HK1030260A1 - Conductive contact - Google Patents

Conductive contact

Info

Publication number
HK1030260A1
HK1030260A1 HK01101231A HK01101231A HK1030260A1 HK 1030260 A1 HK1030260 A1 HK 1030260A1 HK 01101231 A HK01101231 A HK 01101231A HK 01101231 A HK01101231 A HK 01101231A HK 1030260 A1 HK1030260 A1 HK 1030260A1
Authority
HK
Hong Kong
Prior art keywords
conductive contact
conductive
contact
Prior art date
Application number
HK01101231A
Other languages
English (en)
Inventor
Toshio Kazama
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of HK1030260A1 publication Critical patent/HK1030260A1/xx

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06722Spring-loaded
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK01101231A 1997-07-14 2001-02-21 Conductive contact HK1030260A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18858797 1997-07-14
PCT/JP1998/003131 WO1999004274A1 (fr) 1997-07-14 1998-07-13 Contact conducteur

Publications (1)

Publication Number Publication Date
HK1030260A1 true HK1030260A1 (en) 2001-04-27

Family

ID=16226288

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01101231A HK1030260A1 (en) 1997-07-14 2001-02-21 Conductive contact

Country Status (9)

Country Link
US (1) US6337572B1 (fr)
EP (1) EP0995996B1 (fr)
KR (1) KR20010021666A (fr)
CN (1) CN1257410C (fr)
DE (1) DE69831491T2 (fr)
HK (1) HK1030260A1 (fr)
IL (1) IL125320A (fr)
MY (1) MY125717A (fr)
WO (1) WO1999004274A1 (fr)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1226632C (zh) * 1998-07-10 2005-11-09 日本发条株式会社 导电的接触单元
JP4124520B2 (ja) * 1998-07-30 2008-07-23 日本発条株式会社 導電性接触子のホルダ及びその製造方法
WO2000073805A1 (fr) * 1999-05-28 2000-12-07 Nhk Spring Co., Ltd. Contact conducteur
JP5075309B2 (ja) * 2001-03-16 2012-11-21 日本発條株式会社 導電性接触子用支持体
US6565395B1 (en) * 2001-12-21 2003-05-20 Northrop Grumman Corporation Electrical connection to a coil spring through a local interference fit for connection to a vibratory rotation sensor and method of forming the same
JP3990915B2 (ja) * 2002-01-23 2007-10-17 日本発条株式会社 導電性接触子
US7239158B2 (en) * 2002-04-16 2007-07-03 Nhk Spring Co., Ltd. Holder for conductive contact
JP4721637B2 (ja) * 2003-12-25 2011-07-13 日本発條株式会社 導電性接触子ホルダ、導電性接触子ユニット、導電性接触子ホルダの製造方法および検査方法
WO2006064546A1 (fr) * 2004-12-14 2006-06-22 Advantest Corporation Broche de contact, carte de pointe utilisant celle-ci et appareil d’essai de dispositif electronique
US7626408B1 (en) * 2005-02-03 2009-12-01 KK Technologies, Inc. Electrical spring probe
US7154286B1 (en) * 2005-06-30 2006-12-26 Interconnect Devices, Inc. Dual tapered spring probe
US7601009B2 (en) * 2006-05-18 2009-10-13 Centipede Systems, Inc. Socket for an electronic device
DE102007035020A1 (de) * 2007-07-26 2009-01-29 Qimonda Ag Kontaktvorrichtung zum Kontaktieren von Kontakten, Testanordnung und Verfahren
US20110006799A1 (en) * 2008-02-21 2011-01-13 Tokyo Electron Limited Method for manufacturing probe supporting plate, computer storage medium and probe supporting plate
JP4900843B2 (ja) 2008-12-26 2012-03-21 山一電機株式会社 半導体装置用電気接続装置及びそれに使用されるコンタクト
JP2011043377A (ja) 2009-08-20 2011-03-03 Tokyo Electron Ltd 検査用接触構造体
JP2011226786A (ja) * 2010-04-15 2011-11-10 Tokyo Electron Ltd 接触構造体および接触構造体の製造方法
TWI426275B (zh) * 2011-08-26 2014-02-11 Pegatron Corp 探針裝置
MY167999A (en) 2011-10-07 2018-10-10 Nhk Spring Co Ltd Probe unit
CN102621724B (zh) * 2012-04-17 2014-06-11 友达光电(上海)有限公司 面板测试系统、面板测试笔及其操作方法
JP6033130B2 (ja) * 2013-03-13 2016-11-30 新光電気工業株式会社 プローブガイド板及びその製造方法
JP6475479B2 (ja) * 2014-11-27 2019-02-27 株式会社ヨコオ 検査ユニット
JP6706494B2 (ja) * 2015-12-14 2020-06-10 センサータ テクノロジーズ インコーポレーテッド インターフェース構造
TW201723492A (zh) * 2015-12-31 2017-07-01 旺矽科技股份有限公司 探針結構及探針裝置
KR101919881B1 (ko) * 2017-01-17 2019-02-11 주식회사 이노글로벌 양방향 도전성 패턴 모듈
SG11202000654VA (en) 2017-07-28 2020-02-27 Nhk Spring Co Ltd Contact probe and probe unit
CN113614899B (zh) * 2019-03-13 2023-10-24 日本发条株式会社 接触式探针及信号传送方法
JP7335507B2 (ja) * 2019-12-10 2023-08-30 山一電機株式会社 検査用ソケット

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3340431C2 (de) 1983-11-09 1985-12-19 Feinmetall Gmbh, 7033 Herrenberg Gefederter Kontaktstift für Prüfzwecke
US4931726A (en) * 1987-06-22 1990-06-05 Hitachi, Ltd. Apparatus for testing semiconductor device
JP2539453B2 (ja) * 1987-09-11 1996-10-02 株式会社日立製作所 半導体素子検査装置
US5003255A (en) 1989-06-15 1991-03-26 Nhk Spring Co., Ltd. Electric contact probe
JP2993980B2 (ja) * 1989-12-29 1999-12-27 新光電気工業株式会社 基板用コンタクトプローブ
JPH06201725A (ja) 1992-11-09 1994-07-22 Nhk Spring Co Ltd 導電性接触子及び導電性接触子ユニット
JP2532331B2 (ja) * 1992-11-09 1996-09-11 日本発条株式会社 導電性接触子
JPH07115253A (ja) * 1993-10-18 1995-05-02 Hitachi Chem Co Ltd 金属ベース基板
JPH0823013A (ja) * 1994-07-05 1996-01-23 Aging Tesuta Kaihatsu Kyodo Kumiai ウエハー用プローバ
JP3149316B2 (ja) * 1994-08-01 2001-03-26 アルプス電気株式会社 サーマルヘッドおよびその製造方法
JPH0954116A (ja) * 1995-08-10 1997-02-25 Nippon Denshi Zairyo Kk 高温測定用プローブカード
CN1255686C (zh) * 1996-04-12 2006-05-10 日本发条株式会社 导电接触单元系统
JP3634074B2 (ja) 1996-06-28 2005-03-30 日本発条株式会社 導電性接触子
JPH1038920A (ja) 1996-07-29 1998-02-13 Sankyo Seiki Mfg Co Ltd プローブユニット
JPH10111315A (ja) * 1996-10-04 1998-04-28 Mitsubishi Electric Corp プローブカードおよびこれを用いた試験装置

Also Published As

Publication number Publication date
CN1264470A (zh) 2000-08-23
IL125320A0 (en) 1999-03-12
MY125717A (en) 2006-08-30
IL125320A (en) 2003-04-10
EP0995996B1 (fr) 2005-09-07
WO1999004274A1 (fr) 1999-01-28
EP0995996A1 (fr) 2000-04-26
US6337572B1 (en) 2002-01-08
KR20010021666A (ko) 2001-03-15
DE69831491D1 (de) 2005-10-13
DE69831491T2 (de) 2006-06-29
EP0995996A4 (fr) 2003-07-16
CN1257410C (zh) 2006-05-24

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110713