HK1006606A1 - Spring clamp assembly with electrically insulating shoe - Google Patents

Spring clamp assembly with electrically insulating shoe

Info

Publication number
HK1006606A1
HK1006606A1 HK98105824A HK98105824A HK1006606A1 HK 1006606 A1 HK1006606 A1 HK 1006606A1 HK 98105824 A HK98105824 A HK 98105824A HK 98105824 A HK98105824 A HK 98105824A HK 1006606 A1 HK1006606 A1 HK 1006606A1
Authority
HK
Hong Kong
Prior art keywords
electrically insulating
clamp assembly
spring clamp
insulating shoe
shoe
Prior art date
Application number
HK98105824A
Other languages
English (en)
Inventor
Donald L Clemens
Keith Mandell
Original Assignee
Thermalloy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermalloy Inc filed Critical Thermalloy Inc
Publication of HK1006606A1 publication Critical patent/HK1006606A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK98105824A 1993-11-15 1998-06-20 Spring clamp assembly with electrically insulating shoe HK1006606A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15196693A 1993-11-15 1993-11-15
US08/223,011 US5371652A (en) 1993-11-15 1994-04-05 Spring clamp assembly with electrically insulating shoe

Publications (1)

Publication Number Publication Date
HK1006606A1 true HK1006606A1 (en) 1999-03-05

Family

ID=26849129

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98105824A HK1006606A1 (en) 1993-11-15 1998-06-20 Spring clamp assembly with electrically insulating shoe

Country Status (7)

Country Link
US (1) US5371652A (ko)
JP (1) JPH07183679A (ko)
KR (1) KR950016477A (ko)
CN (1) CN1106898A (ko)
DE (1) DE4436491A1 (ko)
GB (1) GB2283781B (ko)
HK (1) HK1006606A1 (ko)

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US5594624A (en) * 1994-04-05 1997-01-14 Thermalloy, Inc. Strap spring for heat sink clip assembly
US5621244A (en) * 1994-05-16 1997-04-15 Lin; Shih-Jen Fin assembly for an integrated circuit
US5475564A (en) * 1994-12-20 1995-12-12 Chiou; Ming D. CPU heat sink holding-down device
US5600540A (en) * 1995-05-15 1997-02-04 Blomquist; Michael L. Heat sink and retainer for electronic integrated circuits
US5640305A (en) * 1995-06-07 1997-06-17 Thermalloy, Inc. Anchor for securing a heat sink to a printed circuit board
US5850691A (en) * 1995-07-20 1998-12-22 Dell Usa, L. P. Method for securing an electronic component to a pin grid array socket
US5617292A (en) * 1995-09-14 1997-04-01 International Electronic Research Corporation Two piece clip for heat dissipating assemblies
US5668348A (en) * 1995-10-02 1997-09-16 Lin; Chun-Sheng CPU dissipator mounting apparatus
US5602719A (en) * 1995-11-13 1997-02-11 Intel Corporation No handle zip socket
KR0181092B1 (ko) * 1996-04-30 1999-05-15 배순훈 전자 회로부품의 방열 장치
US5761041A (en) * 1996-06-25 1998-06-02 Sun Microsystems, Inc. Mechanical heat sink attachment
US5734556A (en) * 1996-06-26 1998-03-31 Sun Microsystems, Inc. Mechanical heat sink attachment having two pin headers and a spring clip
US5801452A (en) * 1996-10-25 1998-09-01 Micron Technology, Inc. Multi chip module including semiconductor wafer or dice, interconnect substrate, and alignment member
US6079486A (en) * 1997-02-27 2000-06-27 Aavid Thermal Technologies, Inc. Spring clip for attaching an electronic component to a heat sink and an assembly utilizing the same
US6401807B1 (en) 1997-04-03 2002-06-11 Silent Systems, Inc. Folded fin heat sink and fan attachment
US6061239A (en) 1997-05-16 2000-05-09 Psc Computer Products Cam-type retainer clip for heat sinks for electronic integrated circuits
US5917700A (en) * 1997-09-16 1999-06-29 Lucent Technologies Inc Heat sink and attachment process for electronic components
US5909358A (en) * 1997-11-26 1999-06-01 Todd Engineering Sales, Inc. Snap-lock heat sink clip
US5969947A (en) 1997-12-17 1999-10-19 International Business Machines Corporation Integral design features for heatsink attach for electronic packages
US6219238B1 (en) * 1999-05-10 2001-04-17 International Business Machines Corporation Structure for removably attaching a heat sink to surface mount packages
US6222734B1 (en) * 1999-11-29 2001-04-24 Intel Corporation Clamping heat sinks to circuit boards over processors
EP1128432B1 (de) * 2000-02-24 2016-04-06 Infineon Technologies AG Befestigung von Halbleitermodulen an einem Kühlkörper
TW516799U (en) * 2000-06-17 2003-01-01 Foxconn Prec Components Co Ltd Snap device of heat sink
US6496371B2 (en) 2001-03-30 2002-12-17 Intel Corporation Heat sink mounting method and apparatus
US20030064262A1 (en) * 2001-05-31 2003-04-03 Plug Power Inc. Method and apparatus for controlling a combined heat and power fuel cell system
US7026065B2 (en) * 2001-08-31 2006-04-11 Plug Power Inc. Fuel cell system heat recovery
US20030044662A1 (en) * 2001-08-31 2003-03-06 Plug Power Inc. Method and apparatus for thermal management in a fuel cell system
TW532516U (en) * 2002-04-18 2003-05-11 Hon Hai Prec Ind Co Ltd Fastener for heat sink
TW537437U (en) * 2002-06-28 2003-06-11 Shuttle Inc CPU heat dissipating fastener
TW590243U (en) * 2002-06-28 2004-06-01 Hon Hai Prec Components Co Ltd Lateral slide resisting structure for heat sink
TW537438U (en) * 2002-06-28 2003-06-11 Shuttle Inc CPU heat dissipating device
US6788538B1 (en) * 2003-03-17 2004-09-07 Unisys Corporation Retention of heat sinks on electronic packages
TW200525338A (en) * 2004-01-29 2005-08-01 Asustek Comp Inc Fan fasten device and electrical apparatus thereof
JP4857635B2 (ja) * 2005-07-25 2012-01-18 豊田合成株式会社 Ｌｅｄランプユニット
JP2007177841A (ja) * 2005-12-27 2007-07-12 Kokusan Denki Co Ltd コントロールユニット
US8063485B1 (en) 2008-06-27 2011-11-22 Advanced Thermal Solutions, Inc. Electronics package with integrated lugs for cooling attachment
CN101861080A (zh) * 2009-04-10 2010-10-13 富准精密工业(深圳)有限公司 散热装置
US8139361B2 (en) * 2009-12-16 2012-03-20 International Business Machines Corporation Apparatus and method for attaching selected components to a printed circuit board
JP5127886B2 (ja) * 2010-06-25 2013-01-23 三菱電機株式会社 発熱部品と放熱部品の組付用金具およびこの組付用金具を用いたヒートシンク組立体
US8611090B2 (en) 2010-09-09 2013-12-17 International Business Machines Corporation Electronic module with laterally-conducting heat distributor layer
US8766426B2 (en) * 2010-09-24 2014-07-01 Stats Chippac Ltd. Integrated circuit packaging system with warpage control and method of manufacture thereof
US9401317B2 (en) 2011-01-26 2016-07-26 Aavid Thermalloy, Llc Heat sink mount and assembly
US8779585B2 (en) 2011-08-05 2014-07-15 International Business Machines Corporation Implementing enhanced thermal conductivity in stacked modules
CN103988591B (zh) 2011-11-21 2016-08-24 汤姆逊许可公司 用于固定散热器的压板
US10624245B2 (en) * 2016-06-23 2020-04-14 Laird Technologies, Inc. Laser weldable brackets for attachment of heat sinks to board level shields
US10684086B2 (en) * 2017-07-19 2020-06-16 Craig D. Churchill Spent casing catch and release trap mechanism with clip
JP6673889B2 (ja) * 2017-10-31 2020-03-25 ファナック株式会社 電子装置
CN110838632B (zh) * 2018-08-17 2021-05-25 富士康(昆山)电脑接插件有限公司 电连接器组件及其限位件
CN113826209B (zh) * 2020-02-27 2024-09-13 京东方科技集团股份有限公司 显示面板及其制造方法和显示装置
CN113118720A (zh) * 2021-03-16 2021-07-16 江阴沐祥节能装饰工程有限公司 高倍散热器型材的模具制备工艺及加工出的型材

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Publication number Priority date Publication date Assignee Title
GB1221308A (en) * 1967-11-10 1971-02-03 Mcmurdo Instr Company Ltd Improvements in or relating to fasteners
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
US5282111A (en) * 1989-06-09 1994-01-25 Labinal Components And Systems, Inc. Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate
US5068764A (en) * 1990-03-05 1991-11-26 Thermalloy Incorporated Electronic device package mounting assembly
JPH0625688Y2 (ja) * 1990-04-23 1994-07-06 旭光学工業株式会社 複数の板材の挟持構造
US5099550A (en) * 1990-11-05 1992-03-31 Mi Proprietary Clamp for attachment of a heat sink
DE9113009U1 (de) * 1991-10-19 1993-02-18 Robert Bosch Gmbh, 7000 Stuttgart Baugruppe für elektronische Steuergeräte
US5208731A (en) * 1992-01-17 1993-05-04 International Electronic Research Corporation Heat dissipating assembly
US5307239A (en) * 1992-10-08 1994-04-26 Unisys Corporation Electromechanical module with small footprint and post-solder attachable/removable heat sink frame
US5276585A (en) * 1992-11-16 1994-01-04 Thermalloy, Inc. Heat sink mounting apparatus
US5313099A (en) * 1993-03-04 1994-05-17 Square Head, Inc. Heat sink assembly for solid state devices

Also Published As

Publication number Publication date
CN1106898A (zh) 1995-08-16
GB9417579D0 (en) 1994-10-19
US5371652A (en) 1994-12-06
KR950016477A (ko) 1995-06-17
JPH07183679A (ja) 1995-07-21
DE4436491A1 (de) 1995-05-18
GB2283781A (en) 1995-05-17
GB2283781B (en) 1997-01-15

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20040831