HK1030987A1 - Device and assembly for testing electronic components - Google Patents

Device and assembly for testing electronic components

Info

Publication number
HK1030987A1
HK1030987A1 HK01100284A HK01100284A HK1030987A1 HK 1030987 A1 HK1030987 A1 HK 1030987A1 HK 01100284 A HK01100284 A HK 01100284A HK 01100284 A HK01100284 A HK 01100284A HK 1030987 A1 HK1030987 A1 HK 1030987A1
Authority
HK
Hong Kong
Prior art keywords
assembly
electronic components
testing electronic
testing
components
Prior art date
Application number
HK01100284A
Other languages
English (en)
Inventor
Willem Antonie Hennekes
Antoon Willem Pothoven
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Publication of HK1030987A1 publication Critical patent/HK1030987A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
HK01100284A 1998-03-25 2001-01-11 Device and assembly for testing electronic components HK1030987A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1008697A NL1008697C2 (nl) 1998-03-25 1998-03-25 Testinrichting, testsamenstel, werkwijze voor testen en werkwijze voor kalibreren van een testinrichting.
PCT/NL1999/000166 WO1999049328A1 (fr) 1998-03-25 1999-03-24 Dispositif, ensemble, et procede pour controler des composants electroniques, et procede de calibrage s'y rapportant

Publications (1)

Publication Number Publication Date
HK1030987A1 true HK1030987A1 (en) 2001-05-25

Family

ID=19766811

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01100284A HK1030987A1 (en) 1998-03-25 2001-01-11 Device and assembly for testing electronic components

Country Status (9)

Country Link
US (1) US6507185B1 (fr)
EP (1) EP1066535B1 (fr)
JP (1) JP2002507753A (fr)
KR (1) KR20010042154A (fr)
DE (1) DE69912589T2 (fr)
HK (1) HK1030987A1 (fr)
NL (1) NL1008697C2 (fr)
TW (1) TW363131B (fr)
WO (1) WO1999049328A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6734694B2 (en) * 2001-03-19 2004-05-11 Juki Corporation Method and apparatus for automatically testing semiconductor device
NL1017656C2 (nl) * 2001-03-20 2002-09-23 Rentec B V Inrichting en werkwijze voor het testen van circuit modules.
US6783316B2 (en) * 2001-06-26 2004-08-31 Asm Assembly Automation Limited Apparatus and method for testing semiconductor devices
DE10131712B4 (de) * 2001-06-29 2009-04-09 Qimonda Ag Elektronisches Bauelement, Testereinrichtung und Verfahren zur Kalibrierung einer Testereinrichtung
US6756800B2 (en) * 2002-04-16 2004-06-29 Teradyne, Inc. Semiconductor test system with easily changed interface unit
KR100941674B1 (ko) * 2008-01-29 2010-02-12 (주)테크윙 전자부품 검사 지원을 위한 핸들러용 캐리어보드이송시스템 및 전자부품 검사 지원을 위한 핸들러의 챔버내에서의 캐리어보드 이송방법
US7924033B2 (en) * 2008-03-21 2011-04-12 Electro Scientific Industries, Inc. Compensation tool for calibrating an electronic component testing machine to a standardized value
CN101923151B (zh) * 2009-06-12 2013-01-09 河南电力试验研究院 流水线型电能表定位接线系统
CN101923150B (zh) * 2009-06-12 2013-01-30 郑州三晖电气股份有限公司 一种电能表定位接线机构
CN101923149B (zh) * 2009-06-12 2013-03-13 郑州三晖电气股份有限公司 电能表定位接线机构
KR101033992B1 (ko) * 2009-12-29 2011-05-11 주식회사 이엔씨 테크놀로지 Ｌｅｄ 검사장치
DE102011112532B4 (de) * 2011-09-05 2019-03-21 Audi Ag Prüfeinrichtung und Verfahren zum Prüfen von Batteriezellen
US20130200915A1 (en) * 2012-02-06 2013-08-08 Peter G. Panagas Test System with Test Trays and Automated Test Tray Handling
DE102017003683A1 (de) * 2017-04-18 2018-10-18 Franka Emika Gmbh Verfahren zum Überführen eines zu prüfenden Bauteils und Roboter zur Durchführung dieses Verfahrens
DE102017118978A1 (de) 2017-04-23 2018-10-25 Franka Emika Gmbh Vorrichtung und Verfahren zur elektrischen Prüfung eines elektrischen Bauteils
DE102017118980B4 (de) * 2017-04-23 2018-11-08 Franka Emika Gmbh Vorrichtung und Verfahren zur elektrischen Prüfung eines elektrischen Bauteils
DE202018100762U1 (de) * 2018-02-13 2019-05-14 topometric GmbH Prüfstation
TWI676031B (zh) * 2018-09-06 2019-11-01 致茂電子股份有限公司 滑移式電子元件測試裝置
CN109188159A (zh) * 2018-09-25 2019-01-11 珠海格力智能装备有限公司 检测装置及产品安全性能参数检测的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930702085A (ko) * 1990-09-24 1993-09-08 레이몬드 지. 트위그 전자장치 테스트 처리기
US5151650A (en) * 1991-09-03 1992-09-29 Motorola, Inc. Packaged semiconductor device handler
GB2320965B (en) * 1993-11-25 1998-08-26 Motorola Inc Method for testing electronic devices attached to a leadframe
JP3134738B2 (ja) * 1995-09-28 2001-02-13 安藤電気株式会社 ハンドリングシステム
WO1997029383A1 (fr) * 1996-02-09 1997-08-14 Mci Computer Gmbh Procede de manipulation de composants electroniques
US6008636A (en) * 1997-09-30 1999-12-28 Motorola, Inc. Test system with robot arm for delivering a device under test

Also Published As

Publication number Publication date
JP2002507753A (ja) 2002-03-12
NL1008697C2 (nl) 1999-09-28
US6507185B1 (en) 2003-01-14
TW363131B (en) 1999-07-01
WO1999049328A1 (fr) 1999-09-30
DE69912589D1 (de) 2003-12-11
EP1066535A1 (fr) 2001-01-10
KR20010042154A (ko) 2001-05-25
EP1066535B1 (fr) 2003-11-05
DE69912589T2 (de) 2004-09-16

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20080324