HK1008760A1 - Tray for integrated circuits - Google Patents

Tray for integrated circuits Download PDF

Info

Publication number
HK1008760A1
HK1008760A1 HK98109253A HK98109253A HK1008760A1 HK 1008760 A1 HK1008760 A1 HK 1008760A1 HK 98109253 A HK98109253 A HK 98109253A HK 98109253 A HK98109253 A HK 98109253A HK 1008760 A1 HK1008760 A1 HK 1008760A1
Authority
HK
Hong Kong
Prior art keywords
tray
parts
styrene
weight
range
Prior art date
Application number
HK98109253A
Other languages
German (de)
English (en)
French (fr)
Chinese (zh)
Other versions
HK1008760B (en
Inventor
Ueki Toru
Yoshimura Masaji
Kanezaki Kazuharu
Iwata Ineo
Takiguchi Minoru
Original Assignee
Mitsui Chemicals, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17612649&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1008760(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsui Chemicals, Inc. filed Critical Mitsui Chemicals, Inc.
Publication of HK1008760B publication Critical patent/HK1008760B/en
Publication of HK1008760A1 publication Critical patent/HK1008760A1/en

Links

Classifications

    • H10P72/50—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/10—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK98109253A 1991-10-25 1992-10-26 Tray for integrated circuits HK1008760A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP279558/91 1991-10-25
JP27955891 1991-10-25
PCT/JP1992/001385 WO1993008595A1 (en) 1991-10-25 1992-10-26 Tray for integrated circuits

Publications (2)

Publication Number Publication Date
HK1008760B HK1008760B (en) 1999-05-14
HK1008760A1 true HK1008760A1 (en) 1999-05-14

Family

ID=17612649

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98109253A HK1008760A1 (en) 1991-10-25 1992-10-26 Tray for integrated circuits

Country Status (8)

Country Link
EP (1) EP0564660B1 (enExample)
JP (1) JP3353789B2 (enExample)
KR (1) KR0121749B1 (enExample)
DE (1) DE69224282D1 (enExample)
HK (1) HK1008760A1 (enExample)
SG (1) SG47795A1 (enExample)
TW (1) TW276264B (enExample)
WO (1) WO1993008595A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4403677A1 (de) * 1994-02-07 1995-08-10 Basf Ag Formmasse auf der Basis von Polyarylenetherblends und Kohlefasern
DE59502175D1 (de) * 1994-03-31 1998-06-18 Marquardt Gmbh Werkstück aus kunststoff und herstellungsverfahren für ein derartiges werkstück
JPH07278318A (ja) * 1994-04-08 1995-10-24 Asahi Chem Ind Co Ltd 難燃性ｃｄ−ｒｏｍ帰属部品
US6610773B1 (en) * 1998-12-09 2003-08-26 General Electric Company Conductive, low warp polyetherimide resin compositions
US6518218B1 (en) * 1999-03-31 2003-02-11 General Electric Company Catalyst system for producing carbon fibrils
US6689613B1 (en) 1999-03-31 2004-02-10 General Electric Company Method for preparing and screening catalysts
KR100381972B1 (ko) * 2000-10-02 2003-05-01 한국지이플라스틱스 유한회사 반도체 칩 트레이용 폴리페닐렌옥사이드 또는폴리페닐렌에테르계 복합 수지 조성물
KR100855367B1 (ko) * 2007-04-05 2008-09-04 (주)성호폴리텍 Ｉｃ 트레이용 개질 폴리페닐렌에테르와 그의 제조 방법,및 이를 기본재질로서 포함하는 ｉｃ 트레이
EP2805990B1 (en) 2012-01-17 2019-02-20 National Institute of Advanced Industrial Science And Technology Carbon fiber-reinforced plastic material with nanofiller mixed therein
EP3847876B1 (en) 2018-09-04 2026-01-14 Jabil, Inc. Apparatus, system, and method of providing a tray for holding an optoelectronic device during printed circuit board manufacturing
CN112646352B (zh) * 2020-12-28 2022-06-14 金发科技股份有限公司 一种高性能导电聚苯醚/聚苯乙烯合金材料及其制备方法和应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577922A (en) * 1980-06-18 1982-01-16 Mitsubishi Electric Corp Sheet cover for semiconductor wafer
US4404125A (en) * 1981-10-14 1983-09-13 General Electric Company Polyphenylene ether resin compositions for EMI electromagnetic interference shielding
JPS61174262A (ja) * 1985-01-30 1986-08-05 Toho Rayon Co Ltd 樹脂組成物
JPH0735181B2 (ja) * 1985-05-01 1995-04-19 信越ポリマー株式会社 耐熱性の電子部品収納トレー
JPH0646636B2 (ja) * 1988-08-12 1994-06-15 株式会社山本包装商事 Ｉｃチップ用トレイの製造方法
US5019616A (en) * 1989-05-16 1991-05-28 General Electric Company Composition comprising a polyphenylene-ether-containing polymeric component and reinforcing fibers
JPH03290463A (ja) * 1990-04-09 1991-12-20 Mitsui Toatsu Chem Inc 導電性樹脂組成物

Also Published As

Publication number Publication date
WO1993008595A1 (en) 1993-04-29
EP0564660A1 (en) 1993-10-13
SG47795A1 (en) 1998-04-17
KR0121749B1 (ko) 1997-11-11
JP3353789B2 (ja) 2002-12-03
TW276264B (enExample) 1996-05-21
KR930703697A (ko) 1993-11-30
JPH05221472A (ja) 1993-08-31
EP0564660A4 (enExample) 1994-04-06
EP0564660B1 (en) 1998-01-28
DE69224282D1 (de) 1998-03-05

Similar Documents

Publication Publication Date Title
US5334636A (en) Thermoplastic composition
US6221283B1 (en) Conductive compositions with compositionally controlled bulk resistivity
EP0564660B1 (en) Tray for integrated circuits
KR100258498B1 (ko) 액정 폴리에스테르 수지 조성물 및 성형품
HK1008760B (en) Tray for integrated circuits
EP1190421B1 (en) Conductive compositions with compositionally controlled bulk resistivity
US5075035A (en) Molding material for electroconductive ic parts
US5173524A (en) Conductive polysulfone resine composition and high-heat-resistant, conductive semi-conductor article molded from same
US5149465A (en) Conductive resin composition
US5223563A (en) Antistatic ppe compositions and methods
KR920009804B1 (ko) 도전성 ic 부재용 성형재료
KR100537923B1 (ko) 용융 흐름성이 우수하고 내열성 및 저온충격강도가 우수한폴리프로필렌 수지 조성물
EP0562179A1 (en) Electroconductive resin composition
JPH04211916A (ja) 金属をインサートした成形品
JP3105284B2 (ja) 導電性樹脂組成物
JPH11335549A (ja) 導電性樹脂組成物、半導体包装容器、及び、ｉｃトレー
JP3140142B2 (ja) スライドキャリアー
JPH11349756A (ja) 樹脂組成物
JPH08188710A (ja) 押出性良好導電性樹脂組成物
JPS61278556A (ja) 耐油性、耐熱性及び寸法精度の改良された熱可塑性樹脂組成物
JP3004768B2 (ja) Ｉｃ耐熱トレー成形体用樹脂組成物
JP3348801B2 (ja) 耐熱導電性樹脂組成物
JPH08239568A (ja) 衝撃強度の改良された導電性樹脂組成物
JPH1180534A (ja) 耐熱導電性樹脂組成物
JPH04370145A (ja) 導電性を有する芳香族ポリエーテルケトン樹脂組成物およびその成形体

Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20081026