HK1022050A1 - Die bonding apparatus - Google Patents

Die bonding apparatus

Info

Publication number
HK1022050A1
HK1022050A1 HK00100977A HK00100977A HK1022050A1 HK 1022050 A1 HK1022050 A1 HK 1022050A1 HK 00100977 A HK00100977 A HK 00100977A HK 00100977 A HK00100977 A HK 00100977A HK 1022050 A1 HK1022050 A1 HK 1022050A1
Authority
HK
Hong Kong
Prior art keywords
substrate
chip
temperature sensor
filler metal
brazing filler
Prior art date
Application number
HK00100977A
Other languages
English (en)
Inventor
Masao Yamazaki
Terumitsu Santo
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of HK1022050A1 publication Critical patent/HK1022050A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK00100977A 1998-05-12 2000-02-18 Die bonding apparatus HK1022050A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12917998 1998-05-12
JP11069137A JP2000036501A (ja) 1998-05-12 1999-03-15 ダイボンド装置

Publications (1)

Publication Number Publication Date
HK1022050A1 true HK1022050A1 (en) 2000-07-21

Family

ID=26410319

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00100977A HK1022050A1 (en) 1998-05-12 2000-02-18 Die bonding apparatus

Country Status (5)

Country Link
US (1) US6142356A (ja)
JP (1) JP2000036501A (ja)
CN (1) CN1131554C (ja)
HK (1) HK1022050A1 (ja)
TW (1) TW413872B (ja)

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US6202293B1 (en) * 2000-01-28 2001-03-20 Visteon Global Technologies, Inc. Work holder assembly
US7223617B2 (en) * 2003-07-30 2007-05-29 Matsushita Electric Industrial Co., Ltd. Semiconductor laser device and a method of mounting a semiconductor laser component on a submount
JP4206320B2 (ja) 2003-09-19 2009-01-07 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
JP4130167B2 (ja) * 2003-10-06 2008-08-06 日東電工株式会社 半導体ウエハの剥離方法
US20050127144A1 (en) * 2003-12-10 2005-06-16 Atuhito Mochida Method of mounting a semiconductor laser component on a submount
DE102004009901B4 (de) * 2004-02-26 2005-12-01 Infineon Technologies Ag Vorrichtung zum Singulieren und Bonden von Halbleiterchips und Verfahren zum Singulieren und Bonden
JP2006013073A (ja) * 2004-06-24 2006-01-12 Sharp Corp ボンディング装置、ボンディング方法及び半導体装置の製造方法
KR100546419B1 (ko) * 2004-09-03 2006-01-26 삼성전자주식회사 다이 어태치 장치, 이를 세정하는 세정 시스템 및 그세정방법
JP2006352008A (ja) * 2005-06-20 2006-12-28 Nec Electronics Corp 半導体装置および回路基板
JP4687290B2 (ja) * 2005-07-11 2011-05-25 ソニー株式会社 半導体チップのボンディング装置及びボンディング方法
JP5259116B2 (ja) * 2007-04-17 2013-08-07 キヤノンマシナリー株式会社 ダイボンダ
JP4798170B2 (ja) * 2008-05-13 2011-10-19 株式会社豊田自動織機 半導体装置
US20090289097A1 (en) * 2008-05-21 2009-11-26 Weng-Jin Wu Wafer Leveling-Bonding System Using Disposable Foils
CN101794554A (zh) * 2010-03-31 2010-08-04 华为终端有限公司 类纸显示装置中亮度调节方法及装置、类纸显示系统
US8381965B2 (en) 2010-07-22 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compress bonding
US8104666B1 (en) * 2010-09-01 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compressive bonding with separate die-attach and reflow processes
JP5865639B2 (ja) * 2011-09-15 2016-02-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
US8349116B1 (en) 2011-11-18 2013-01-08 LuxVue Technology Corporation Micro device transfer head heater assembly and method of transferring a micro device
US9773750B2 (en) * 2012-02-09 2017-09-26 Apple Inc. Method of transferring and bonding an array of micro devices
US8967452B2 (en) * 2012-04-17 2015-03-03 Asm Technology Singapore Pte Ltd Thermal compression bonding of semiconductor chips
US9725367B2 (en) * 2013-03-29 2017-08-08 Mitsubishi Materials Corporation Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate
CN103295919B (zh) * 2013-05-31 2015-10-14 三星半导体(中国)研究开发有限公司 单元节距可控的植球装置及植球方法
US9180539B1 (en) * 2014-03-18 2015-11-10 Flextronics Ap, Llc Method of and system for dressing RF shield pads
CN104362121A (zh) * 2014-11-13 2015-02-18 广东威创视讯科技股份有限公司 一种晶体固定装置及晶体固定方法
US10475764B2 (en) 2014-12-26 2019-11-12 Taiwan Semiconductor Manufacturing Company, Ltd. Die bonder and methods of using the same
JP6581389B2 (ja) * 2015-05-12 2019-09-25 東芝メモリ株式会社 半導体装置の製造装置及び製造方法
DE102015120156B4 (de) * 2015-11-20 2019-07-04 Semikron Elektronik Gmbh & Co. Kg Vorrichtung zur materialschlüssigen Verbindung von Verbindungspartnern eines Leistungselekronik-Bauteils und Verwendung einer solchen Vorrichtung
CN111033705B (zh) * 2017-08-22 2023-09-08 株式会社新川 安装装置及温度测定方法
JP6742386B2 (ja) * 2018-11-13 2020-08-19 キヤノンマシナリー株式会社 ボンディング装置、ダイボンダ、及びボンディング方法
JP7207152B2 (ja) * 2019-05-16 2023-01-18 株式会社デンソー スリーブはんだ付け装置および電子装置の製造方法
CN114171432B (zh) * 2021-11-09 2023-10-31 恩纳基智能科技无锡有限公司 一种半导体芯片焊接用加热输送机构
CN114309911B (zh) * 2022-01-07 2023-08-22 武汉中设机器人科技有限公司 一种汽车锁扣热铆自动化生产线专机及工作方法
TWI825937B (zh) * 2022-08-23 2023-12-11 庫力索法高科股份有限公司 複合裝置
CN116190273B (zh) * 2023-03-01 2023-11-21 苏州联讯仪器股份有限公司 一种吸附式芯片搬运装置

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Publication number Priority date Publication date Assignee Title
FR2087327A5 (ja) * 1970-05-14 1971-12-31 Stel
US4257061A (en) * 1977-10-17 1981-03-17 John Fluke Mfg. Co., Inc. Thermally isolated monolithic semiconductor die
US4749329A (en) * 1982-12-06 1988-06-07 Motorola, Inc. Die pick mechanism for automatic assembly of semiconductor devices
US4804810A (en) * 1986-06-19 1989-02-14 Fairchild Semiconductor Corporation Apparatus and method for tape bonding
JPS6320430A (ja) * 1986-07-11 1988-01-28 Kawasaki Steel Corp エロンゲ−タプラグ用耐熱合金
US5634267A (en) * 1991-06-04 1997-06-03 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
JPH0425137A (ja) * 1990-05-19 1992-01-28 Kawasaki Steel Corp ダイボンディング方法
JPH0645377A (ja) * 1992-07-22 1994-02-18 Mitsubishi Electric Corp 半導体製造装置及び半導体パッケージ並びにチップ実装方法

Also Published As

Publication number Publication date
TW413872B (en) 2000-12-01
JP2000036501A (ja) 2000-02-02
CN1235371A (zh) 1999-11-17
US6142356A (en) 2000-11-07
CN1131554C (zh) 2003-12-17

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090512