HK1000517A1 - Polyamide resin composition and molded articles obtained therefrom - Google Patents

Polyamide resin composition and molded articles obtained therefrom

Info

Publication number
HK1000517A1
HK1000517A1 HK97102142A HK97102142A HK1000517A1 HK 1000517 A1 HK1000517 A1 HK 1000517A1 HK 97102142 A HK97102142 A HK 97102142A HK 97102142 A HK97102142 A HK 97102142A HK 1000517 A1 HK1000517 A1 HK 1000517A1
Authority
HK
Hong Kong
Prior art keywords
resin composition
polyamide resin
molded articles
obtained therefrom
articles obtained
Prior art date
Application number
HK97102142A
Other languages
English (en)
Inventor
Ebara Kenji
Nishino Hiroshi
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of HK1000517A1 publication Critical patent/HK1000517A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
HK97102142A 1992-06-25 1997-11-07 Polyamide resin composition and molded articles obtained therefrom HK1000517A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16760092 1992-06-25

Publications (1)

Publication Number Publication Date
HK1000517A1 true HK1000517A1 (en) 1998-04-03

Family

ID=15852779

Family Applications (1)

Application Number Title Priority Date Filing Date
HK97102142A HK1000517A1 (en) 1992-06-25 1997-11-07 Polyamide resin composition and molded articles obtained therefrom

Country Status (6)

Country Link
US (1) US5371132A (fr)
CA (1) CA2099066C (fr)
DE (1) DE4321247C3 (fr)
FR (1) FR2692902B1 (fr)
GB (1) GB2268182B (fr)
HK (1) HK1000517A1 (fr)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0691996A4 (fr) * 1993-03-29 1997-06-18 Du Pont Composition de resine polyamide
FR2716885B1 (fr) * 1994-03-01 1996-04-12 Solvay Matériau thermoplastique composite et procédé de fabrication d'articles à base de celui-ci.
US5948492A (en) * 1997-01-09 1999-09-07 Graham Packaging Company, L.P. Cost-effective environmentally-friendly blow-molded plastic container
DE19719150A1 (de) * 1997-05-06 1998-11-19 Rueb F A Holding Gmbh Elektrostatisch beschichteter Polyamidwerkstoff
DE19731229A1 (de) * 1997-07-21 1999-01-28 Basf Ag Polyamidformmasse
DE19731230A1 (de) 1997-07-21 1999-01-28 Basf Ag Statistische Copolyamide enthaltende Formmassen, Verfahren zu ihrer Herstellung und ihre Verwendung
DE19925221B4 (de) 1998-06-02 2017-05-18 Asahi Kasei Kabushiki Kaisha Schwarz gefärbte verstärkte Polyamidharz-Zusammensetzung
EP1522461A3 (fr) * 1998-06-11 2005-07-20 Asahi Kasei Kabushiki Kaisha Rail de toit et son procédé de fabrication
US6291633B1 (en) * 1999-01-08 2001-09-18 Ube Industries, Inc. Polyamide resin compositions with excellent weld strength
DE19905503A1 (de) 1999-02-10 2000-08-17 Basf Ag Thermoplastische Nanocomposites
ES2215058T3 (es) * 1999-08-02 2004-10-01 E.I. Du Pont De Nemours And Company Composiciones de poliamida aromatica para moldeo.
JP4003035B2 (ja) * 2000-07-05 2007-11-07 日本精工株式会社 転がり軸受
ATE367420T1 (de) 2005-11-18 2007-08-15 Ems Chemie Ag Verstärkte polyamidformmassen
DE502005001079D1 (de) * 2005-11-18 2007-08-30 Ems Chemie Ag Verstärkte Polyamidformmassen
EP1972659B1 (fr) * 2006-01-13 2016-02-24 Mitsubishi Engineering-Plastics Corporation Composition de resine polyamide destinee a un appareil electronique portable et article moule destine a un appareil electronique portable
CN101432362B (zh) * 2006-04-27 2011-04-06 旭化成化学株式会社 树脂组合物及由该树脂组合物制造的汽车发动机罩内部件
US20070276081A1 (en) * 2006-05-23 2007-11-29 Shengmei Yuan High modulus thermoplastic compositions
US8562894B2 (en) * 2007-09-10 2013-10-22 Sabic Innovative Plastics Ip B.V. Synthetic resin process and article useful for plating applications
US8257613B2 (en) * 2008-04-09 2012-09-04 Sabic Innovative Plastics Ip B.V. Filled compositions and a method of making
US20090105412A1 (en) * 2008-09-12 2009-04-23 Martens Marvin M Polyamides for vehicular parts
CN106239818A (zh) 2009-03-04 2016-12-21 帝斯曼知识产权资产管理有限公司 用于制备具有减少的玻璃纤维显现的注射模制部件的方法
WO2011155596A1 (fr) * 2010-06-11 2011-12-15 旭化成ケミカルズ株式会社 Polyamide et composition de polyamide
GB201017926D0 (en) * 2010-09-15 2010-12-01 Toit Pieter W Du Moulding of fibre reinforced thermoplastic materials
US9520604B2 (en) 2013-03-15 2016-12-13 GM Global Technology Operations LLC Slip stream for reliable anode to cathode flow in freeze conditions
US20140306359A1 (en) * 2013-04-15 2014-10-16 GM Global Technology Operations LLC Simplified Fuel Cell Humidifier Design
US20150183991A1 (en) * 2013-11-20 2015-07-02 Asahi Kasei Chemicals Corporation Flame-retardant thermoplastic resin composition and molded article of the same
WO2020170959A1 (fr) * 2019-02-22 2020-08-27 東洋紡株式会社 Procédé de production d'une composition de résine de polyamide renforcée par des fibres de verre
WO2021149674A1 (fr) * 2020-01-24 2021-07-29 東洋紡株式会社 Procédé de fabrication d'une composition de résine de polyamide

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2887462A (en) * 1955-01-26 1959-05-19 Du Pont Polyester or polyamide-manganous salt composition and process of preparing same
NL274646A (fr) * 1961-02-09
NL137598C (fr) * 1961-03-31
NL127623C (fr) * 1965-05-24
DE2647310A1 (de) * 1976-10-20 1978-04-27 Bayer Ag Verstaerktes polyhexamethylenisophthalamid
JPS5562959A (en) * 1978-11-06 1980-05-12 Toray Ind Inc Reinforced polyamide resin composition
EP0019768B1 (fr) * 1979-06-02 1983-05-11 BASF Aktiengesellschaft Compositions à mouler ignifugées chargées à base de polyamides
GB2092600A (en) * 1981-02-11 1982-08-18 Du Pont Mineral reinforced polyamides
US4603166A (en) * 1983-02-16 1986-07-29 Amoco Corporation Crystalline polyamide composition from dicarboxylic acid mixture and diamine
JPS601256A (ja) * 1983-06-19 1985-01-07 Nippon Steel Chem Co Ltd ポリアミド樹脂組成物
JPS60158220A (ja) * 1984-01-27 1985-08-19 Mitsui Petrochem Ind Ltd 摺動材用成形材料
JPS6160861A (ja) * 1984-08-31 1986-03-28 Toyota Motor Corp 鋼製ピストンリング用材料
DE3506656A1 (de) * 1985-02-26 1986-08-28 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von copolyamiden aus aromatischen dicarbonsaeuren, adipinsaeure und hexamethylendiamin
US4985102A (en) * 1986-07-17 1991-01-15 Du Pont Canada Inc. Method of making fiber reinforced polyamide sheets
JPS63118367A (ja) * 1986-11-07 1988-05-23 Ube Ind Ltd ポリアミド樹脂組成物
DE3705228A1 (de) * 1987-02-19 1988-09-01 Bayer Ag Polyamidmischungen und formkoerper daraus
JPH0676546B2 (ja) * 1987-04-08 1994-09-28 三菱化成株式会社 ポリアミドフィルム
DE3717218A1 (de) * 1987-05-22 1989-03-23 Bayer Ag Glasfaserverstaerkte stabilisierte polyamidformmasse
DE3813354A1 (de) * 1988-04-21 1989-11-02 Huels Chemische Werke Ag Thermoplastische formmassen auf basis von funktionalisierten polyphenylenethern und polyamiden
JP2690775B2 (ja) * 1989-04-06 1997-12-17 昭和電工株式会社 ポリアミド樹脂組成物
JPH03269056A (ja) * 1990-03-20 1991-11-29 Mitsubishi Kasei Corp ポリアミド樹脂組成物
JPH0453871A (ja) * 1990-06-20 1992-02-21 Toray Ind Inc 自動車用アンダーフード部品
JPH0768344B2 (ja) * 1990-10-11 1995-07-26 東レ株式会社 吹込成形品
GB9114767D0 (en) * 1991-07-09 1991-08-28 Du Pont Canada Food containers of nylon 6,6/6t
JPH0562959A (ja) * 1991-08-30 1993-03-12 Mitsui Toatsu Chem Inc 洗浄槽

Also Published As

Publication number Publication date
DE4321247A1 (de) 1994-01-05
CA2099066A1 (fr) 1993-12-26
DE4321247C2 (de) 1996-05-09
GB2268182A (en) 1994-01-05
DE4321247C3 (de) 2001-07-05
GB2268182B (en) 1996-01-31
FR2692902A1 (fr) 1993-12-31
US5371132A (en) 1994-12-06
GB9312399D0 (en) 1993-07-28
FR2692902B1 (fr) 1994-12-16
CA2099066C (fr) 1999-09-21

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20040616