HK1032334A2 - Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate - Google Patents

Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate

Info

Publication number
HK1032334A2
HK1032334A2 HK00108081A HK00108081A HK1032334A2 HK 1032334 A2 HK1032334 A2 HK 1032334A2 HK 00108081 A HK00108081 A HK 00108081A HK 00108081 A HK00108081 A HK 00108081A HK 1032334 A2 HK1032334 A2 HK 1032334A2
Authority
HK
Hong Kong
Prior art keywords
bonder
suction device
holding down
curved substrate
pulling flat
Prior art date
Application number
HK00108081A
Other languages
English (en)
Inventor
Stefan Behler
Reto Schubiger
Beat Zumbuehl
Original Assignee
Esec Trading Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Trading Sa filed Critical Esec Trading Sa
Publication of HK1032334A2 publication Critical patent/HK1032334A2/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK00108081A 1999-12-14 2000-12-14 Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate HK1032334A2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH229099 1999-12-14

Publications (1)

Publication Number Publication Date
HK1032334A2 true HK1032334A2 (en) 2001-07-06

Family

ID=4230324

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00108081A HK1032334A2 (en) 1999-12-14 2000-12-14 Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate

Country Status (7)

Country Link
US (1) US6435492B1 (ko)
KR (1) KR100655981B1 (ko)
CH (1) CH695405A5 (ko)
DE (1) DE10059883A1 (ko)
HK (1) HK1032334A2 (ko)
SG (1) SG90213A1 (ko)
TW (1) TW478024B (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH695075A5 (de) * 2000-07-03 2005-11-30 Esec Trading Sa Greifwerkzeug.
TW527674B (en) * 2000-12-06 2003-04-11 Esec Trading Sa Die bonder and/or wire bonder with a device for holding down a substrate
US6564979B2 (en) * 2001-07-18 2003-05-20 Micron Technology, Inc. Method and apparatus for dispensing adhesive on microelectronic substrate supports
DE10159921A1 (de) * 2001-12-06 2003-06-18 Imt Robot Ag Objektgreifer für die Automatisierungstechnik
TWI271247B (en) * 2003-03-21 2007-01-21 Esec Trading Sa Wire bonder
JP4312001B2 (ja) * 2003-07-28 2009-08-12 リアライズ・アドバンストテクノロジ株式会社 基板支持装置および基板取り外し方法
US7044476B2 (en) * 2003-11-25 2006-05-16 N&K Technology, Inc. Compact pinlifter assembly integrated in wafer chuck
JP4555008B2 (ja) * 2004-07-08 2010-09-29 パナソニック株式会社 部品実装装置
TW200602713A (en) * 2004-07-08 2006-01-16 Matsushita Electric Ind Co Ltd Substrate processing apparatus and mounter
DE102011001879A1 (de) * 2011-04-07 2012-10-11 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Spannen verformter Wafer
CN103904011B (zh) * 2012-12-28 2016-12-28 上海微电子装备有限公司 翘曲硅片吸附装置及其吸附方法
US9630269B2 (en) 2013-10-30 2017-04-25 Globalfoundries Inc. Mechanism to attach a die to a substrate
JP6663252B2 (ja) * 2016-03-01 2020-03-11 株式会社アドテックエンジニアリング プリント基板用露光装置
JP6789368B2 (ja) * 2019-12-25 2020-11-25 株式会社アドテックエンジニアリング プリント基板用露光装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE794002A (fr) * 1972-01-13 1973-05-02 Coburn Optical Ind Dispositif porte-verre a effet de ventouse pour machine a finir des verres ophtalmiques
US3934916A (en) * 1974-01-25 1976-01-27 Kliklok Corporation Vacuum pickup cup
FR2527124A1 (fr) 1982-05-18 1983-11-25 Gerber Scient Products Inc Porte-piece a depression
US4566170A (en) 1983-05-10 1986-01-28 Pitney Bowes Inc. Method of producing a light emiting diode array
NL8701603A (nl) 1987-07-08 1989-02-01 Philips & Du Pont Optical Vacuuminrichting voor het vastzuigen van werkstukken.
JPH0831515B2 (ja) * 1988-06-21 1996-03-27 株式会社ニコン 基板の吸着装置
JPH02105429A (ja) 1988-10-13 1990-04-18 Nec Corp リードフレーム供給装置
DE69133413D1 (de) 1990-05-07 2004-10-21 Canon Kk Substratträger des Vakuumtyps
US5281794A (en) 1990-05-25 1994-01-25 Kabushiki Kaisha Shinkawa Heater block for use in a bonder utilizing vacuum suction attachment means
DE4024642A1 (de) 1990-08-03 1992-02-06 Ibm Schleuderteller fuer substrate
DE4129146A1 (de) 1991-09-02 1993-03-04 Siemens Nixdorf Inf Syst Bandfoermiger hilfstraeger als montagehilfe fuer die zeilenweise montage von halbleiterchips auf einer passflaeche eines traegerelementes und ein zugehoeriges montageverfahren
USH1373H (en) 1992-04-06 1994-11-01 American Telephone And Telegraph Company Wafer handling apparatus and method
JPH0669254A (ja) 1992-08-13 1994-03-11 Hitachi Ltd リードフレーム位置決めストッパ機構およびそれを用いたワイヤボンダ
JPH0758191A (ja) 1993-08-13 1995-03-03 Toshiba Corp ウェハステージ装置
JP3225336B2 (ja) 1995-07-13 2001-11-05 株式会社新川 リードフレームの吸着保持装置
US5923408A (en) 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US5937993A (en) 1997-01-14 1999-08-17 Tamarac Scientific Co., Inc. Apparatus and method for automatically handling and holding panels near and at the exact plane of exposure
US6164633A (en) * 1999-05-18 2000-12-26 International Business Machines Corporation Multiple size wafer vacuum chuck

Also Published As

Publication number Publication date
KR100655981B1 (ko) 2006-12-08
US6435492B1 (en) 2002-08-20
KR20010062185A (ko) 2001-07-07
CH695405A5 (de) 2006-04-28
SG90213A1 (en) 2002-07-23
DE10059883A1 (de) 2001-09-20
TW478024B (en) 2002-03-01
US20020093130A1 (en) 2002-07-18

Similar Documents

Publication Publication Date Title
HK1032334A2 (en) Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate
EP1174928A4 (en) SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SUBSTRATE
HK1038439A1 (zh) 半導體器件及其制造方法
AU2001272741A1 (en) Semiconductor light-emitting device and semiconductor light-emitting apparatus
AU2003218146A8 (en) Semiconductor device having a wire bond pad and method therefor
GB2381122B (en) Termination structure for a semiconductor device
EP1353390A4 (en) BATTERY PACK AND CONDUCTIVE WIRE FILM
AU2002254726A1 (en) Semiconductor device and a method therefor
EP1164595A4 (en) SEMICONDUCTOR DEVICE
SG97903A1 (en) Semiconductor device
HK1081326A1 (en) Semiconductor device with wire bond inductor and method
TW576544U (en) Semiconductor device
GB0000106D0 (en) Semiconductor device
EP1169731A4 (en) SEMICONDUCTOR DEVICE COMPRISING A SELF-ALIGNED CONTACTS STRUCTURE AND METHODS OF MANUFACTURING THE SAME
HK1053012A1 (en) Semiconductor device and forming method thereof
EP1179851A4 (en) SEMICONDUCTOR
AU2002228825A1 (en) Semiconductor device package and lead frame with die overhanging lead frame pad
EP1100131A4 (en) CHIP LIGHT EMITTING DEVICE
GB2347014B (en) Semiconductor device
GB2356489B (en) Semiconductor device
GB2347266B (en) Semiconductor device and fabrication process therefor
GB2354879B (en) A semiconductor device
SG92747A1 (en) Bonhead for a wire bonder
EP1229591A4 (en) SEMICONDUCTOR DEVICE
EP1220071A4 (en) SEMICONDUCTOR DEVICE

Legal Events

Date Code Title Description
PF Patent in force
PF2 Short-term patent ceased to have effect under s.126(2) (not payment of maintenance fee and has 6-month grace period to pay)

Effective date: 20041214