonding adhesive interface surfaces
FR2877349B1 (fr) * 2004-11-04 2007-04-27 Rescoll Sarl Soc Procede d'assemblage de deux substrats par collage, procede de demontage de cet assemblage colle par migration
ES2553580T3 (es) * 2007-02-28 2015-12-10 Basf Se Método para producir elementos compuestos con base en material espumado a base de isocianato
US8709141B2 (en) 2007-03-02 2014-04-29 Ppg Industries Ohio, Inc. Heat releasable composite coatings and related methods
DE202007019297U1 (de) 2007-10-19 2011-11-14 Nitto Denko Corp. Ein Klebeband
BRPI0913965A2 (pt) * 2008-06-27 2015-10-20 Glabete Ag composição de fixação e processo para a fixação de um objeto em uma base
GB0811941D0 (en) * 2008-07-01 2008-07-30 Bonding Ltd De Coated thermoexpandable microspheres
WO2010077774A2 (en) 2008-12-17 2010-07-08 Dow Corning Corporation Suspensions of silicate shell microcapsules for temperature controlled release
DE102009019483A1 (de) 2009-05-04 2010-11-11 Eads Deutschland Gmbh Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung
DE102009019484B4 (de) * 2009-05-04 2015-12-17 Airbus Defence and Space GmbH Kombination der Effekte von Expansionsstoffen und chemischen Abbaureagenzien für lösbare Klebeverbindungen
WO2011069771A1 (en) 2009-12-09 2011-06-16 Evonik Degussa Gmbh Heat-expandable microcapsules comprising magnetic metal oxide particles
FR2954776B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere rigide, procedes de montage et de demontage par migration de cet assemblage colle
FR2954777B1 (fr) 2009-12-29 2013-03-08 Rescoll Assemblage de deux substrats colles par un polymere souple, procedes de montage et de demontage par migration de cet assemblage colle
DE102011087636A1 (de) 2011-12-02 2013-06-06 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzte Scheibe
DE102011087656B4 (de) * 2011-12-02 2022-09-22 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Entfernen einer durch Verklebung in einen Rahmen eingesetzten Scheibe
CN104119811A (zh) * 2013-04-26 2014-10-29 鸿富锦精密工业（深圳）有限公司 粘结结构及其采用的表面处理剂
EP2942334A1 (de) * 2014-05-06 2015-11-11 Siemens Aktiengesellschaft Schichtsystem für ein Bauteil
GB201416183D0 (en) * 2014-09-12 2014-10-29 Pilkington Group Ltd Wired glazing
KR20180063959A (ko) 2016-12-02 2018-06-14 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
KR20180136029A (ko) 2017-06-13 2018-12-24 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
CN116234850A (zh) 2020-09-30 2023-06-06 巴斯夫欧洲公司 基于热膨胀微球的可脱粘聚氨酯粘合剂
JP7106779B1 (ja) 2021-03-31 2022-07-26 株式会社Ｄｎｐファインケミカル 非水性インク組成物、インクセット、それを用いた記録方法、記録物の製造方法、記録物、及びインクジェット記録装置
DE102021210563A1 (de) 2021-09-22 2023-03-23 Tesa Se Primer zur Herstellung einer lösbaren Klebverbindung
CN114437636B (zh) * 2022-02-24 2023-06-16 韦尔通科技股份有限公司 一种单组份丙烯酸酯胶黏剂及其制备方法和基材的粘接方法

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JP3057236B2 (ja) * 1990-07-01 2000-06-26 株式会社アルファ技研 ２―シアノアクリレート系組成物
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ATE141222T1 (de) * 1991-07-03 1996-08-15 Gurit Essex Ag Lösbare klebeverbindungen, verfahren zu deren herstellung und verwendung von vorrichtungen zum lösen solcher klebeverbindungen
JP2970963B2 (ja) † 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
JPH05269906A (ja) * 1992-03-26 1993-10-19 Toppan Printing Co Ltd 積層体およびその分離方法
JP3405576B2 (ja) * 1993-11-12 2003-05-12 ダイセル化学工業株式会社 熱剥離性フィルム及び剥離方法
IT1269293B (it) * 1994-03-07 1997-03-26 Ppg Ind Italia S R L Composizione di adesivo per il riempimento di parti scatolate di scocche di veicoli
ES2146284T3 (es) * 1994-12-15 2000-08-01 Saint Gobain Performance Plast Adhesivo esponjoso sensible a la presion.
JPH1072035A (ja) * 1996-08-27 1998-03-17 Shiseido Co Ltd 装着部材付き容器
JP3810911B2 (ja) * 1997-12-01 2006-08-16 日東電工株式会社 加熱剥離型粘着シート
DE19822044A1 (de) † 1998-05-16 2000-01-13 Daimler Chrysler Ag Klebeverbindung
JP4540150B2 (ja) * 1998-09-30 2010-09-08 日東電工株式会社 熱剥離型粘着シート
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JP2001226650A (ja) * 2000-02-16 2001-08-21 Nitto Denko Corp 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2001323228A (ja) * 2000-05-15 2001-11-22 Nitto Denko Corp 加熱剥離型粘着シート

Also Published As

Publication number Publication date
WO2000075254A1 (en) 2000-12-14
JP2003501544A (ja) 2003-01-14
BR0011128B1 (pt) 2011-07-12
HK1047446A1 (en) 2003-02-21
HUP0202982A2 (en) 2002-12-28
EP1185594B2 (en) 2009-02-25
ZA200109817B (en) 2002-03-27
ES2239007T3 (es) 2005-09-16
CZ20014260A3 (cs) 2002-04-17
RU2265636C2 (ru) 2005-12-10
KR100696436B1 (ko) 2007-03-19
CN1192070C (zh) 2005-03-09
EP1185594A1 (en) 2002-03-13
AU4940200A (en) 2000-12-28
DE60019109T2 (de) 2006-02-02
DE60019109T3 (de) 2010-01-14
PL352210A1 (en) 2003-08-11
GB9912694D0 (en) 1999-08-04
GB2365431A (en) 2002-02-20
BR0011128A (pt) 2002-02-26
PT1185594E (pt) 2005-07-29
ATE292168T1 (de) 2005-04-15
EP1185594B1 (en) 2005-03-30
GB2365431B (en) 2003-12-17
MXPA01012504A (es) 2003-10-14
GB0127411D0 (en) 2002-01-09
ES2239007T5 (es) 2009-06-02
CN1354774A (zh) 2002-06-19
TR200103487T2 (tr) 2002-04-22
KR20020034085A (ko) 2002-05-08
DE60019109D1 (de) 2005-05-04

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Legal Events

Date Code Title Description
AM43 Amendment of standard patent following opposition or revocation proceedings in the designated patent office (acc. sect 43 patent ordinance)
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20120526